公开(公告)号：US07170103B2

公开(公告)日：2007-01-30

申请号：US11210357

申请日：2005-08-24

申请人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

发明人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

IPC分类号： H01L29/88 ,  H01L29/861

CPC分类号： H01L21/02667 ,  H01L21/02532 ,  H01L21/2022 ,  H01L27/0814 ,  H01L27/101 ,  H01L27/1021 ,  H01L27/24 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/861 ,  H01L45/04 ,  H01L45/145 ,  Y10S257/903 ,  Y10S257/91 ,  Y10S438/979

摘要： A method of making a vertical diode is provided, the vertical diode having associated therewith a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The diode opening is initially filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that is heavily doped with a first type dopant and a bottom portion that is lightly doped with a second type dopant. The top portion is bounded by the bottom portion so as not to contact the titanium silicide layer. For one embodiment of the vertical diode, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

摘要翻译： 提供了一种制造垂直二极管的方法，该垂直二极管具有与其相连的二极管开口，其延伸穿过绝缘层并接触硅晶片上的有源区。 硅化钛层覆盖二极管开口的内表面并接触有源区。 二极管开口最初填充有非晶硅插塞，其在沉积期间被掺杂，随后再结晶以形成大晶粒多晶硅。 硅插头具有重掺杂有第一类型掺杂剂的顶部部分和轻掺杂有第二类型掺杂剂的底部部分。 顶部由底部界定，以便不与硅化钛层接触。 对于垂直二极管的一个实施例，可编程电阻器接触硅插头的顶部并且金属线接触可编程电阻器。

公开(公告)号：US06784046B2

公开(公告)日：2004-08-31

申请号：US10104240

申请日：2002-03-22

申请人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

发明人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

IPC分类号： H01L218234

CPC分类号： H01L21/02667 ,  H01L21/02532 ,  H01L21/2022 ,  H01L27/0814 ,  H01L27/101 ,  H01L27/1021 ,  H01L27/24 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/861 ,  H01L45/04 ,  H01L45/145 ,  Y10S257/903 ,  Y10S257/91 ,  Y10S438/979

摘要： A method of making a vertical diode is provided, the vertical dioxide having associated therewith a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The diode opening is initially filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that is heavily doped with a first type dopant and a bottom portion that is lightly doped with a second type dopant. The top portion is bounded by the bottom portion so as not to contact the titanium silicide layer. For one embodiment of the vertical diode, a programable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

摘要翻译： 提供了一种制造垂直二极管的方法，所述垂直二氧化物具有与其相连的二极管开口，其延伸穿过绝缘层并接触硅晶片上的有源区。 硅化钛层覆盖二极管开口的内表面并接触有源区。 二极管开口最初填充有非晶硅插塞，其在沉积期间被掺杂，随后再结晶以形成大晶粒多晶硅。 硅插头具有重掺杂有第一类型掺杂剂的顶部部分和轻掺杂有第二类型掺杂剂的底部部分。 顶部由底部界定，以便不与硅化钛层接触。 对于垂直二极管的一个实施例，可编程电阻器接触硅插头的顶部并且金属线接触可编程电阻器。

公开(公告)号：US5854102A

公开(公告)日：1998-12-29

申请号：US932791

申请日：1997-09-05

申请人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

发明人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

IPC分类号： H01L21/329 ,  H01L27/08 ,  H01L29/861 ,  H01L21/8234

CPC分类号： H01L29/66136 ,  H01L27/0814 ,  H01L29/861 ,  Y10S257/91 ,  Y10S438/979

摘要： A vertical diode is provided having a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The diode opening is initially filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that is heavily doped with a first type dopant and a bottom portion that is lightly doped with a second type dopant. The top portion is bounded by the bottom portion so as not to contact the titanium silicide layer. For one embodiment of the vertical diode, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

