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公开(公告)号：US6049464A
公开(公告)日：2000-04-11
申请号：US978303
申请日：1997-11-25
CPC分类号： H01L21/6835 , H01L23/3128 , H05K3/303 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/141 , H05K2201/10568 , H05K2201/10734 , H05K2203/0195 , H05K2203/082 , Y02P70/613 , Y10S439/94
摘要： In the manufacturing process of electronic modules a problem could arise when the modules have non-flat top surface. This is due to the fact that most of the automatic picking tools uses a vacuum nozzle to pick and place the module. According to the present invention a flat feature (a cap or a stud) is added to the module. This flat feature can be either fixed on the module or removable after the manufacture in order to reduce the dimensions.
摘要翻译： 在电子模块的制造过程中，当模块具有非平坦的顶表面时，可能会出现问题。 这是因为大多数自动拾取工具使用真空喷嘴来拾取和放置模块。 根据本发明，在模块中添加了一个扁平特征（帽或螺栓）。 该扁平特征可以固定在模块上，也可以在制造后移动，以减小尺寸。
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公开(公告)号：US06493240B2
公开(公告)日：2002-12-10
申请号：US09859252
申请日：2001-05-17
IPC分类号： H05K111
CPC分类号： H05K1/141 , H01L2224/16225 , H01R12/52 , H01R12/714 , H05K3/3436 , H05K3/368 , H05K2201/10378 , H05K2201/10674 , H05K2203/1572
摘要： The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard, electrically connecting the microcard and the motherboard by means of plated via-holes. The substrate is organic and a plurality of chips are mounted on both sides of the substrate. On the opposite sides of the interposer are pluralities of metal pads which are coupled by metallized via holes, the pads in turn connected to the chips, thereby coupling chips or cards on one side of the interposer to chips or boards on the other side. Electrical connection between the chips on the top side of the substrate and the metal pads on the lower side of the substrate is provided by the metallized via holes.
摘要翻译： 本发明是用于将微卡与母板电耦合的插入器。 插入器包括插入在微卡和母板之间的框架，通过电镀通孔电连接微卡和母板。 基板是有机的，并且多个芯片安装在基板的两侧。 在插入器的相对侧上是通过金属化通孔耦合的多个金属焊盘，焊盘又连接到芯片，从而将插入器的一侧上的芯片或卡耦合到另一侧的芯片或板。 通过金属化通孔提供衬底顶侧的芯片与衬底下侧的金属焊盘之间的电连接。
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公开(公告)号：US4458275A
公开(公告)日：1984-07-03
申请号：US242136
申请日：1981-03-09
申请人： Alberto Monti
发明人： Alberto Monti
CPC分类号： G11B5/59627
摘要： The method of testing units for the processing of magnetic disks comprises the insertion of a suitably modified disk into the testing unit and the reading of this disk when operations controlled by a testing programme are carried out. The disk for testing is modified and has a plurality of concentric tracks recorded on one or both sides in such a way that the distance between two tracks is slightly greater than the distance between the tracks of standard disks. Only the central track coincides exactly with the corresponding central track of standard disks. After the modified disk has been inserted in the testing unit, the magnetic head is firstly positioned on the central track of the disk and then displaced on the tracks moving increasingly further from the central track. Taking into account the occurrence of cross-talk errors caused by the head as a result of the simultaneous interference of two adjacent tracks and the number of sectors of the disk on which the head causes this error, the value of the possible non-alignment of the head in respect of the nominal axis of the tracks and the possible eccentricity of the drive spindle are determined.
摘要翻译： 用于处理磁盘的测试单元的方法包括在执行由测试程序控制的操作时将适当修改的盘插入到测试单元中并读取该磁盘。 用于测试的盘被修改并且具有记录在一侧或两侧上的多个同心轨道，使得两个轨道之间的距离稍微大于标准盘的轨道之间的距离。 只有中央轨道与标准磁盘的相应中心轨道完全一致。 在修改的盘被插入测试单元之后，磁头首先被定位在盘的中心轨道上，然后在轨道上移动，该轨迹从中心轨道越来越远。 考虑到由于两个相邻轨道的同时干扰以及磁头引起该误差的盘的扇区数量而导致头部引起的串扰错误的发生，可能的不对准的值 确定相对于轨道的标称轴线的头部和驱动主轴的可能的偏心度。
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