公开(公告)号：US20030137223A1

公开(公告)日：2003-07-24

申请号：US10347708

申请日：2003-01-21

Applicant: Fujitsu Limited

Inventor： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

IPC: H01L041/047

CPC classification number: H01L41/29 ,  G11B5/5552 ,  G11B5/5556 ,  H01L41/0993 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01327 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

公开(公告)号：US20030173411A1

公开(公告)日：2003-09-18

申请号：US10199850

申请日：2002-07-19

Applicant: FUJITSU LIMITED

Inventor： Masanao Fujii ,  Toru Okada ,  Hidehiko Kobayashi ,  Seiichi Shimoura

IPC: B60H001/02 ,  F24D001/04 ,  F24D005/00

CPC classification number: H01L41/313

Abstract: A first plate material is set on a work stage. The first plate material includes first components commonly connected to a first connection member. A second plate material is subsequently set on the work stage. The second plate material includes second components commonly connected to a second connection member. The second components are superposed on the corresponding first components. The first components as well as the second components can be handled as a one-piece component. It leads to an improved productivity. Heat surfaces of a heat block contact the second components. The connection members are prevented from thermal expansion. The constant intervals are reliably maintained between the adjacent first components and the adjacent second components.

Abstract translation: 将第一板材放置在工作台上。 第一板材包括通常连接到第一连接构件的第一部件。 随后将第二板材置于工作台上。 第二板材包括通常连接到第二连接构件的第二部件。 第二组件叠加在相应的第一组件上。 第一组件以及第二组件可以作为单件组件来处理。 它可以提高生产率。 加热块的热表面与第二部件接触。 连接件防止热膨胀。 在相邻的第一部件和相邻的第二部件之间可靠地保持恒定间隔。

公开(公告)号：US20020195476A1

公开(公告)日：2002-12-26

申请号：US10185801

申请日：2002-06-27

Applicant: Fujitsu Limited

Inventor： Shunji Baba ,  Hidehiko Kira ,  Norio Kainuma ,  Toru Okada

IPC: B23K020/12

CPC classification number: H01L24/81 ,  B23K1/0008 ,  B23K2101/40 ,  G11B5/4806 ,  G11B5/486 ,  G11B33/122 ,  H01L24/75 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/75302 ,  H01L2224/75303 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A suspension of a head assembly provided in a disk apparatus is prevented from being deformed due to mounting of a head IC chip onto the suspension. The head IC chip mounted on the suspension has protruding electrodes made of gold. The suspension has electrode pads connected to the respective protruding electrodes of the head IC chip. Each of the electrode pads has a surface layer made of gold. The protruding electrodes of the head IC chip are bonded to the electrode pads of the suspension by ultrasonic bonding.

Abstract translation: 由于将头IC芯片安装到悬架上，防止设置在盘装置中的头组件的悬架变形。 安装在悬架上的头IC芯片具有由金制成的突出电极。 悬架具有连接到头IC芯片的各个突出电极的电极焊盘。 每个电极焊盘具有由金制成的表面层。 头IC芯片的突出电极通过超声波接合结合到悬浮液的电极焊盘。

公开(公告)号：US20020074902A1

公开(公告)日：2002-06-20

申请号：US09822636

申请日：2001-03-30

Applicant: FUJITSU LIMITED

Inventor： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayaski ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

IPC: H01L041/04

CPC classification number: H01L41/29 ,  G11B5/5552 ,  G11B5/5556 ,  H01L41/0993 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01327 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Abstract translation: 一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成 在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。 第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。 该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。

公开(公告)号：US20030057552A1

公开(公告)日：2003-03-27

申请号：US10223454

申请日：2002-08-20

Applicant: FUJITSU LIMITED

Inventor： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

IPC: H01L023/48

CPC classification number: H01L24/28 ,  H01L21/563 ,  H01L24/13 ,  H01L24/14 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05664

Abstract: An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 nullm is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.

公开(公告)号：US20020059717A1

公开(公告)日：2002-05-23

申请号：US09820553

申请日：2001-03-29

Applicant: FUJITSU LIMITED

Inventor： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

IPC: G11B005/127 ,  H04R031/00

CPC classification number: G11B5/5552 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49025 ,  Y10T29/49055

Abstract: A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.

