公开(公告)号：US20070117249A1

公开(公告)日：2007-05-24

申请号：US11653861

申请日：2007-01-17

申请人： Frank Hall ,  William Reeder ,  Bret Street ,  James Derderian

发明人： Frank Hall ,  William Reeder ,  Bret Street ,  James Derderian

IPC分类号： H01L21/00

CPC分类号： H01L27/14683 ,  B33Y80/00 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/00014 ,  H01L2924/00

摘要： Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes disposing a plurality of discrete stand-offs on the support member. The discrete stand-offs are arranged in arrays relative to corresponding imaging dies. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member, and attaching a plurality of covers to corresponding stand-off arrays so that the covers are positioned over the image sensors.

摘要翻译： 本文公开了微电子成像单元和用于制造微电子成像单元的方法。 在一个实施例中，一种方法包括将多个单独的成像管芯放置在支撑构件上。 各个成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及可操作地耦合到集成电路的多个外部触点。 该方法还包括在支撑构件上设置多个离散支架。 离散的支架相对于相应的成像管芯排列成阵列。 该方法还包括将成像管芯的外部触头电连接到支撑构件上的对应的端子，以及将多个盖子附接到相应的支架阵列，使盖子位于图像传感器上方。

公开(公告)号：US20060014313A1

公开(公告)日：2006-01-19

申请号：US10893022

申请日：2004-07-16

申请人： Frank Hall ,  William Reeder ,  Bret Street ,  James Derderian

发明人： Frank Hall ,  William Reeder ,  Bret Street ,  James Derderian

IPC分类号： H01L21/00

CPC分类号： H01L27/14683 ,  B33Y80/00 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/00014 ,  H01L2924/00

摘要： Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes disposing a plurality of discrete stand-offs on the support member. The discrete stand-offs are arranged in arrays relative to corresponding imaging dies. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member, and attaching a plurality of covers to corresponding stand-off arrays so that the covers are positioned over the image sensors.

摘要翻译： 本文公开了微电子成像单元和用于制造微电子成像单元的方法。 在一个实施例中，一种方法包括将多个单独的成像管芯放置在支撑构件上。 各个成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及可操作地耦合到集成电路的多个外部触点。 该方法还包括在支撑构件上设置多个离散支架。 离散的支架相对于相应的成像管芯排列成阵列。 该方法还包括将成像管芯的外部触头电连接到支撑构件上的对应的端子，以及将多个盖子附接到相应的支架阵列，使盖子位于图像传感器上方。

公开(公告)号：US20060035402A1

公开(公告)日：2006-02-16

申请号：US10915180

申请日：2004-08-10

申请人： Bret Street ,  Frank Hall ,  James Derderian

发明人： Bret Street ,  Frank Hall ,  James Derderian

IPC分类号： H01L21/00

CPC分类号： H01L27/1469 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00014

摘要： Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method for manufacturing a plurality of microelectronic imaging units includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include a first height, an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member and forming a base on the support member between adjacent imaging dies. The base has a second height less than or approximately equal to the first height of the dies. The method further includes attaching a plurality of covers to the base so that the covers are positioned over corresponding image sensors.

公开(公告)号：US20060216850A1

公开(公告)日：2006-09-28

申请号：US11444404

申请日：2006-06-01

申请人： Bret Street ,  Frank Hall ,  James Derderian

发明人： Bret Street ,  Frank Hall ,  James Derderian

IPC分类号： H01L21/00

CPC分类号： H01L27/1469 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00014

摘要： Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method for manufacturing a plurality of microelectronic imaging units includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include a first height, an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member and forming a base on the support member between adjacent imaging dies. The base has a second height less than or approximately equal to the first height of the dies. The method further includes attaching a plurality of covers to the base so that the covers are positioned over corresponding image sensors.

公开(公告)号：US20060223207A1

公开(公告)日：2006-10-05

申请号：US11447917

申请日：2006-06-07

申请人： James Derderian ,  Bret Street ,  Eric Mueller

发明人： James Derderian ,  Bret Street ,  Eric Mueller

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

摘要： Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes providing a plurality of imaging dies on a microfeature workpiece. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes attaching a plurality of covers to corresponding imaging dies, cutting the microfeature workpiece to singulate the imaging dies, and coupling the singulated dies to a support member. The covers can be attached to the imaging dies before or after the workpiece is cut.

摘要翻译： 本文公开了使用这种方法形成微电子成像单元和微电子成像单元的方法。 在一个实施例中，一种方法包括在微特征工件上提供多个成像管芯。 各个成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及可操作地耦合到集成电路的多个外部触点。 该方法还包括将多个盖子附接到相应的成像管芯，切割微特征工件以分割成像管芯，以及将单个模具连接到支撑件上。 盖子可以在切割工件之前或之后连接到成像模具。

公开(公告)号：US20060024856A1

公开(公告)日：2006-02-02

申请号：US10901851

申请日：2004-07-28

申请人： James Derderian ,  Bret Street ,  Eric Mueller

发明人： James Derderian ,  Bret Street ,  Eric Mueller

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/92247 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes forming a plurality of stand-offs on corresponding imaging dies before and/or after the imaging dies are singulated and electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member. The individual stand-offs include a portion between adjacent external contacts.

