Surface-imaging technique for lithographic processes for device
fabrication
    1.
    发明授权
    Surface-imaging technique for lithographic processes for device fabrication 失效
    用于器件制造的光刻工艺的表面成像技术

    公开(公告)号:US5550007A

    公开(公告)日:1996-08-27

    申请号:US68485

    申请日:1993-05-28

    摘要: A surface-imaging technique for lithographic processes is disclosed. The lithographic processes are used to manufacture integrated circuit devices. An image is produced on a resist that is applied onto a substrate. The image is produced by exposing selected regions of the resist material to radiation. The selected exposed regions correspond to the image. The resist is then exposed to a silylating reagent that selectively reacts with either the exposed or the unexposed region of the resist. The silylated resist is then subjected to reactive ion etching, which forms an in situ silicon oxide etch mask over the silylated regions of the resist. The mask so formed provides etching selectivity which provides precise image transfer from the resist into the substrate.

    摘要翻译: 公开了一种用于光刻工艺的表面成像技术。 光刻工艺用于制造集成电路器件。 在施加到基板上的抗蚀剂上产生图像。 通过将抗蚀剂材料的选定区域暴露于辐射来产生图像。 所选择的曝光区域对应于图像。 然后将抗蚀剂暴露于选择性地与抗蚀剂的暴露区域或未曝光区域反应的甲硅烷基化试剂。 然后将甲硅烷基化抗蚀剂进行反应离子蚀刻,其在抗蚀剂的甲硅烷基化区域上形成原位氧化硅蚀刻掩模。 如此形成的掩模提供蚀刻选择性,其提供从抗蚀剂到基底的精确图像转移。

    Surface-imaging technique for lithographic processes for device
fabrication
    2.
    发明授权
    Surface-imaging technique for lithographic processes for device fabrication 失效
    用于器件制造的光刻工艺的表面成像技术

    公开(公告)号:US5487967A

    公开(公告)日:1996-01-30

    申请号:US390733

    申请日:1995-02-17

    摘要: A surface-imaging technique for lithographic processes is disclosed. The lithographic processes are used to manufacture integrated circuit devices. An image is produced on a resist that is applied onto a substrate. The image is produced by exposing selected regions of the resist material to radiation. The selected exposed regions correspond to the image. The resist is then exposed to a silylating reagent that selectively reacts with either the exposed or the unexposed region of the resist. The silylating reagent is combined with a cross-linking reagent. The silylated resist is then subjected to reactive ion etching, which forms an in situ silicon oxide etch mask over the silylated regions of the resist. The mask so formed provides etching selectivity which provides precise image transfer from the resist into the substrate.

    摘要翻译: 公开了一种用于光刻工艺的表面成像技术。 光刻工艺用于制造集成电路器件。 在施加到基板上的抗蚀剂上产生图像。 通过将抗蚀剂材料的选定区域暴露于辐射来产生图像。 所选择的曝光区域对应于图像。 然后将抗蚀剂暴露于选择性地与抗蚀剂的暴露区域或未曝光区域反应的甲硅烷基化试剂。 甲硅烷基化试剂与交联剂组合。 然后将甲硅烷基化抗蚀剂进行反应离子蚀刻,其在抗蚀剂的甲硅烷基化区域上形成原位氧化硅蚀刻掩模。 如此形成的掩模提供蚀刻选择性,其提供从抗蚀剂到基底的精确图像转移。

    Photoresist systems
    3.
    发明授权
    Photoresist systems 有权
    光刻胶系统

    公开(公告)号:US08012670B2

    公开(公告)日:2011-09-06

    申请号:US10412640

    申请日:2003-04-11

    IPC分类号: G03F7/20 G03F7/11

    CPC分类号: G03F7/105

    摘要: New photoresist systems are provided that comprise an underlying processing (or barrier) layer composition and an overcoated photoresist layer. Systems of the invention can exhibit significant adhesion to SiON and other inorganic surface layers.

    摘要翻译: 提供了新的光致抗蚀剂系统,其包括下面的处理(或阻挡)层组合物和外涂光致抗蚀剂层。 本发明的系统可以显示出对SiON和其它无机表面层的显着粘着。

    Polymers and photoresist compositions
    4.
    发明授权
    Polymers and photoresist compositions 失效
    聚合物和光致抗蚀剂组合物

    公开(公告)号:US06749983B1

    公开(公告)日:2004-06-15

    申请号:US09330418

    申请日:1999-06-11

    IPC分类号: G03C173

    摘要: The present invention provides novel polymers and chemically-amplified positive-acting photoresist compositions that contain such polymers as a resin binder component. Preferred polymers of the invention include one or more structural groups that are capable of reducing the temperature required for effective deprotection of acid-labile moieties of the polymer.

