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1.发明授权公开(公告)号：US08138448B2
公开(公告)日：2012-03-20
申请号：US11967459
申请日：2007-12-31
CPC分类号： B32B37/144 , B32B38/1866 , B32B2311/24 , Y10T428/249971 , Y10T428/2982
摘要： Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
摘要翻译： 用于制造负系数热膨胀工程元件的方法，特别地，其中这些元件提供具有低或甚至潜在的零系数热膨胀的填料，并且其可用作具有高热膨胀系数的聚合物的填料。 此外，公开了通过本发明方法获得的新颖结构。
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2.发明申请公开(公告)号：US20120121906A1
公开(公告)日：2012-05-17
申请号：US13356778
申请日：2012-01-24
CPC分类号： B32B37/144 , B32B38/1866 , B32B2311/24 , Y10T428/249971 , Y10T428/2982
摘要： Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
摘要翻译： 用于制造负系数热膨胀工程元件的方法，特别地，其中这些元件提供具有低或甚至潜在的零系数热膨胀的填料，并且其可用作具有高热膨胀系数的聚合物的填料。 此外，公开了通过本发明方法获得的新颖结构。
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3.发明申请公开(公告)号：US20090169886A1
公开(公告)日：2009-07-02
申请号：US11967459
申请日：2007-12-31
CPC分类号： B32B37/144 , B32B38/1866 , B32B2311/24 , Y10T428/249971 , Y10T428/2982
摘要： Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
摘要翻译： 用于制造负系数热膨胀工程元件的方法，特别地，其中这些元件提供具有低或甚至潜在的零系数热膨胀的填料，并且其可用作具有高热膨胀系数的聚合物的填料。 此外，公开了通过本发明方法获得的新颖结构。
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4.发明授权公开(公告)号：US08624152B2
公开(公告)日：2014-01-07
申请号：US13356778
申请日：2012-01-24
CPC分类号： B32B37/144 , B32B38/1866 , B32B2311/24 , Y10T428/249971 , Y10T428/2982
摘要： Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.
摘要翻译： 用于制造负系数热膨胀工程元件的方法，特别地，其中这些元件提供具有低或甚至潜在的零系数热膨胀的填料，并且其可用作具有高热膨胀系数的聚合物的填料。 此外，公开了通过本发明方法获得的新颖结构。
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公开(公告)号：US20080180914A1
公开(公告)日：2008-07-31
申请号：US11668097
申请日：2007-01-29
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： Disclosed is an integrated active heat spreader and exchanger. The heat spreader cum exchanger includes a housing with a conductive heat spreader therein. A spreader plate of the heat spreader is in thermal contact with a microprocessor chip to be cooled and a plurality of spreader fins extending from the spreader plate. A membrane connects the heat spreader and the housing, sealing an interface between the heat spreader and the housing. A top plate, including a plurality of top plate fins, is disposed in the housing. A pump is located between the top plate fins and the spreader fins and urges fluid across the spreader fins and conducts heat from the spreader fins. The top plate fins conduct heat from the fluid and into a heat sink in thermal contact with the top plate. A heat sink plate conducts heat into heat sink fins where the heat is dissipated.
摘要翻译： 公开了一种集成的主动散热器和换热器。 散热器暨交换器包括其中具有导电散热器的壳体。 散热器的散布板与要冷却的微处理器芯片热接触，并且从扩散板延伸出多个散热片。 隔膜连接散热器和外壳，密封散热器和外壳之间的接口。 包括多个顶板翅片的顶板设置在壳体内。 泵位于顶板翅片和扩散器翅片之间，并且促使流体跨越扩散器翅片并且从扩散器翅片传导热量。 顶板翅片从流体传导热量并进入与顶板热接触的散热器。 散热片将散热片散热到散热片散热片。
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公开(公告)号：US20080159853A1
公开(公告)日：2008-07-03
申请号：US11649041
申请日：2007-01-03
IPC分类号： F01D5/08
CPC分类号： F04D25/04 , F04D29/582 , H01L23/467 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , Y10T29/49236 , H01L2224/0401
摘要： A cooling system includes a moving rotor system which in turn includes: a disk on which a plurality of heat conducting structures are distributed, the heat conducting structures having a cross section optimized for maximum surface area to footprint area; the heat conducting structures having a shape to optimize the heat transfer coefficient between the structures moving through the ambient fluid; and a mechanism for generating a mass fluid flow over the conducting structures so that the heat conducting structures are persistently cooled.
