摘要:
The present invention provides an apparatus for suppressing interference in a coordinated multi-point CoMP transmission system, comprising: frame configuration conflicting detection unit configured to detect conflicting frame configurations; frame configuration conflicting notification unit configured to give a notification of conflicting frame configurations; and interference suppression unit configured to suppress interference between a first CoMP cluster and a second CoMP cluster that are adjacent in the CoMP transmission system when detecting conflicting frame configurations. The present invention further provides a method of suppressing interference in a coordinated multi-point CoMP transmission system. The present invention provides a novel solution that may suppress inter-cell UL/DL ICI by adopting coordinated beamforming (CBF) and coordinated scheduling (CS) in a TDD CoMP system, while maintaining sound implementation of CoMP and flexibility of frame configuration in the TDD system.
摘要:
The present invention provides an apparatus for suppressing interference in a coordinated multi-point CoMP transmission system, comprising: frame configuration conflicting detection unit configured to detect conflicting frame configurations; frame configuration conflicting notification unit configured to give a notification of conflicting frame configurations; and interference suppression unit configured to suppress interference between a first CoMP cluster and a second CoMP cluster that are adjacent in the CoMP transmission system when detecting conflicting frame configurations. The present invention further provides a method of suppressing interference in a coordinated multi-point CoMP transmission system. The present invention provides a novel solution that may suppress inter-cell UL/DL ICI by adopting coordinated beamforming (CBF) and coordinated scheduling (CS) in a TDD CoMP system, while maintaining sound implementation of CoMP and flexibility of frame configuration in the TDD system.
摘要:
A method for examining a sample with a scanning charged particle beam imaging apparatus. First, an image area and a scan area are specified on a surface of the sample. Herein, the image area is entirely overlapped within the scan area. Next, the scan area is scanned by using a charged particle beam along a direction neither parallel nor perpendicular to an orientation of the scan area. It is possible that only a portion of the scan area overlapped with the image area is exposed to the charged particle beam. It also is possible that both the shape and the size of the image area are essentially similar with that of the scan area, such that the size of the area projected by the charged particle beam is almost equal to the size of the image area.
摘要:
A method for enhancing the quality of a charged particle microscopic image of a sample is disclosed. The image is formed by a charged particle beam imaging system. The method comprising: scanning, using a first scanning beam, a surface of the sample in at least one first scan line; and scanning, using a second scanning beam, the sample surface in at least one second scan line, wherein said second scanning beam is scanned across said sample surface during a time interval between the end of said first scan lines and the beginning of the next said first scan lines. Application of the proposed method as a charged particle beam imaging system is also disclosed.
摘要:
A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method.
摘要:
A method for filtering noises in an image scanned by charged particles includes steps of grouping pixels with similar types in the image into a plurality of pixel groups; and removing noises for each pixel group in the image according to a corresponding noise model to obtain the scanned image with better quality and/or contrast. A system for filtering noises in an image scanned by charged particles is also disclosed.
摘要:
A method of inspecting for overlay shift defects during semiconductor manufacturing is disclosed. The method can include the steps of providing a charged particle microscopic image of a sample, identifying an inspection pattern period in the charged particle microscopic image, averaging the charged particle microscopic image by using the inspection pattern period to form an averaged inspection pattern period, estimating an average width from the averaged inspection pattern period, and comparing the average width with a predefined threshold value to determine the presence of an overlay shift defect.
摘要:
The present invention provides a connector interface comprising a connector socket interface and a connector plug interface, the connector socket interface comprising metal shell, insulator, band-shaped recess provided on said insulator and metal contacts and the connector plug interface comprising metal shell, insulator, and band-shaped protrusion provided on said insulator and metal contacts, said connector socket interface and said connector plug interface being able to be coupled together, wherein: said connector socket interface has a plurality of band-shaped recesses and said connector plug interface has a plurality of band-shaped protrusions. In a connector interface with the same number of metal pieces according to an embodiment of the present invention, the footprint of the coupling part is reduced, the footprint per pair of contacts is reduced, and the objective of increasing the pin density of the contacts in a connector is achieved.
摘要:
The present invention provides a connector interface comprising a connector socket interface and a connector plug interface, the connector socket interface comprising metal shell, insulator, band-shaped recess provided on said insulator and metal contacts and the connector plug interface comprising metal shell, insulator, and band-shaped protrusion provided on said insulator and metal contacts, said connector socket interface and said connector plug interface being able to be coupled together, wherein: said connector socket interface has a plurality of band-shaped recesses and said connector plug interface has a plurality of band-shaped protrusions. In a connector interface with the same number of metal pieces according to an embodiment of the present invention, the footprint of the coupling part is reduced, the footprint per pair of contacts is reduced, and the objective of increasing the pin density of the contacts in a connector is achieved.