公开(公告)号：US20160095199A1

公开(公告)日：2016-03-31

申请号：US14500530

申请日：2014-09-29

Applicant: General Electric Company

Inventor： Shakti Singh Chauhan ,  Stuart Connolly ,  Binoy Milan Shah ,  Brian Hoden ,  Joo Han Kim

IPC: H05K1/02 ,  H05K3/36 ,  H05K3/30 ,  H05K7/20 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H05K1/181 ,  H05K3/30 ,  H05K3/368 ,  H05K7/1461 ,  H05K7/20672

Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Abstract translation: 提供电路卡组件。 组件包括第一印刷电路板，在预定位置安装在第一印刷电路板上的至少一个电子元件，耦合到第一印刷电路板的框架和耦合到框架的传热组件。 传热组件包括在第一印刷电路板的至少一部分上延伸的第一板，耦合到第一板的热管和位于至少一个电子部件和热管之间的导热部件。 导热构件基于所述至少一个电子部件的预定位置被选择性地安装在沿着第一板的预定位置处。

公开(公告)号：US09253871B2

公开(公告)日：2016-02-02

申请号：US14068697

申请日：2013-10-31

Applicant: General Electric Company

Inventor： Joo Han Kim ,  Hendrik Pieter Jacobus de Bock ,  Jay Todd Labhart ,  Shakti Singh Chauhan ,  Graham Charles Kirk ,  Stuart Connolly

IPC: H05K7/20 ,  H01S4/00 ,  F28F7/00 ,  F28D15/00 ,  H01R13/00 ,  H05K1/02 ,  H05K7/14

CPC classification number: H05K1/0203 ,  H05K7/1461 ,  H05K7/20672 ,  Y10T29/49002

Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.

Abstract translation: 提供电路卡组件。 电路卡组件包括印刷电路板，安装在印刷电路板上的至少一个电子部件和耦合到印刷电路板的框架，使得电子部件设置在印刷电路板和框架之间。 电路卡组件还包括耦合到框架的传热装置。 传热装置具有至少部分地设置在框架和印刷电路板之间的热管。 电路卡组件还包括将热管朝向电子部件偏置的可枢转支架，以便于冷却电子部件。

公开(公告)号：US09370090B2

公开(公告)日：2016-06-14

申请号：US14500530

申请日：2014-09-29

Applicant: General Electric Company

Inventor： Shakti Singh Chauhan ,  Stuart Connolly ,  Binoy Milan Shah ,  Brian Hoden ,  Joo Han Kim

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  G06F1/20

CPC classification number: H05K1/0204 ,  H05K1/181 ,  H05K3/30 ,  H05K3/368 ,  H05K7/1461 ,  H05K7/20672

Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Abstract translation: 提供电路卡组件。 组件包括第一印刷电路板，在预定位置安装在第一印刷电路板上的至少一个电子元件，耦合到第一印刷电路板的框架和耦合到框架的传热组件。 传热组件包括在第一印刷电路板的至少一部分上延伸的第一板，耦合到第一板的热管和位于至少一个电子部件和热管之间的导热部件。 导热构件基于所述至少一个电子部件的预定位置被选择性地安装在沿着第一板的预定位置处。

公开(公告)号：US20150116940A1

公开(公告)日：2015-04-30

申请号：US14068697

申请日：2013-10-31

Applicant: General Electric Company

Inventor： Joo Han Kim ,  Hendrik Pieter Jacobus de Bock ,  Jay Todd Labhart ,  Shakti Singh Chauhan ,  Graham Charles Kirk ,  Stuart Connolly

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K7/1461 ,  H05K7/20672 ,  Y10T29/49002

Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.

Abstract translation: 提供电路卡组件。 电路卡组件包括印刷电路板，安装在印刷电路板上的至少一个电子部件和耦合到印刷电路板的框架，使得电子部件设置在印刷电路板和框架之间。 电路卡组件还包括耦合到框架的传热装置。 传热装置具有至少部分地设置在框架和印刷电路板之间的热管。 电路卡组件还包括将热管朝向电子部件偏置的可枢转支架，以便于冷却电子部件。

公开(公告)号：US20130206363A1

公开(公告)日：2013-08-15

申请号：US13750078

申请日：2013-01-25

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Graham Charles Kirk ,  Stuart Connolly ,  Tao Deng ,  Zeshan Jabar Hussain ,  Binoy Milan Shah

IPC: F28F7/00 ,  B23P15/26

CPC classification number: F28F27/00 ,  B23P15/26 ,  F28D20/02 ,  F28F7/00 ,  F28F2013/008 ,  F28F2255/02 ,  H01L23/40 ,  H01L23/4275 ,  H01L23/4338 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

Abstract translation: 一种热连接器，其构造成放置在散热器和发热部件之间的散热器的凹部内，并将热量从部件传递到散热器，包括构造成装配在散热器的凹部内的散热器， 弹簧构造成位于散热器和散热器之间并且将散热器朝向和远离散热器偏置，附接到散热器和散热器并且密封凹部的柔性膜以及相变材料， 填充凹部，其中柔性膜包含相变材料，并且允许其响应于散热器朝向或远离散热器的移动而收缩或膨胀。