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公开(公告)号：US20130206363A1
公开(公告)日：2013-08-15
申请号：US13750078
申请日：2013-01-25
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Graham Charles Kirk , Stuart Connolly , Tao Deng , Zeshan Jabar Hussain , Binoy Milan Shah
CPC classification number: F28F27/00 , B23P15/26 , F28D20/02 , F28F7/00 , F28F2013/008 , F28F2255/02 , H01L23/40 , H01L23/4275 , H01L23/4338 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.
Abstract translation: 一种热连接器，其构造成放置在散热器和发热部件之间的散热器的凹部内，并将热量从部件传递到散热器，包括构造成装配在散热器的凹部内的散热器， 弹簧构造成位于散热器和散热器之间并且将散热器朝向和远离散热器偏置，附接到散热器和散热器并且密封凹部的柔性膜以及相变材料， 填充凹部，其中柔性膜包含相变材料，并且允许其响应于散热器朝向或远离散热器的移动而收缩或膨胀。
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公开(公告)号：US09826662B2
公开(公告)日：2017-11-21
申请号：US14103868
申请日：2013-12-12
Applicant: General Electric Company
Inventor： Joo Han Kim , Graham Charles Kirk , Jay Todd Labhart , Binoy Milan Shah , Yogen Vishwas Utturkar , Pramod Charmarthy , Tao Deng
IPC: H05K7/20 , F28F21/08 , C09K5/06 , H01L23/427 , H05K1/02
CPC classification number: H05K7/20454 , C09K5/063 , F28F21/08 , H01L23/4275 , H01L2924/0002 , H05K1/0203 , H05K7/20672 , H01L2924/00
Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.
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Patent Agency Ranking
公开(公告)号：US09370090B2
公开(公告)日：2016-06-14
申请号：US14500530
申请日：2014-09-29
Applicant: General Electric Company
Inventor： Shakti Singh Chauhan , Stuart Connolly , Binoy Milan Shah , Brian Hoden , Joo Han Kim
CPC classification number: H05K1/0204 , H05K1/181 , H05K3/30 , H05K3/368 , H05K7/1461 , H05K7/20672
Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.
Abstract translation: 提供电路卡组件。 组件包括第一印刷电路板，在预定位置安装在第一印刷电路板上的至少一个电子元件，耦合到第一印刷电路板的框架和耦合到框架的传热组件。 传热组件包括在第一印刷电路板的至少一部分上延伸的第一板，耦合到第一板的热管和位于至少一个电子部件和热管之间的导热部件。 导热构件基于所述至少一个电子部件的预定位置被选择性地安装在沿着第一板的预定位置处。
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公开(公告)号：US20150168087A1
公开(公告)日：2015-06-18
申请号：US14103868
申请日：2013-12-12
Applicant: General Electric Company
Inventor： Joo Han Kim , Graham Charles Kirk , Jay Todd Labhart , Binoy Milan Shah , Yogen Vishwas Utturkar , Pramod Charmarthy , Tao Deng
CPC classification number: H05K7/20454 , C09K5/063 , F28F21/08 , H01L23/4275 , H01L2924/0002 , H05K1/0203 , H05K7/20672 , H01L2924/00
Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.
Abstract translation: 提供了具有金属基泡沫和易熔金属基合金的可重复使用的相变热界面结构。 在可熔金属基合金的固相中，可熔金属基合金至少设置在金属基泡沫的一部分中。 此外，在可熔金属基合金的液相中，可熔融金属基合金至少设置在金属基泡沫的一个或多个外表面的一部分上。
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公开(公告)号：US20150060021A1
公开(公告)日：2015-03-05
申请号：US14018579
申请日：2013-09-05
Applicant: General Electric Company
Inventor： Shakti Singh Chauhan , William Harold King , Stanton Earl Weaver, JR. , Binoy Milan Shah , Tao Deng
CPC classification number: F28D15/046 , B22F7/002 , B22F7/06 , B22F2999/00 , Y10T29/49353 , B22F3/02 , B22F2202/01
Abstract: A heat transfer device includes a casing and a wick disposed within the casing. The wick includes a first sintered layer and a second sintered layer. The first sintered layer includes a plurality of first sintered particles, having a first porosity and a plurality of first pores. The first sintered layer is disposed proximate to an inner surface of the casing. The second sintered layer includes a plurality of second sintered particles, having a second porosity and a plurality of second pores. The second sintered layer is disposed on the first sintered layer. The heat transfer device includes at least one first sintered particle smaller than at least one second pore and the first porosity is smaller than the second porosity.
Abstract translation: 传热装置包括壳体和设置在壳体内的芯。 芯包括第一烧结层和第二烧结层。 第一烧结层包括具有第一孔隙和多个第一孔的多个第一烧结颗粒。 第一烧结层设置在壳体的内表面附近。 第二烧结层包括具有第二孔隙率和多个第二孔隙的多个第二烧结颗粒。 第二烧结层设置在第一烧结层上。 传热装置包括至少一个小于至少一个第二孔的第一烧结颗粒，并且第一孔隙度小于第二孔隙率。
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公开(公告)号：US10731762B2
公开(公告)日：2020-08-04
申请号：US14942168
申请日：2015-11-16
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Deepak Trivedi , Chad Eric Yates , Binoy Milan Shah
Abstract: An elastomeric sealing device operable at an operating temperature above an installation temperature. The sealing device includes a body fabricated from an elastomeric material. A channel is formed within the body. A mesh is disposed within the channel. The mesh includes a plurality of interwoven fibers forming an inner volume. A filler is disposed within the inner volume. At least a portion of the filler is a liquid at the installation temperature. The at least a portion of the filler is a gas at the operating temperature.
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公开(公告)号：US20160095199A1
公开(公告)日：2016-03-31
申请号：US14500530
申请日：2014-09-29
Applicant: General Electric Company
Inventor： Shakti Singh Chauhan , Stuart Connolly , Binoy Milan Shah , Brian Hoden , Joo Han Kim
CPC classification number: H05K1/0204 , H05K1/181 , H05K3/30 , H05K3/368 , H05K7/1461 , H05K7/20672
Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.
Abstract translation: 提供电路卡组件。 组件包括第一印刷电路板，在预定位置安装在第一印刷电路板上的至少一个电子元件，耦合到第一印刷电路板的框架和耦合到框架的传热组件。 传热组件包括在第一印刷电路板的至少一部分上延伸的第一板，耦合到第一板的热管和位于至少一个电子部件和热管之间的导热部件。 导热构件基于所述至少一个电子部件的预定位置被选择性地安装在沿着第一板的预定位置处。
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