摘要翻译： 本文公开了使用这种方法形成微电子成像单元和微电子成像单元的方法。 在一个实施例中，一种方法包括将多个单独的成像管芯耦合到支撑构件。 各个成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及可操作地耦合到集成电路的多个外部触点。 该方法还包括在成像管芯被切割之前和/或之后在相应的成像管芯上形成多个支架，并将成像管芯的外部触头电连接到支撑构件上的相应端子。 各个支架包括相邻的外部触点之间的部分。

公开(公告)号：US20050156266A1

公开(公告)日：2005-07-21

申请号：US10930789

申请日：2004-09-01

申请人： Bret Street ,  James Derderian ,  Jeremy Minnich

发明人： Bret Street ,  James Derderian ,  Jeremy Minnich

IPC分类号： H01L23/04 ,  H01L23/10 ,  H01L27/146 ,  H01L31/0203 ,  B32B31/00

CPC分类号： H01L31/0203 ,  H01L23/04 ,  H01L23/10 ,  H01L27/14618 ,  H01L2224/48471 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches that extend from one edge of the transparent element to the other edge. A third embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches. A fourth embodiment has a transparent element with an adhesive flow restriction area formed as a protuberance. A fifth embodiment comprises a trench in the die. A sixth embodiment has a die with a plurality of trenches in the die as an adhesive flow restriction area. A seventh embodiment has a die with a protuberance.

摘要翻译： 具有粘合剂流动限制区域的模具包装。 在第一实施例中，粘合剂流动限制区域形成为透明元件中的沟槽。 第二实施例具有透明元件，其具有形成为从透明元件的一个边缘延伸到另一边缘的多个沟槽的粘合剂流动限制区域。 第三实施例具有形成为多个沟槽的粘合剂流动限制区域的透明元件。 第四实施例具有形成为突起的粘合剂流动限制区域的透明元件。 第五实施例包括模具中的沟槽。 第六实施例具有在模具中具有多个沟槽的管芯作为粘合剂流动限制区域。 第七实施例具有具有凸起的模具。

公开(公告)号：US20070114646A1

公开(公告)日：2007-05-24

申请号：US11654576

申请日：2007-01-18

申请人： Bret Street ,  James Derderian ,  Jeremy Minnich

发明人： Bret Street ,  James Derderian ,  Jeremy Minnich

IPC分类号： H01L23/02

CPC分类号： H01L31/0203 ,  H01L23/04 ,  H01L23/10 ,  H01L27/14618 ,  H01L2224/48471 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches that extend from one edge of the transparent element to the other edge. A third embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches. A fourth embodiment has a transparent element with an adhesive flow restriction area formed as a protuberance. A fifth embodiment comprises a trench in the die. A sixth embodiment has a die with a plurality of trenches in the die as an adhesive flow restriction area. A seventh embodiment has a die with a protuberance.

摘要翻译： 具有粘合剂流动限制区域的模具包装。 在第一实施例中，粘合剂流动限制区域形成为透明元件中的沟槽。 第二实施例具有透明元件，其具有形成为从透明元件的一个边缘延伸到另一边缘的多个沟槽的粘合剂流动限制区域。 第三实施例具有形成为多个沟槽的粘合剂流动限制区域的透明元件。 第四实施例具有形成为突起的粘合剂流动限制区域的透明元件。 第五实施例包括模具中的沟槽。 第六实施例具有在模具中具有多个沟槽的管芯作为粘合剂流动限制区域。 第七实施例具有具有凸起的模具。

公开(公告)号：US20050151272A1

公开(公告)日：2005-07-14

申请号：US10751441

申请日：2004-01-06

申请人： Bret Street ,  James Derderian ,  Jeremy Minnich

发明人： Bret Street ,  James Derderian ,  Jeremy Minnich

IPC分类号： H01L23/04 ,  H01L23/10 ,  H01L27/146 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L23/04 ,  H01L23/10 ,  H01L27/14618 ,  H01L2224/48471 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches that extend from one edge of the transparent element to the other edge. A third embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches. A fourth embodiment has a transparent element with an adhesive flow restriction area formed as a protuberance. A fifth embodiment comprises a trench in the die. A sixth embodiment has a die with a plurality of trenches in the die as an adhesive flow restriction area. A seventh embodiment has a die with a protuberance.

公开(公告)号：US20070287216A1

公开(公告)日：2007-12-13

申请号：US11889666

申请日：2007-08-15

申请人： James Derderian ,  Bret Street ,  Eric Mueller

发明人： James Derderian ,  Bret Street ,  Eric Mueller

IPC分类号： H01L31/18

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

摘要： Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes providing a plurality of imaging dies on a microfeature workpiece. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes attaching a plurality of covers to corresponding imaging dies, cutting the microfeature workpiece to singulate the imaging dies, and coupling the singulated dies to a support member. The covers can be attached to the imaging dies before or after the workpiece is cut.