公开(公告)号：US20170277936A1

公开(公告)日：2017-09-28

申请号：US15371527

申请日：2016-12-07

Applicant: Fingerprint Cards AB

Inventor： Mats Slottner

IPC: G06K9/00

CPC classification number: G06K9/00053 ,  G06K9/0002 ,  G06K9/00087

Abstract: It is provided a fingerprint sensor module comprising: a substrate; a fingerprint sensing device mounted on a first side of the substrate; at least one connection pad arranged on the substrate and configured to electrically connect the fingerprint sensor module to an external component; and an electrically conductive layer arranged on a second side of the substrate, opposing the first side, forming a back surface of the fingerprint sensing module, wherein the electrically conductive layer is connected to control circuitry of the fingerprint sensor module for controlling a potential of a finger in contact with the electrically conductive layer. There is also provided a smart card comprising a fingerprint sensor module.

公开(公告)号：USD972545S1

公开(公告)日：2022-12-13

申请号：US29754922

申请日：2020-10-15

Applicant: Fingerprint Cards AB

Designer： Sofia Runesson ,  Mats Slottner

公开(公告)号：US11610429B2

公开(公告)日：2023-03-21

申请号：US17161963

申请日：2021-01-29

Applicant: Fingerprint Cards AB

Inventor： Nils Lundberg ,  Zhimin Mo ,  Mats Slottner

IPC: G06V40/13 ,  G06K19/073 ,  G06V10/147

Abstract: A fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device comprises connection pads for connecting to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure, arranged to cover the fingerprint sensor device, having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. The fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.

公开(公告)号：US11023702B2

公开(公告)日：2021-06-01

申请号：US16512845

申请日：2019-07-16

Applicant: Fingerprint Cards AB

Inventor： Nils Lundberg ,  Zhimin Mo ,  Mats Slottner

IPC: G06K9/00 ,  G06K19/073

Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure arranged to cover the fingerprint sensor device, the cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.

公开(公告)号：US09773153B1

公开(公告)日：2017-09-26

申请号：US15371527

申请日：2016-12-07

Applicant: Fingerprint Cards AB

Inventor： Mats Slottner

IPC: G06K9/00

CPC classification number: G06K9/00053 ,  G06K9/0002 ,  G06K9/00087

Abstract: It is provided a fingerprint sensor module comprising: a substrate; a fingerprint sensing device mounted on a first side of the substrate; at least one connection pad arranged on the substrate and configured to electrically connect the fingerprint sensor module to an external component; and an electrically conductive layer arranged on a second side of the substrate, opposing the first side, forming a back surface of the fingerprint sensing module, wherein the electrically conductive layer is connected to control circuitry of the fingerprint sensor module for controlling a potential of a finger in contact with the electrically conductive layer. There is also provided a smart card comprising a fingerprint sensor module.

公开(公告)号：US09582704B2

公开(公告)日：2017-02-28

申请号：US14911573

申请日：2014-08-22

Applicant: Fingerprint Cards AB

Inventor： Pontus Jägemalm ,  Karl Lundahl ,  Mats Slottner ,  Hans Thörnblom ,  Ojie Julian

IPC: G06K9/00 ,  H01L23/00

CPC classification number: G06K9/0002 ,  H01L24/03 ,  H01L24/05 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/033 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/035 ,  H01L2224/04042 ,  H01L2224/05022 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06179 ,  H01L2224/48091 ,  H01L2224/48148 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/85186 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: A fingerprint sensing device comprising sensing circuitry comprising a plurality of sensing elements, each sensing element comprising a sensing structure arranged in a sensing plane and facing a surface of the capacitive fingerprint sensing device, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing structure and a finger placed on the surface of the fingerprint sensing device; and a plurality of connection pads electrically connected to the sensing circuitry for providing an electrical connection between the sensing circuitry and readout circuitry, wherein each of the connection pads is separately recessed in relation to the sensing plane such that each connection pad has a floor in a floor plane, and wherein each connection pad is separated from an adjacent connection pad through a portion of the sensing device being elevated in relation to the floor plane.

Abstract translation: 一种指纹感测装置，包括感测电路，其包括多个感测元件，每个感测元件包括布置在感测平面中并面向电容式指纹感测装置的表面的感测结构，每个感测元件被配置为提供指示 感测结构和放置在指纹感测装置的表面上的手指之间的电磁耦合; 以及电连接到感测电路的多个连接焊盘，用于在感测电路和读出电路之间提供电连接，其中每个连接焊盘相对于感测平面分别凹陷，使得每个连接焊盘具有位于 底板平面，并且其中每个连接垫通过相对于底板平面升高的感测装置的一部分与相邻的连接垫分离。

公开(公告)号：USD1028759S1

公开(公告)日：2024-05-28

申请号：US29800660

申请日：2021-07-22

Applicant: Fingerprint Cards AB

Designer： Sofia Runesson ,  Mats Slottner ,  Erik Montnémery

Abstract: FIG. 1 is a front and top side perspective view of a biometric sensor showing a first embodiment of our new design;
FIG. 2 is a first side view of the biometric sensor of FIG. 1;
FIG. 3 is a second side view of the biometric sensor of FIG. 1;
FIG. 4 is a third side view of the biometric sensor of FIG. 1;
FIG. 5 is a top side view of the biometric sensor of FIG. 1;
FIG. 6 is a bottom side view of the biometric sensor of FIG. 1;
FIG. 7 is a fourth side view of the biometric sensor of FIG. 1;
FIG. 8 is a front and top side perspective view of a biometric sensor showing a second embodiment of our new design;
FIG. 9 is a first side view of the biometric sensor of FIG. 8;
FIG. 10 is a second side view of the biometric sensor of FIG. 8;
FIG. 11 is a third side view of the biometric sensor of FIG. 8;
FIG. 12 is a top side view of the biometric sensor of FIG. 8;
FIG. 13 is a bottom side view of the biometric sensor of FIG. 8; and,
FIG. 14 is a fourth side view of the biometric sensor of FIG. 8.
The broken lines depict portions of a biometric sensor that form no part of the claimed design.

公开(公告)号：US10395164B2

公开(公告)日：2019-08-27

申请号：US15807679

申请日：2017-11-09

Applicant: Fingerprint Cards AB

Inventor： Nils Lundberg ,  Zhimin Mo ,  Mats Slottner

IPC: G06K9/00 ,  G06K19/14 ,  G06K19/18 ,  G06K19/077

Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry and a fingerprint sensor device cover structure, the cover structure having a first side configured to be touched by a finger, and a second side facing the sensing array, wherein the cover structure comprises conductive traces, arranged on the second side, for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.