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公开(公告)号：US20240258111A1
公开(公告)日：2024-08-01
申请号：US18434199
申请日：2024-02-06
CPC分类号： H01L21/30 , C09D5/00 , C09D7/20 , H01L23/293
摘要： This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
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公开(公告)号：US20230048767A1
公开(公告)日：2023-02-16
申请号：US17968971
申请日：2022-10-19
摘要： This disclosure relates to methods and compositions for treating a semiconductor substrate having a pattern disposed on a surface of the substrate.
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公开(公告)号：US20210122925A1
公开(公告)日：2021-04-29
申请号：US17143229
申请日：2021-01-07
IPC分类号： C09D5/00 , C09D4/00 , C09D183/04 , C09D7/63 , B08B3/08 , H01L21/02 , H01L23/29 , C09D7/20 , C08K5/095 , C08K5/09
摘要： This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
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公开(公告)号：US10533146B2
公开(公告)日：2020-01-14
申请号：US15725415
申请日：2017-10-05
发明人： Keeyoung Park , Emil A. Kneer , Thomas Dory , Tomonori Takahashi
IPC分类号： C11D7/50 , C11D7/20 , C11D3/00 , H01L21/02 , C11D7/06 , C11D7/10 , C11D7/32 , C11D7/34 , C11D11/00 , C11D7/26
摘要： This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 3) at least one metal-containing additive; and 4) water.
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公开(公告)号：US11508569B2
公开(公告)日：2022-11-22
申请号：US16983119
申请日：2020-08-03
摘要： This disclosure relates to methods and compositions for treating a semiconductor substrate having a pattern disposed on a surface of the substrate. The methods can include a) supplying a sublimating material to a substrate having a pattern disposed on a surface thereof; b) maintaining the sublimating material on the surface for a time sufficient to modify the surface; c) solidifying the sublimating material on the surface; and d) removing by sublimation the sublimating material disposed on the surface.
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公开(公告)号：US11174394B2
公开(公告)日：2021-11-16
申请号：US16223396
申请日：2018-12-18
IPC分类号： H01L29/08 , C09D5/00 , C09D4/00 , C09D183/04 , C09D7/63 , B08B3/08 , H01L21/02 , H01L23/29 , C09D7/20 , C08K5/095 , C08K5/09 , H01L21/3105 , C09D7/40 , H01L21/306
摘要： This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
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公开(公告)号：US20180100128A1
公开(公告)日：2018-04-12
申请号：US15725415
申请日：2017-10-05
发明人： Keeyoung Park , Emil A. Kneer , Thomas Dory , Tomonori Takahashi
CPC分类号： C11D7/20 , C11D3/0042 , C11D7/06 , C11D7/10 , C11D7/261 , C11D7/263 , C11D7/264 , C11D7/266 , C11D7/3245 , C11D7/34 , C11D7/50 , C11D7/5022 , C11D11/0047 , H01L21/02063
摘要： This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 3) at least one metal-containing additive; and 4) water.
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公开(公告)号：US20190211210A1
公开(公告)日：2019-07-11
申请号：US16223396
申请日：2018-12-18
CPC分类号： C09D5/00 , B08B3/08 , C09D4/00 , C09D7/20 , C09D7/63 , C09D183/04 , H01L21/02057 , H01L21/02126 , H01L23/296
摘要： This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
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公开(公告)号：US20180277357A1
公开(公告)日：2018-09-27
申请号：US15928152
申请日：2018-03-22
摘要： The disclosure provides methods and compositions therefor for treating a surface wherein a surface treatment layer is formed on the surface, thereby minimizing or preventing pattern collapse as the surface is subjected to typical cleaning steps in the semiconductor manufacturing process.
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公开(公告)号：US11447642B2
公开(公告)日：2022-09-20
申请号：US17143229
申请日：2021-01-07
IPC分类号： H01L23/29 , C09D5/00 , C09D4/00 , C09D183/04 , C09D7/63 , B08B3/08 , H01L21/02 , C09D7/20 , C08K5/095 , C08K5/09 , H01L21/3105 , C09D7/40 , H01L21/306
摘要： This disclosure relates to methods and compositions for treating a wafer having a pattern disposed on a surface of the wafer.
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