摘要:
The present invention relates to a projector using laser light, and more particularly to a ring-shaped laser spot capable of forming a projected image having a ring-shaped projected image formed from a diffraction fringe, by interposing a diaphragm between a collimator lens and a target. The collimator lens transmits laser light emitted from a laser light source to the target to form a first projected image on the target. The diaphragm shapes the laser light transmitted through the collimator lens to form a ring-shaped second projected image as a diffraction fringe on the target.
摘要:
The present invention provides a method of manufacturing a semiconductor device and a semiconductor device that allow use of interlayer and interconnect insulating films having a low dielectric constant in forming a dual damascene structure. A first insulating film, a second insulating film, a first-mask forming layer, a second-mask forming layer, a third-mask forming layer, and a fourth-mask forming layer are sequentially deposited over a substrate. The fourth-mask forming layer is patterned to form a fourth mask having an interconnect trench pattern. After a resist mask is formed on the fourth mask, the layers to the second insulating film are etched to open via holes. The third-mask forming layer is etched through the fourth mask to thereby form a third mask having the interconnect trench pattern and to extend the via holes downward partway across the first insulating film. The second-mask forming layer is etched through the fourth mask to thereby form a second mask having the interconnect trench pattern, and the first insulating film that remains under the bottoms of the via holes is removed. Subsequently, the second insulating film is etched through the second mask to thereby form an interconnect trench, and then the second mask is removed.
摘要:
A solid-state image pickup device 100 is constructed in which a waveguide 15 is formed in an insulating layer on a light-receiving sensor portion 2, a side wall 161 of the waveguide 15 is covered with a reflective film 17 made of an Al film deposited by a CVD method, an underlayer film 19 is formed between the reflective film 17 and the side wall 161 of the waveguide 15 and the underlayer film 19 is made of a VIb-group element. It is possible to obtain a solid-state image pickup device including a waveguide in which hydrogen supplied to the light-receiving sensor portion 2 can be restrained from being absorbed by the underlayer film 19 and which has the reflective film 17 of high reflectivity with satisfactory surface condition, satisfactory coverage and excellent adhesion.
摘要:
Disclosed herein is a capacitive element formed by multilayer wirings, wherein a total capacitance, intralayer capacitance and interlayer capacitance are calculated for a plurality of device structures by changing parameters relating to the multilayer wirings in an integrated circuit, a device structure is identified, from among the plurality of device structures, whose difference in the total capacitance between the device structures is equal to or less than a predetermined level and at least either of whose ratio of the intralayer capacitance to the total capacitance or ratio of the interlayer capacitance to the total capacitance satisfies a predetermined condition, and the parameters of the device structure satisfying the predetermined condition are determined as the parameters of the multilayer wirings.
摘要:
A measuring apparatus measuring a surface shape of a target includes a projection optical system to radiate a line beam on the target, an imaging device to acquire a reflected line beam reflected from the target, an optical imaging system to cause the reflected line beam to form an image on a receiving surface of the imaging device to acquire a shape of the line beam on the target, and a splitting mechanism to split the reflected line beam so as to acquire the shape of the line beam on the target at different positions in an extending direction of the line beam and guide the split reflected line beams to the imaging device. A plurality of segments are set on the receiving surface while each segment in which at least one region is set as a reception region is partitioned into a plurality of regions, and the optical imaging system causes the split reflected line beams to form images on the reception regions in the different segments, respectively.
摘要:
A measuring apparatus for measuring a surface shape of a target, includes a projection system to radiate a line beam on the target, an imaging device to acquire a reflected line beam reflected from the target, a plurality of imaging systems each configured to cause the reflected line beam to form an image on a receiving surface of the imaging device so that a shape of the line beam on the target is acquired and a splitting mechanism to split the reflected line beam and guide the split reflected line beam to the imaging device. The imaging systems have different optical settings for the object in the target, a plurality of segments are set on the receiving surface while each of the segments in each of which at least one region is set as a reception region is partitioned into a plurality of regions, and the imaging system causes the reflected line beams split by the splitting mechanism to form images on the reception regions in the different segments, respectively.
摘要:
Disclosed is a semiconductor device which has a wiring structure including a small-width wiring connected to a large-width wiring through a connection hole or holes formed in an inter-layer insulation film and in which reliability of wiring can be enhanced by regulating the number of the connection hole or holes and the location(s) of the connection hole or hole. The semiconductor device includes first wirings (21), (22), an inter-layer insulation film (not shown) covering the first wirings (21), (22), second wirings (31), (33) connected to the first wirings (21), (22) through the connection holes formed in the inter-layer insulation film, the first wirings (21), (22) being formed to be larger in width than the second wirings (31), (33), wherein a plurality of the connection holes (41), (42) and connection holes (43) to (45) are provided, and the plurality of the connection holes (41), (42), (43) to (45) are disposed at intervals between the connection holes (41), (42) and between the connection holes (43) to (45) within the range of from 1 to 18 times the connection hole diameter.
摘要:
A measuring apparatus measuring a surface shape of a target includes a projection optical system to radiate a line beam on the target, an imaging device to acquire a reflected line beam reflected from the target, an optical imaging system to cause the reflected line beam to form an image on a receiving surface of the imaging device to acquire a shape of the line beam on the target, and a splitting mechanism to split the reflected line beam so as to acquire the shape of the line beam on the target at different positions in an extending direction of the line beam and guide the split reflected line beams to the imaging device. A plurality of segments are set on the receiving surface while each segment in which at least one region is set as a reception region is partitioned into a plurality of regions, and the optical imaging system causes the split reflected line beams to form images on the reception regions in the different segments, respectively.
摘要:
In order to form an aluminum system wiring that does not peel off on an insulating film containing fluorine and to improve the reliability thereof, a semiconductor device according to the present invention includes an insulating film (14) containing fluorine formed on a substrate (11), a titanium aluminum alloy film (17a) formed on the insulating film (14) containing fluorine, and a metallic film (17b) comprising aluminum or an aluminum alloy formed on the titanium aluminum alloy film (17a).
摘要:
A solid-state imaging device having a plurality of light-receiving sections which are disposed in a substrate and which generate charge in response to incident light, a planarizing layer which covers predetermined elements disposed on the substrate to perform planarization, a plurality of signal lines disposed above the planarizing layer and a waveguide which guides incident light to each of the light-receiving sections, the waveguide passing through the space between the plurality of signal lines.