公开(公告)号：US06242106B1

公开(公告)日：2001-06-05

申请号：US09305767

申请日：1999-05-05

申请人： Günter Herklotz ,  Lutz Schräpler ,  Christoph Simons ,  Jürgen Reuel ,  Y. C. Cho

发明人： Günter Herklotz ,  Lutz Schräpler ,  Christoph Simons ,  Jürgen Reuel ,  Y. C. Cho

IPC分类号： C22C502

CPC分类号： H01L24/45 ,  H01L24/43 ,  H01L2224/4321 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01018 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/01063 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/30107 ,  Y10T428/12431 ,  H01L2924/01046 ,  H01L2924/01201 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01026 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01062 ,  H01L2924/01064 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01069 ,  H01L2924/0107 ,  H01L2924/01071 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00013

摘要： A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.

摘要翻译： 由含有0.6〜2重量％镍的金合金或含有0.1〜2重量％的镍的合金，0.0001〜0.1重量％的碱土金属和/或稀土金属制成的细线， 和任选的0.1至1.0重量％的铂和/或钯。 细线通过有利的导电性和良好的强度与伸长率的区别。 细线适用于半导体器件的引线接合和用于制造倒装芯片的球凸块。