MULTI-STAGE PATTERN RECOGNITION IN CIRCUIT DESIGNS

    公开(公告)号:US20180341739A1

    公开(公告)日:2018-11-29

    申请号:US15602810

    申请日:2017-05-23

    CPC classification number: G06F17/5081

    Abstract: An identification of a first area of an IC design surrounding a failure component is received; and, in response, a smaller portion of the first area is selected. The smaller portion also surrounds the failure component, is smaller than the first area, and contains less circuit components than the first area. The smaller portion is matched to other areas of the IC design to identify potentially undesirable patterns of the IC design that are the same size as the first area. Additionally, the potentially undesirable patterns are grouped into pattern categories, the pattern categories are matched to known good pattern categories, and the known good patterns are removed from the potentially undesirable patterns to leave potential failure patterns. The potential failure patterns of the IC design are then output.

    Multi-stage pattern recognition in circuit designs

    公开(公告)号:US10248754B2

    公开(公告)日:2019-04-02

    申请号:US15602810

    申请日:2017-05-23

    Abstract: An identification of a first area of an IC design surrounding a failure component is received; and, in response, a smaller portion of the first area is selected. The smaller portion also surrounds the failure component, is smaller than the first area, and contains less circuit components than the first area. The smaller portion is matched to other areas of the IC design to identify potentially undesirable patterns of the IC design that are the same size as the first area. Additionally, the potentially undesirable patterns are grouped into pattern categories, the pattern categories are matched to known good pattern categories, and the known good patterns are removed from the potentially undesirable patterns to leave potential failure patterns. The potential failure patterns of the IC design are then output.

    Method, system and program product for identifying anomalies in integrated circuit design layouts

    公开(公告)号:US10055535B2

    公开(公告)日:2018-08-21

    申请号:US15277796

    申请日:2016-09-27

    Abstract: Disclosed is a method and corresponding system and program product that includes providing integrated circuit design layout(s), deconstructing the integrated circuit design layout(s) into unit-level geometric constructs, identifying anomalies in the unit-level geometric constructs, and storing anomaly data in a database. The method further includes determining one or more feature attributes for each of the plurality of unit-level geometric constructs, annotating the unit-level geometric constructs with feature attributes, resulting in annotated unit-level geometric constructs, mapping the annotated unit-level geometric constructs in a hyperplane formed by one or more feature attributes, each of the one or more feature attributes forming a dimensional axis of the hyperplane, resulting in a mapped hyperplane, applying a first model to the mapped hyperplane, identifying the anomalies from applying the first model, and applying a second model to the mapped hyperplane to rank the anomalies for printability risk, the generated data including rank data.

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