摘要翻译： 提供了具有延伸穿过绝缘层并与硅晶片上的有源区接触的二极管开口的垂直二极管。 硅化钛层覆盖二极管开口的内表面并接触有源区。 二极管开口最初填充有非晶硅插塞，其在沉积期间被掺杂，随后再结晶以形成大晶粒多晶硅。 硅插头具有重掺杂有第一类型掺杂剂的顶部部分和轻掺杂有第二类型掺杂剂的底部部分。 顶部由底部界定，以便不与硅化钛层接触。 对于垂直二极管的一个实施例，可编程电阻器接触硅插头的顶部并且金属线接触可编程电阻器。

公开(公告)号：US07563666B2

公开(公告)日：2009-07-21

申请号：US11869012

申请日：2007-10-09

申请人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

发明人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

IPC分类号： H01L21/8234

CPC分类号： H01L21/02667 ,  H01L21/02532 ,  H01L21/2022 ,  H01L27/0814 ,  H01L27/101 ,  H01L27/1021 ,  H01L27/24 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/861 ,  H01L45/04 ,  H01L45/145 ,  Y10S257/903 ,  Y10S257/91 ,  Y10S438/979

摘要： Semiconductor structures and methods of making a vertical diode structure are provided. The vertical diode structure may have associated therewith a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer may be formed over the interior surface of the diode opening and contacting the active region. The diode opening may initially be filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that may be heavily doped with a first type dopant and a bottom portion that may be lightly doped with a second type dopant. The top portion may be bounded by the bottom portion so as not to contact the titanium silicide layer. In one embodiment of the vertical diode structure, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

摘要翻译： 提供了制造垂直二极管结构的半导体结构和方法。 垂直二极管结构可以具有延伸穿过绝缘层并接触硅晶片上的有源区的二极管开口。 硅化钛层可以形成在二极管开口的内表面上并与活性区接触。 二极管开口最初可以填充非晶硅插塞，其在沉积期间被掺杂并随后重结晶以形成大晶粒多晶硅。 硅插头具有可以重掺杂第一类型掺杂剂的顶部部分和可以轻掺杂第二类型掺杂剂的底部部分。 顶部可以由底部限定，以便不与硅化钛层接触。 在垂直二极管结构的一个实施例中，可编程电阻器接触硅插头的顶部并且金属线接触可编程电阻器。

公开(公告)号：US07166875B2

公开(公告)日：2007-01-23

申请号：US10804477

申请日：2004-03-19

申请人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

发明人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

IPC分类号： H01L29/24 ,  H01L29/861 ,  H01L29/88

CPC分类号： H01L21/02667 ,  H01L21/02532 ,  H01L21/2022 ,  H01L27/0814 ,  H01L27/101 ,  H01L27/1021 ,  H01L27/24 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/861 ,  H01L45/04 ,  H01L45/145 ,  Y10S257/903 ,  Y10S257/91 ,  Y10S438/979

摘要： A method of making a vertical diode is provided, the vertical dioxide having associated therewith a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The diode opening is initially filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that is heavily doped with a first type dopant and a bottom portion that is lightly doped with a second type dopant. The top portion is bounded by the bottom portion so as not to contact the titanium silicide layer. For one embodiment of the vertical diode, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

摘要翻译： 提供了一种制造垂直二极管的方法，所述垂直二氧化物具有与其相连的二极管开口，其延伸穿过绝缘层并接触硅晶片上的有源区。 硅化钛层覆盖二极管开口的内表面并接触有源区。 二极管开口最初填充有非晶硅插塞，其在沉积期间被掺杂，随后再结晶以形成大晶粒多晶硅。 硅插头具有重掺杂有第一类型掺杂剂的顶部部分和轻掺杂有第二类型掺杂剂的底部部分。 顶部由底部界定，以便不与硅化钛层接触。 对于垂直二极管的一个实施例，可编程电阻器接触硅插头的顶部并且金属线接触可编程电阻器。

