Circuit structure and related method for radiation resistant memory cell

    公开(公告)号:US12183394B2

    公开(公告)日:2024-12-31

    申请号:US18487202

    申请日:2023-10-16

    Abstract: Embodiments of the disclosure provide a circuit structure and related method to provide a radiation resistant memory cell. A circuit structure may include a first latch having an input node and an output node. A second latch has an input node and an output node, in which the output node of the second latch is coupled to the input node of the first latch, and the input node of the second latch is coupled to the output node of the first latch. A read/write (R/W) circuit includes a plurality of transistors coupling a word line, a bit line, and an inverted bit line to at least two outputs. One of the at least two outputs is coupled to the input node of the first latch and another of the outputs is coupled to the input node of the second latch.

    INTEGRATED CIRCUIT STRUCTURE WITH MULTI-ROW CELL FOR ACCOMMODATING MIXED TRACK HEIGHT

    公开(公告)号:US20240222356A1

    公开(公告)日:2024-07-04

    申请号:US18149279

    申请日:2023-01-03

    CPC classification number: H01L27/0207

    Abstract: A multi-row standard cell and an integrated circuit (IC) structure using the standard cell are provided. The IC structure includes a plurality of cell rows extending in a first direction. At least two cell rows of the plurality of cell rows have different row heights. The IC structure includes a multi-row standard cell positioned in two or more cell rows having different row heights. At least one active region is shared by portions of the multi-row cell across the at least two cell rows. The IC structure may also include one or more asymmetric shared power rails disposed in an asymmetric manner across a row boundary between the at least two cell rows of different row heights. The multi-row standard cells and IC structures allow placement of multi-row cells for mixed track height arrangements in a manner not limited to multiples of row heights.

    CIRCUIT STRUCTURE AND RELATED METHOD FOR RADIATION RESISTANT MEMORY CELL

    公开(公告)号:US20230326520A1

    公开(公告)日:2023-10-12

    申请号:US17658189

    申请日:2022-04-06

    CPC classification number: G11C11/419 G11C11/412 H03K3/356078 H03K3/356026

    Abstract: Embodiments of the disclosure provide a circuit structure and related method to provide a radiation resistant memory cell. A circuit structure may include a first latch having an input node and an output node. A second latch has an input node and an output node, in which the output node of the second latch is coupled to the input node of the first latch, and the input node of the second latch is coupled to the output node of the first latch. A read/write (R/W) circuit includes a plurality of transistors coupling a word line, a bit line, and an inverted bit line to at least two outputs. One of the at least two outputs is coupled to the input node of the first latch and another of the outputs is coupled to the input node of the second latch.

    DEEP NWELL CONTACT STRUCTURES
    6.
    发明公开

    公开(公告)号:US20230282707A1

    公开(公告)日:2023-09-07

    申请号:US17687941

    申请日:2022-03-07

    CPC classification number: H01L29/1087 H01L27/1203 H01L29/7838

    Abstract: Integrated structures include (among other components) a deep well structure having a first impurity, well rows contacting the deep well structure and having a second impurity, a well contact ring enclosing the well rows within an enclosed area, a transistor layer on the well rows, transistors within the transistor layer, and at least one ring-enclosed contact contacting the deep well structure. The ring-enclosed contact is positioned within the enclosed area. Such structures further include a well contact connection contacting the well contact ring and the ring-enclosed contact.

    Single-rail memory circuit with row-specific voltage supply lines and boost circuits

    公开(公告)号:US11322200B1

    公开(公告)日:2022-05-03

    申请号:US17120325

    申请日:2020-12-14

    Abstract: A single-rail memory circuit includes an array of memory cells arranged in rows and columns and peripheral circuitry connected to the array for facilitating read and write operations with respect to selected memory cells. The peripheral circuitry includes, but is not limited to, boost circuits for the rows. Each boost circuit is connected to a wordline for a row and to a discrete voltage supply line for the same row. Each boost circuit for a row is configured to increase the voltage levels on the wordline and the voltage supply line for the row during a read of any selected memory cell within the row. Increasing the voltage levels on the wordline and on the voltage supply line during the read operation effectively boosts the read current. A method of operating the memory circuit reduces the probability of a read fail.

    Low clock load dynamic dual output latch circuit

    公开(公告)号:US11218137B2

    公开(公告)日:2022-01-04

    申请号:US16847807

    申请日:2020-04-14

    Abstract: The present disclosure relates to integrated circuits, and more particularly, to a low clock load dynamic dual output latch circuit and methods of operation. The structure includes: a plurality of dynamic clocked stacks which are configured to receive input data and provide a true logical value and a complement logical value; and a plurality of holding stacks which are configured to provide a hold signal to the dynamic clocked stacks and output the true logical value and the complement logical value in response to the hold signal being activated.

    Dynamic single input-dual output latch

    公开(公告)号:US11050414B1

    公开(公告)日:2021-06-29

    申请号:US16881053

    申请日:2020-05-22

    Abstract: A dynamic single input-dual output latch includes input, feedback, and output stages. In the input stage, operations are dependent on a clock signal (CLK) and a feedback signal (FB) from the feedback stage. For example, when FB is at a low voltage level and CLK switches to a high voltage level, the input stage enters a data capture mode. Once data has been captured, FB switches back to the high voltage level, placing the input stage in a data hold mode. In the output stage, operations are dependent on CLK but independent of FB. For example, instead of initiating output signal stabilization only after both CLK and FB are at high voltage levels, weak pull-down transistors (including at least one CLK-controlled pull-down transistor) are employed in the output stage to ensure output signal stabilization is initiated after data capture has begun but before FB switches to the high voltage level.

    Cell layouts
    10.
    发明授权

    公开(公告)号:US12288782B2

    公开(公告)日:2025-04-29

    申请号:US17679655

    申请日:2022-02-24

    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to cell layouts in semiconductor structures and methods of manufacture. A structure includes: a plurality of abutting cells each of which include transistors with gate structures having diffusion regions; a contact spanning across abutting cells of the plurality of abutting cells and contacting to the diffusion regions of separate cells of the abutting cells; and a continuous active region spanning across the plurality of abutting cells, wherein the continuous active region includes a drain-source abutment with L-shape construct, a source-source abutment with U-shape construct, and a drain-drain abutment with a filler cell located between a drain-drain abutment.

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