Abstract translation: 提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架 被放置在第一粘合剂上。 第一粘合剂通过加热和压制半固化。 将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。 第二粘合剂通过加热和压制半固化。 将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架被放置在第三粘合剂上。 第三粘合剂通过加热和压制半固化。 接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。 第四粘合剂通过加热和加压半固化。 最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。

公开(公告)号：US20030184191A1

公开(公告)日：2003-10-02

申请号：US10459955

申请日：2003-06-12

Applicant: Fujitsu Limited

Inventor： Masanao Fujii ,  Toru Okada ,  Masayuki Kitajima ,  Hidehiko Kobayashi ,  Seiichi Shimoura

IPC: H01L041/08

CPC classification number: G11B5/5552 ,  H01L41/0993 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head, to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

Abstract translation: 在制造微致动器的方法中，将第一粘合剂施加到可动板上，将可动电极放置在第一粘合剂上。 可移动板和可动电极夹紧在第一台和第一头之间，然后在第一预定时间段内加热第一预定的压力负载到第一头上，以半固化第一粘合剂。 将第二粘合剂施加到可动电极上，并将压电元件放置在第二粘合剂上。 可移动板，可动电极和压电元件被夹持在第一级和第二头之间，随后在第二预定时间段内加热，同时向第二头施加第二预定的压力负载以半固化第二粘合剂 。 接下来，将第三粘合剂施加到致动器基座，将基极放置在第三粘合剂上，并且以与上述相同的方式将第三粘合剂半固化。 将第四粘合剂施加到基底电极上，将压电元件放置在第四粘合剂上，并且以与上述相同的方式将第四粘合剂半固化。 最后，将如此得到的粘合层叠体放入加热炉中并在预定温度下加热预定的时间，从而使粘合剂完全固化。

公开(公告)号：US20030103169A1

公开(公告)日：2003-06-05

申请号：US10309575

申请日：2002-12-04

Applicant: FUJITSU LIMITED

Inventor： Toru Okada ,  Masanao Fujii ,  Seiichi Shimoura ,  Shingo Yamaguchi ,  Haruyasu Watanabe

IPC: H04N003/14

CPC classification number: G02B27/0172 ,  G02B2027/0178

Abstract: A body has a configuration in which a first ellipse has a first and second focal points and a second ellipse having a third and fourth points are arranged such that the second and third focal points coincide. This body is equivalent to an optical system having an optical path in which light gathered to the first focal point passes through the first focal point, and is reflected by a first concave reflecting surface, being a part of the first ellipse, to go through the second focal point, and then reflected by a second concave reflecting surface, being a part of the second ellipse, to be gathered to the fourth focal point.

Abstract translation: 主体具有其中第一椭圆具有第一和第二焦点的构造，并且具有第三和第四点的第二椭圆被布置成使得第二和第三焦点重合。 本体等效于具有聚光到第一焦点的光通过第一焦点的光路的光学系统，并且被作为第一椭圆的一部分的第一凹面反射面反射，穿过第一椭圆 第二焦点，然后被作为第二椭圆的一部分的第二凹面反射面反射，聚集到第四焦点。

公开(公告)号：US20020050767A1

公开(公告)日：2002-05-02

申请号：US09822621

申请日：2001-03-30

Applicant: FUJITSU LIMITED

Inventor： Masanao Fujii ,  Toru Okada ,  Masayuki Kitajima ,  Hidehiko Kobayashi ,  Seiichi Shimoura

IPC: H01L041/04

CPC classification number: G11B5/5552 ,  H01L41/0993 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

Abstract translation: 在制造微致动器的方法中，将第一粘合剂施加到可动板上，将可动电极放置在第一粘合剂上。 可移动板和可动电极夹紧在第一台和第一头之间，随后在第一预定时间段内加热，同时对第一头施加第一预定的压力负载以半固化第一粘合剂。 将第二粘合剂施加到可动电极上，并将压电元件放置在第二粘合剂上。 可移动板，可动电极和压电元件被夹持在第一级和第二头之间，随后在第二预定时间段内加热，同时向第二头施加第二预定的压力负载以半固化第二粘合剂 。 接下来，将第三粘合剂施加到致动器基座，将基极放置在第三粘合剂上，并且以与上述相同的方式将第三粘合剂半固化。 将第四粘合剂施加到基底电极上，将压电元件放置在第四粘合剂上，并且以与上述相同的方式将第四粘合剂半固化。 最后，将如此得到的粘合层叠体放入加热炉中并在预定温度下加热预定的时间，从而使粘合剂完全固化。