公开(公告)号：US06750091B1

公开(公告)日：2004-06-15

申请号：US09505953

申请日：2000-02-16

申请人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

发明人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

IPC分类号： H01L218234

CPC分类号： H01L21/02667 ,  H01L21/02532 ,  H01L21/2022 ,  H01L27/0814 ,  H01L27/101 ,  H01L27/1021 ,  H01L27/24 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/861 ,  H01L45/04 ,  H01L45/145 ,  Y10S257/903 ,  Y10S257/91 ,  Y10S438/979

摘要： A method of making a vertical diode is provided, the vertical dioxide having associated therewith a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The diode opening is initially filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that is heavily doped with a first type dopant and a bottom portion that is lightly doped with a second type dopant. The top portion is bounded by the bottom portion so as not to contact the titanium silicide layer. For one embodiment of the vertical diode, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

摘要翻译： 提供了一种制造垂直二极管的方法，所述垂直二氧化物具有与其相连的二极管开口，其延伸穿过绝缘层并接触硅晶片上的有源区。 硅化钛层覆盖二极管开口的内表面并接触有源区。 二极管开口最初填充有非晶硅插塞，其在沉积期间被掺杂，随后再结晶以形成大晶粒多晶硅。 硅插头具有重掺杂有第一类型掺杂剂的顶部部分和轻掺杂有第二类型掺杂剂的底部部分。 顶部由底部界定，以便不与硅化钛层接触。 对于垂直二极管的一个实施例，可编程电阻器接触硅插头的顶部并且金属线接触可编程电阻器。

公开(公告)号：US06194746B1

公开(公告)日：2001-02-27

申请号：US09150317

申请日：1998-09-09

申请人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

发明人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

IPC分类号： H01L2100

CPC分类号： H01L29/66136 ,  H01L27/0814 ,  H01L29/861 ,  Y10S257/91 ,  Y10S438/979

摘要： A vertical diode is provided having a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The diode opening is initially filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that is heavily doped with a first type dopant and a bottom portion that is lightly doped with a second type dopant. The top portion is bounded by the bottom portion so as not to contact the titanium silicide layer. For one embodiment of the vertical diode, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

摘要翻译： 提供了具有延伸穿过绝缘层并与硅晶片上的有源区接触的二极管开口的垂直二极管。 硅化钛层覆盖二极管开口的内表面并接触有源区。 二极管开口最初填充有非晶硅插塞，其在沉积期间被掺杂，随后再结晶以形成大晶粒多晶硅。 硅插头具有重掺杂有第一类型掺杂剂的顶部部分和轻掺杂有第二类型掺杂剂的底部部分。 顶部由底部界定，以便不与硅化钛层接触。 对于垂直二极管的一个实施例，可编程电阻器接触硅插头的顶部并且金属线接触可编程电阻器。

公开(公告)号：US06740552B2

公开(公告)日：2004-05-25

申请号：US10104656

申请日：2002-03-22

申请人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

发明人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

IPC分类号： H01L218234

CPC分类号： H01L21/02667 ,  H01L21/02532 ,  H01L21/2022 ,  H01L27/0814 ,  H01L27/101 ,  H01L27/1021 ,  H01L27/24 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/861 ,  H01L45/04 ,  H01L45/145 ,  Y10S257/903 ,  Y10S257/91 ,  Y10S438/979

摘要： A method of making a vertical diode is provided, the vertical dioxide having associated therewith a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The diode opening is initially filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that is heavily doped with a first type dopant and a bottom portion that is lightly doped with a second type dopant. The top portion is bounded by the bottom portion so as not to contact the titanium silicide layer. For one embodiment of the vertical diode, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

摘要翻译： 提供了一种制造垂直二极管的方法，所述垂直二氧化物具有与其相连的二极管开口，其延伸穿过绝缘层并接触硅晶片上的有源区。 硅化钛层覆盖二极管开口的内表面并接触有源区。 二极管开口最初填充有非晶硅插塞，其在沉积期间被掺杂，随后再结晶以形成大晶粒多晶硅。 硅插头具有重掺杂有第一类型掺杂剂的顶部部分和轻掺杂有第二类型掺杂剂的底部部分。 顶部由底部界定，以便不与硅化钛层接触。 对于垂直二极管的一个实施例，可编程电阻器接触硅插头的顶部并且金属线接触可编程电阻器。

