公开(公告)号：US08129762B2

公开(公告)日：2012-03-06

申请号：US12347427

申请日：2008-12-31

申请人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin Chen Kuo ,  Te-Fu Tseng ,  Chih-Kung Chang ,  Jack Deng ,  Chung-Sheng Hsiung ,  Bii-Junq Chang

发明人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin Chen Kuo ,  Te-Fu Tseng ,  Chih-Kung Chang ,  Jack Deng ,  Chung-Sheng Hsiung ,  Bii-Junq Chang

IPC分类号： H01L27/148

CPC分类号： H01L27/14625 ,  H01L23/544 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

摘要翻译： 提供了一种处理衬底的方法。 衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。 在衬底上形成第一平坦化层。 平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。 在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

公开(公告)号：US07507598B2

公开(公告)日：2009-03-24

申请号：US11156794

申请日：2005-06-20

申请人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin Chen Kuo ,  Te-Fu Tseng ,  Chih-Kung Chang ,  Jack Deng ,  Chung-Sheng Hsiung ,  Bii-Junq Chang

发明人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin Chen Kuo ,  Te-Fu Tseng ,  Chih-Kung Chang ,  Jack Deng ,  Chung-Sheng Hsiung ,  Bii-Junq Chang

IPC分类号： H01L21/00

CPC分类号： H01L27/14625 ,  H01L23/544 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

摘要翻译： 提供了一种处理衬底的方法。 衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。 在衬底上形成第一平坦化层。 平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。 在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

公开(公告)号：US20090104547A1

公开(公告)日：2009-04-23

申请号：US12347427

申请日：2008-12-31

申请人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin Chen Kuo ,  Te-Fu Tseng ,  Chih-Kung Chang ,  Jack Deng ,  Chung-Sheng Hsiung ,  Bii-Junq Chang

发明人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin Chen Kuo ,  Te-Fu Tseng ,  Chih-Kung Chang ,  Jack Deng ,  Chung-Sheng Hsiung ,  Bii-Junq Chang

IPC分类号： G03F3/00

CPC分类号： H01L27/14625 ,  H01L23/544 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

摘要翻译： 提供了一种处理衬底的方法。 衬底具有至少一个滤波器区域，多个接合焊盘以及围绕滤波器区域和接合焊盘布置的多个划线。 在衬底上形成第一平坦化层。 平坦化层具有覆盖过滤器区域，接合焊盘和划线的基本平坦的顶表面。 在第一平坦化层和滤波器区域内形成至少一个抗蚀剂层，同时第一平坦化层覆盖接合焊盘和划线。

公开(公告)号：US20060019424A1

公开(公告)日：2006-01-26

申请号：US11156794

申请日：2005-06-20

申请人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin Chen Kuo ,  Te-Fu Tseng ,  Chih-Kung Chang ,  Jack Deng ,  Chung-Sheng Hsiung ,  Bii-Junq Chang

发明人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin Chen Kuo ,  Te-Fu Tseng ,  Chih-Kung Chang ,  Jack Deng ,  Chung-Sheng Hsiung ,  Bii-Junq Chang

IPC分类号： H01L21/00

CPC分类号： H01L27/14625 ,  H01L23/544 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

公开(公告)号：US06849533B2

公开(公告)日：2005-02-01

申请号：US10354697

申请日：2003-01-29

申请人： Chih-Kung Chang ,  Yu-Kung Hsiao ,  Sheng-Liang Pan ,  Fu-Tien Wong ,  Chin-Chen Kuo ,  Chung-Sheng Hsiung ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Po-Wen Lin ,  Te-Fu Tseng

发明人： Chih-Kung Chang ,  Yu-Kung Hsiao ,  Sheng-Liang Pan ,  Fu-Tien Wong ,  Chin-Chen Kuo ,  Chung-Sheng Hsiung ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Po-Wen Lin ,  Te-Fu Tseng

IPC分类号： H01L21/44 ,  H01L21/60

CPC分类号： H01L24/11 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/00

摘要： A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.

摘要翻译： 用于制造微电子产品的方法提供了在接合焊盘和地形特征上形成平坦化层，两者均形成在衬底上横向分离。 平坦化层在接合焊盘上形成为具有减小的厚度，使得其可以容易地蚀刻以暴露接合焊盘，同时使用形成在地形特征上但不在接合焊盘上的附加层作为掩模。 该方法对于形成具有减弱的键合垫腐蚀的滤色器传感器图像阵列光电产品特别有用。

公开(公告)号：US06956253B2

公开(公告)日：2005-10-18

申请号：US10456759

申请日：2003-06-06

申请人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin-Chen Kuo ,  Te-Fu Tseng

发明人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin-Chen Kuo ,  Te-Fu Tseng

IPC分类号： H01L21/46 ,  H01L21/78 ,  H01L27/146 ,  H01L29/768

CPC分类号： H01L27/14625 ,  H01L27/14621 ,  H01L27/14685

摘要： A color filter includes a substrate having a plurality of scribe lines arranged to form at least one filter region surrounded by the scribe lines. The scribe lines are at least partially filled with a resist material. At least one color resist layer is formed above the substrate within the at least one filter region.

摘要翻译： 滤色器包括具有布置成形成由划线包围的至少一个滤光片区域的多个划线的基板。 划痕线至少部分地被抗蚀剂材料填充。 在至少一个过滤器区域内的衬底上方形成至少一个着色抗蚀剂层。

公开(公告)号：US06964916B2

公开(公告)日：2005-11-15

申请号：US10781217

申请日：2004-02-17

申请人： Chin Chen Kuo ,  Chih-Kung Chang ,  Hung-Jen Hsu ,  Fu-Tien Weng ,  Te-Fu Tseng

发明人： Chin Chen Kuo ,  Chih-Kung Chang ,  Hung-Jen Hsu ,  Fu-Tien Weng ,  Te-Fu Tseng

IPC分类号： H01L21/46 ,  H01L21/78 ,  H01L27/146 ,  H01L29/768

CPC分类号： H01L27/14621 ,  H01L27/14625 ,  H01L27/14685

摘要： A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited metal has a height near to a height of the planarization layer. At least one color resist layer is formed above the planarization layer.

