Abstract:
A method can include forming a contact trench in a semiconductor structure so that the contact trench extends to a contact formation, the forming including using a hardmask layer, and filling the contact trench with a sacrificial material layer, the sacrificial material layer formed over the contact formation. A semiconductor structure can include a sacrificial material layer over a contact formation.
Abstract:
A nanowire device is disclosed that includes first and second nanowires, a gate structure positioned around a portion of the first and second nanowires and a phase change material surrounding at least a portion of the first nanowire in the source/drain regions of the device but not surrounding the second nanowire in the source/drain regions.
Abstract:
The present disclosure relates to semiconductor devices and manufacturing techniques in which topography-related contact failures may be reduced by providing a dielectric fill material in a late manufacturing stage. In sophisticated semiconductor devices, the material loss in the trench isolation regions may result in significant contact failures, which may be reduced by levelling the device topography, thereby tolerating a significant lateral overlap of contact elements with trench isolation regions.
Abstract:
The present disclosure relates to semiconductor devices and manufacturing techniques in which topography-related contact failures may be reduced by providing a dielectric fill material in a late manufacturing stage. In sophisticated semiconductor devices, the material loss in the trench isolation regions may result in significant contact failures, which may be reduced by levelling the device topography, thereby tolerating a significant lateral overlap of contact elements with trench isolation regions.
Abstract:
A nanowire device is disclosed that includes first and second nanowires, a gate structure positioned around a portion of the first and second nanowires and a phase change material surrounding at least a portion of the first nanowire in the source/drain regions of the device but not surrounding the second nanowire in the source/drain regions.