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公开(公告)号:US20170309560A1
公开(公告)日:2017-10-26
申请号:US15136384
申请日:2016-04-22
Applicant: GLOBALFOUNDRIES Inc.
Inventor: Guillaume BOUCHE , Jason Eugene STEPHENS , Tuhin GUHA NEOGI , Kai SUN , Deniz Elizabeth CIVAY , David Charles PRITCHARD , Andy WEI
IPC: H01L23/528 , H01L21/768 , H01L21/762 , H01L21/3213 , H01L21/311 , H01L23/522 , H01L21/033
CPC classification number: H01L23/528 , H01L21/0337 , H01L21/31111 , H01L21/31144 , H01L21/32133 , H01L21/762 , H01L21/76802 , H01L21/7684 , H01L21/76841 , H01L21/76877 , H01L23/5226
Abstract: Semiconductor devices and methods of fabricating the semiconductor devices with cross coupled contacts using patterning for cross couple pick-up are disclosed. One method includes, for instance: obtaining an intermediate semiconductor device; performing a first lithography to pattern a first shape; performing a second lithography to pattern a second shape overlapping a portion of the first shape; processing the first shape and the second shape to form an isolation region at the overlap; and forming four regions separated by the isolation region. An intermediate semiconductor device is also disclosed.
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公开(公告)号:US20200058515A1
公开(公告)日:2020-02-20
申请号:US16662091
申请日:2019-10-24
Applicant: GLOBALFOUNDRIES INC.
Inventor: Heng YANG , David C. PRITCHARD , George J. KLUTH , Anurag MITTAL , Hongru REN , Manjunatha G. PRABHU , Kai SUN , Neha NAYYAR , Lixia LEI
IPC: H01L21/308 , H01L27/12 , H01L29/66 , H01L21/84
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to devices with slotted active regions and methods of manufacture. The method includes: forming a mandrel on top of a diffusion region comprising a diffusion material; forming a first material over the mandrel and the diffusion region; removing the mandrel to form multiple spacers each having a thickness; depositing a second material over the spacers and the diffusion material; and forming slots in the diffusion region by removing a portion of the second material over the diffusion region and the underlying diffusion material.
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