Abstract:
A sensor system in which it is possible to identify a sufficient number of sensors even in a situation where the data length of a packet is limited, as well as a sensor and a receiving device in the same, are provided. A sensor repeating a measurement period for performing measurement and a transmission period for performing transmission at predetermined cycles, includes: a measurement section (11) that outputs during the measurement period measurement information based on predetermined measurement; and a transmission section (12) that transmits during the transmission period, by using a single packet or a plurality of packets, source identification information for identifying a source of a packet, the measurement information, and sensor-related information for identifying the sensor and/or a measurement target equipment of this sensor.
Abstract:
A pneumatic tire is provided in the tread portion (2) with a circumferential groove (3, 3b, 3c) extending continuously in the tire circumferential direction and having a pair of oppositely opposed groove walls (6). The circumferential groove (3, 3b, 3c) is provided in at least one of the groove walls (6) with radial grooves (9) arranged along the longitudinal direction of the circumferential groove (3). The radially outer end (9o) of the radial groove (9) is positioned in a range (a1) of from 0 to 20% of the depth (GDt) of the circumferential groove. The radially inner end (9i) of the radial groove (9) is positioned in a range (a2) of from 80 to 100% of the depth (GDt) of the circumferential groove. The radial groove has an opening width (g) of not less than 1.0 mm, but not more than 6.0 mm.
Abstract:
A method of manufacturing a semiconductor device, including forming an opening in an interlevel insulating film disposed on a semiconductor substrate, forming an auxiliary film containing a predetermined metal element, to cover an inner surface of the opening, forming a main film to fill the opening after forming the auxiliary film, the main film containing, as a main component, Cu used as a material of an interconnection main layer, and performing a heat treatment before or after forming the main film, thereby diffusing the predetermined metal element of the auxiliary film onto a surface of the interlevel insulating film facing the auxiliary film, so as to form a barrier film on the interlevel insulating film within the opening, the barrier film containing, as a main component, a compound of the predetermined metal element with a component element of the interlevel insulating film.
Abstract:
Disclosed is a semiconductor storage device including a first electrode formed by being embedded in an insulating film formed on a substrate, a second electrode formed to be opposed to the first electrode, a storage layer formed between the first electrode and the second electrode, the storage layer being on a side of the first electrode, an ion source layer formed between the storage layer and the second electrode, and a diffusion prevention layer formed of a manganese oxide layer between the insulating film and the first electrode.
Abstract:
A method of manufacturing a semiconductor device by forming an alloy layer in a connection hole provided in a layer insulation film on a substrate, including a first step of forming a first Cu layer in the state of covering the inside wall of the connection hole, a second step of forming an Ag layer on the first Cu layer, a third step of filling up with a second Cu layer the connection hole provided with the Ag layer, and a fourth step of forming a via composed of a CuAg alloy by diffusion caused by a heat treatment.
Abstract:
It aims to provide a heavy duty pneumatic tire with block patterns and capable of improving deflected wear resisting performances without sacrificing wet grip performances or on-snow performances and that can particularly be favorably used for all seasons. The present invention comprises block patterns employing at least three types of blocks 4 comprised of central blocks 4C delimited by the central longitudinal groove 2M, the intermediate longitudinal grooves 2M, and the central lateral grooves 3C, intermediate blocks 4M delimited by the intermediate longitudinal grooves 2M, the outer longitudinal grooves 2S and the intermediate lateral grooves 3M, and outer blocks 4S that are delimited by outer longitudinal grooves 2S, outer lateral grooves 3S that extend from this outer longitudinal grooves 2S to the tread ends E, and wherein longitudinal length ratios (L4/W4) of blocks 4, groove width ratios of longitudinal grooves and lateral grooves (w2/w3), maximum widths of blocks, minimum widths of blocks and ratios thereof (W4max/W4min), and circumferential edge components and tire axial edge components and ratios thereof (EC/EL) at respective stages of wear are defined to be within specified ranges.
Abstract:
A semiconductor device includes an interlevel insulating film disposed on a semiconductor substrate and having an opening formed therein. An interconnection main layer, which contains Cu as a main component, is embedded in the opening. A barrier film is interposed between the interlevel insulating film and the interconnection main layer within the opening. The barrier film contains, as a main component, a compound of a predetermined metal element with a component element of the interlevel insulating film.
Abstract:
The object is to make it possible to pass an electric current to the object of polishing with a stable current density distribution up to the end point of polishing, to use the same plating apparatus, cleaning apparatus and other apparatuses as those conventionally used, and to carry out the conventional manufacturing process flow. A substrate (1) provided with a metallic film (2) and a opposite electrode (3) are disposed oppositely to each other with a predetermined distance therebetween in an electrolytic solution, and an electric current is passed to the metallic film (2) through the electrolytic solution by an anode (4) set out of contact with the metallic film (2), so as to electropolish the metallic film (2). Simultaneously with the electropolishing, wiping is conducted by sliding a pad on the metallic film.
Abstract:
A projection type liquid crystal display device includes a light source and condenser lenses for emitting two groups of beams of light which orthogonally cross each other. A first device is disposed in the path of one of the groups of beams and comprises a liquid crystal panel and at least one polarization plate to transmit P-wave polarized light. A second device is disposed in a path of the other group of beams of light and comprises a liquid crystal panel and at least one polarization plate to transmit P-wave polarized light. A dichroic mirror disposed to receive light from the first and second devices synthesizes the P-wave polarized light by transmitting P-wave polarized light from the first device and for reflecting the P-wave polarized light from the second device.