摘要翻译： 一种冷却系统，包括一个移动转子系统，该转子系统又包括一个盘，多个导热结构分布在该盘上，该导热结构具有针对最大表面积与足迹面积优化的横截面; 导热结构具有优化移动通过环境流体的结构之间的传热系数的形状; 以及用于在导电结构上产生质量流体流动使得导热结构持续冷却的机构。
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公开(公告)号：US20080116571A1
公开(公告)日：2008-05-22
申请号：US11604152
申请日：2006-11-22
申请人： Hien P. Dang , Vinod Kamath , Vijayeshwar D. Khanna , Gerard McVicker , Sri M. Sri-Jayantha , Jung H. Yoon
发明人： Hien P. Dang , Vinod Kamath , Vijayeshwar D. Khanna , Gerard McVicker , Sri M. Sri-Jayantha , Jung H. Yoon
IPC分类号： H01L23/467
CPC分类号： H01L23/4093 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.
摘要翻译： 用于直列芯片模块的弹簧状冷却结构由具有前侧和后侧的导热材料的连续片材形成，所述片材以基本上以一百八十度的角度折叠，其中长度 的结构基本上与直列芯片模块的长度相关，并且该结构的宽度比直列芯片模块的宽度宽，使得该结构适合于并且基本上围绕在线芯片模块; 在结构的左侧，右侧和底部的开口，用于容易地从线内芯片模块固定和移除结构; 顶部，其包括顶部表面，所述顶部表面设置在所述直列芯片模块的顶部上，当固定到所述在线芯片模块时，并且包括从所述直列芯片模块向外扩张的成角度的表面， 顶面 中心水平部分; 中心水平部分和多个芯片之间的间隙; 和结构的扩口底部区域。
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公开(公告)号：US07896611B2
公开(公告)日：2011-03-01
申请号：US11649041
申请日：2007-01-03
CPC分类号： F04D25/04 , F04D29/582 , H01L23/467 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , Y10T29/49236 , H01L2224/0401
摘要： A cooling system includes a moving rotor system which in turn includes: a disk on which a plurality of heat conducting structures are distributed, the heat conducting structures having a cross section optimized for maximum surface area to footprint area; the heat conducting structures having a shape to optimize the heat transfer coefficient between the structures moving through the ambient fluid; and a mechanism for generating a mass fluid flow over the conducting structures so that the heat conducting structures are persistently cooled.
摘要翻译： 一种冷却系统，包括一个移动转子系统，该转子系统又包括一个盘，多个导热结构分布在该盘上，该导热结构具有针对最大表面积与足迹面积优化的横截面; 导热结构具有优化移动通过环境流体的结构之间的传热系数的形状; 以及用于在导电结构上产生质量流体流动使得导热结构持续冷却的机构。
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公开(公告)号：US07612446B2
公开(公告)日：2009-11-03
申请号：US11604152
申请日：2006-11-22
申请人： Hien P. Dang , Vinod Kamath , Vijayeshwar D. Khanna , Gerard McVicker , Sri M. Sri-Jayantha , Jung H. Yoon
发明人： Hien P. Dang , Vinod Kamath , Vijayeshwar D. Khanna , Gerard McVicker , Sri M. Sri-Jayantha , Jung H. Yoon
CPC分类号： H01L23/4093 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.
摘要翻译： 用于直列芯片模块的弹簧状冷却结构由具有前侧和后侧的导热材料的连续片材形成，所述片材以基本上以一百八十度的角度折叠，其中长度 的结构基本上与直列芯片模块的长度相关，并且该结构的宽度比直列芯片模块的宽度宽，使得该结构适合于并且基本上围绕在线芯片模块; 在结构的左侧，右侧和底部的开口，用于容易地从线内芯片模块固定和移除结构; 顶部，其包括顶部表面，所述顶部表面设置在所述直列芯片模块的顶部上，当固定到所述在线芯片模块时，并且包括从所述直列芯片模块向外扩张的成角度的表面， 顶面 中心水平部分; 中心水平部分和多个芯片之间的间隙; 和结构的扩口底部区域。
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公开(公告)号：US20110123318A1
公开(公告)日：2011-05-26
申请号：US13015767
申请日：2011-01-28
CPC分类号： F04D25/04 , F04D29/582 , H01L23/467 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , Y10T29/49236 , H01L2224/0401
摘要： A cooling system includes a moving rotor system which in turn includes: a rotating disk on which a plurality of heat conducting structures are distributed, the heat conducting structures including an inner arrangement of spiral blades; an air flow generating fan element; and an outer arrangement of heat transfer pins distributed along a perimeter of the rotating disk, the heat transfer pins having a high aspect ratio that maximizes a surface area to footprint area; wherein the spiral blades generate a mass fluid flow of ambient fluid toward the heat transfer pins such that the heat transfer pins are persistently cooled.
摘要翻译： 一种冷却系统，包括一个移动转子系统，该转动系统又包括：分配有多个导热结构的旋转盘，该导热结构包括螺旋叶片的内部装置; 气流发生风扇元件; 以及沿着旋转盘的周边分布的传热销的外部布置，传热销具有使表面积最大化到占地面积的高纵横比; 其中所述螺旋叶片产生朝向所述传热销的周围流体的质量流体流，使得所述传热销持续冷却。
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