公开(公告)号：US20090218656A1

公开(公告)日：2009-09-03

申请号：US12434212

申请日：2009-05-01

申请人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

发明人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

IPC分类号： H01L29/8605 ,  H01L21/02

CPC分类号： H01L21/02667 ,  H01L21/02532 ,  H01L21/2022 ,  H01L27/0814 ,  H01L27/101 ,  H01L27/1021 ,  H01L27/24 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/861 ,  H01L45/04 ,  H01L45/145 ,  Y10S257/903 ,  Y10S257/91 ,  Y10S438/979

摘要： Semiconductor structures and methods of making a vertical diode structure are provided. The vertical diode structure may have associated therewith a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer may be formed over the interior surface of the diode opening and contacting the active region. The diode opening may initially be filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that may be heavily doped with a first type dopant and a bottom portion that may be lightly doped with a second type dopant. The top portion may be bounded by the bottom portion so as not to contact the titanium silicide layer. In one embodiment of the vertical diode structure, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

摘要翻译： 提供了制造垂直二极管结构的半导体结构和方法。 垂直二极管结构可以具有延伸穿过绝缘层并接触硅晶片上的有源区的二极管开口。 硅化钛层可以形成在二极管开口的内表面上并与活性区接触。 二极管开口最初可以填充非晶硅插塞，其在沉积期间被掺杂并随后重结晶以形成大晶粒多晶硅。 硅插头具有可以重掺杂第一类型掺杂剂的顶部部分和可以轻掺杂第二类型掺杂剂的底部部分。 顶部可以由底部限定，以便不与硅化钛层接触。 在垂直二极管结构的一个实施例中，可编程电阻器接触硅插头的顶部并且金属线接触可编程电阻器。

公开(公告)号：US07279725B2

公开(公告)日：2007-10-09

申请号：US11210401

申请日：2005-08-24

申请人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

发明人： Fernando Gonzalez ,  Tyler A. Lowrey ,  Trung Tri Doan ,  Raymond A. Turi ,  Graham R. Wolstenholme

IPC分类号： H01L29/00

CPC分类号： H01L21/02667 ,  H01L21/02532 ,  H01L21/2022 ,  H01L27/0814 ,  H01L27/101 ,  H01L27/1021 ,  H01L27/24 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/861 ,  H01L45/04 ,  H01L45/145 ,  Y10S257/903 ,  Y10S257/91 ,  Y10S438/979

摘要： A method of making a vertical diode structure is provided, the vertical diode structure having associated therewith a diode opening extending through an insulation layer and contacting an active region on a silicon wafer. A titanium silicide layer covers the interior surface of the diode opening and contacts the active region. The diode opening is initially filled with an amorphous silicon plug that is doped during deposition and subsequently recrystallized to form large grain polysilicon. The silicon plug has a top portion that is heavily doped with a first type dopant and a bottom portion that is lightly doped with a second type dopant. The top portion is bounded by the bottom portion so as not to contact the titanium silicide layer. For one embodiment of the vertical diode structure, a programmable resistor contacts the top portion of the silicon plug and a metal line contacts the programmable resistor.

摘要翻译： 提供了制造垂直二极管结构的方法，垂直二极管结构具有与其相连的二极管开口，其延伸穿过绝缘层并接触硅晶片上的有源区。 硅化钛层覆盖二极管开口的内表面并接触有源区。 二极管开口最初填充有非晶硅插塞，其在沉积期间被掺杂，随后再结晶以形成大晶粒多晶硅。 硅插头具有重掺杂有第一类型掺杂剂的顶部部分和轻掺杂有第二类型掺杂剂的底部部分。 顶部由底部界定，以便不与硅化钛层接触。 对于垂直二极管结构的一个实施例，可编程电阻器接触硅插头的顶部并且金属线接触可编程电阻器。