摘要翻译： 一种用于处理半导体衬底的方法包括提供具有至少一个过滤器区域的衬底，其中具有多个焊盘。 金属沉积在接合焊盘上方，以减少焊盘台阶高度。 形成平坦化层，使得沉积的金属具有接近平坦化层的高度的高度。 在平坦化层上方形成至少一层耐光层。

公开(公告)号：US06861207B2

公开(公告)日：2005-03-01

申请号：US10611645

申请日：2003-06-30

申请人： Hung-Jen Hsu ,  Chih-Kung Chang ,  Fu-Tien Weng ,  Te-Fu Tseng ,  Chin-Chen Kuo ,  Chiung-Yuan Chang

发明人： Hung-Jen Hsu ,  Chih-Kung Chang ,  Fu-Tien Weng ,  Te-Fu Tseng ,  Chin-Chen Kuo ,  Chiung-Yuan Chang

IPC分类号： G02B3/00 ,  H01L27/14

CPC分类号： G02B5/201 ,  G02B3/0018 ,  G02B3/0056 ,  H01L27/14685

摘要： A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.

摘要翻译： 一种制造微透镜器件的方法。 该方法包括填充接合焊盘区域和划线或其它区域，以改善半导体晶片表面的形貌。 在填充接合焊盘区域和划线之后，将微透镜材料施加到表面。 由于形貌改善，微透镜材料的厚度更均匀，从而有助于形成均匀成形的微透镜。

公开(公告)号：US20050242271A1

公开(公告)日：2005-11-03

申请号：US10833565

申请日：2004-04-28

申请人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Chin-Kung Chang ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin-Chen Kuo

发明人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Chin-Kung Chang ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin-Chen Kuo

IPC分类号： H01L27/00 ,  H01L27/146 ,  H01L31/00 ,  H01L31/0216 ,  H01L31/0232

CPC分类号： H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627

摘要： An image sensor device and method for forming said device are described. The image sensor structure comprises a substrate with photodiodes, an interconnect structure formed on the substrate, a color filter layer above the interconnect structure, a first microlens array, an overcoat layer, and a second microlens array. A key feature is that a second microlens has a larger radius of curvature than a first microlens. Additionally, each first microlens and second microlens is a flat convex lens. Thus, a thicker second microlens with a short focal length is aligned above a thinner first microlens having a long focal length. A light column that includes a first microlens, a second microlens and a color filter region is formed above each photodiode. A second embodiment involves replacing a second microlens in each light column with a plurality of smaller second microlenses that focus light onto a first microlens.

摘要翻译： 描述了用于形成所述装置的图像传感器装置和方法。 图像传感器结构包括具有光电二极管的衬底，形成在衬底上的互连结构，在互连结构上方的滤色器层，第一微透镜阵列，外涂层和第二微透镜阵列。 一个关键特征是第二微透镜具有比第一微透镜更大的曲率半径。 另外，每个第一微透镜和第二微透镜是平凸透镜。 因此，具有短焦距的较厚的第二微透镜在具有长焦距的较薄的第一微透镜上对准。 在每个光电二极管上方形成包括第一微透镜，第二微透镜和滤色器区域的光柱。 第二实施例涉及用多个将光聚焦到第一微透镜上的多个较小的第二微透镜替换每个光柱中的第二微透镜。

公开(公告)号：US07372497B2

公开(公告)日：2008-05-13

申请号：US10833565

申请日：2004-04-28

申请人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Chin-Kung Chang ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin-Chen Kuo

发明人： Fu-Tien Weng ,  Yu-Kung Hsiao ,  Chin-Kung Chang ,  Hung-Jen Hsu ,  Yi-Ming Dai ,  Chin-Chen Kuo

IPC分类号： H04N5/225

CPC分类号： H01L27/14685 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627

摘要： An image sensor device and method for forming said device are described. The image sensor structure comprises a substrate with photodiodes, an interconnect structure formed on the substrate, a color filter layer above the interconnect structure, a first microlens array, an overcoat layer, and a second microlens array. A key feature is that a second microlens has a larger radius of curvature than a first microlens. Additionally, each first microlens and second microlens is a flat convex lens. Thus, a thicker second microlens with a short focal length is aligned above a thinner first microlens having a long focal length. A light column that includes a first microlens, a second microlens and a color filter region is formed above each photodiode. A second embodiment involves replacing a second microlens in each light column with a plurality of smaller second microlenses that focus light onto a first microlens.

摘要翻译： 描述了用于形成所述装置的图像传感器装置和方法。 图像传感器结构包括具有光电二极管的衬底，形成在衬底上的互连结构，在互连结构上方的滤色器层，第一微透镜阵列，外涂层和第二微透镜阵列。 一个关键特征是第二微透镜具有比第一微透镜更大的曲率半径。 另外，每个第一微透镜和第二微透镜是平凸透镜。 因此，具有短焦距的较厚的第二微透镜在具有长焦距的较薄的第一微透镜上对准。 在每个光电二极管上方形成包括第一微透镜，第二微透镜和滤色器区域的光柱。 第二实施例涉及用多个将光聚焦到第一微透镜上的多个较小的第二微透镜替换每个光柱中的第二微透镜。