    摘要翻译: 本发明提供了含有树脂粘合剂成分等聚合物的新型聚合物和化学增幅正性光致抗蚀剂组合物。 本发明优选的聚合物包括能够降低聚合物酸不稳定部分有效去保护所需温度的一个或多个结构基团。

    Resist material and process for use
    5.
    发明授权
    Resist material and process for use 失效
    抵抗材料和使用过程

    公开(公告)号:US5212047A

    公开(公告)日:1993-05-18

    申请号:US837508

    申请日:1992-02-18

    IPC分类号: G03F7/039

    CPC分类号: G03F7/039

    摘要: Excellent resolution and sensitivity in the patterning of resists utilized in device and mask manufacture is obtained with a specific composition. In particular this composition involves polymers having recurring pendant acid labile .alpha.-alkoxyalkyl carboxylic acid ester moieties in the presence of an acid generator activated by actinic radiation such as UV-visible, deep ultraviolet, e-beam and x-ray radiation.

    摘要翻译: 通过具体的组成可以获得在器件和掩模制造中使用的抗蚀剂图案化方面的优异的分辨率和灵敏度。 特别地,该组合物包括在由诸如紫外可见,深紫外线,电子束和x射线辐射的光化辐射激活的酸发生器存在下具有重复的侧链酸不稳定的α-烷氧基烷基羧酸酯部分的聚合物。

    Polymers and photoresist compositions for short wavelength imaging
    6.
    发明授权
    Polymers and photoresist compositions for short wavelength imaging 失效
    用于短波长成像的聚合物和光致抗蚀剂组合物

    公开(公告)号:US6165674A

    公开(公告)日:2000-12-26

    申请号:US7617

    申请日:1998-01-15

    摘要: The present invention provides novel polymers and photoresist compositions that comprise the polymers as a resin binder component. The photoresist compositions of the invention can provide highly resolved relief images upon exposure to extremely short wavelengths, including well-resolved 0.25 micron features imaged at 193 nm. Polymers of the invention include those that comprise a photogenerated acid-labile unit that includes a cyano moiety, as well as polymers that contain cyano and itaconic anhydride moieties in combination.

    摘要翻译: 本发明提供了包含作为树脂粘合剂组分的聚合物的新型聚合物和光致抗蚀剂组合物。 本发明的光致抗蚀剂组合物可以在暴露于极短波长的情况下提供高度分辨的浮雕图像,包括在193nm下成像的良好分辨的0.25微米特征。 本发明的聚合物包括包含氰基部分的光生酸不稳定单元的聚合物,以及组合含有氰基和衣康酸酐部分的聚合物。

    X-ray resist containing poly(2,3-dichloro-1-propyl acrylate) and
poly(glycidyl methacrylate-co-ethyl acrylate)
    8.
    发明授权
    X-ray resist containing poly(2,3-dichloro-1-propyl acrylate) and poly(glycidyl methacrylate-co-ethyl acrylate) 失效
    含有聚(2,3-二氯-1-丙基丙烯酸酯)和聚(甲基丙烯酸缩水甘油酯 - 丙烯酸共聚物)的X射线抗蚀剂,

    公开(公告)号:US4225664A

    公开(公告)日:1980-09-30

    申请号:US14243

    申请日:1979-02-22

    摘要: A mixture of poly(2,3-dichloro-1-propyl acrylate) and poly(glycidyl methacrylate-co-ethyl acrylate), with the latter forming between 1 percent and 20 percent by weight, of the total polymer mixture, has been found to form an x-ray resist having adhesive and resolving properties superior to those of poly(2,3-dichloro-1-propyl acrylate) which is a good x-ray resist material. Superior properties of the mixture are attributed to the fact that the two polymers form a compatible polymer mixture which is a relatively rare and unpredictable event in polymer chemistry.

    摘要翻译: 已经发现聚(2,3-二氯-1-丙基丙烯酸丙酯)和聚(甲基丙烯酸缩水甘油酯 - 丙烯酸共聚物)的混合物,后者形成总聚合物混合物的1重量%至20重量% 以形成具有优于作为良好的x射线抗蚀剂材料的聚(2,3-二氯-1-丙基丙烯酸酯)的粘合剂和分辨性的x射线抗蚀剂。 混合物的优异性质归因于两种聚合物形成相容的聚合物混合物,这在聚合物化学中是相对罕见的和不可预知的事件。

    Photoresist compositions
    9.
    发明授权
    Photoresist compositions 有权
    光刻胶组合物

    公开(公告)号:US07220486B2

    公开(公告)日:2007-05-22

    申请号:US10377165

    申请日:2003-03-01

    摘要: New photoresists are provided that are suitable for short wavelength imaging, including sub-300 nm and sub-200 nm such as 193 nm and 157 nm. Photoresists of the invention contain a resin with photoacid-labile groups, one or more photoacid generator compounds, and an adhesion-promoting additive compound. Photoresists of the invention can exhibit significant adhesion to SiON and other inorganic surface layers.

    摘要翻译: 提供了适用于短波长成像的新型光致抗蚀剂,包括亚300nm和亚200nm,例如193nm和157nm。 本发明的光刻胶含有具有光酸不稳定基团的树脂,一种或多种光致酸发生剂化合物和粘合促进添加剂化合物。 本发明的光刻胶可以显示出对SiON和其它无机表面层的显着粘着。

    Polymers and photoresist compositions for short wavelength imaging
    10.
    发明授权
    Polymers and photoresist compositions for short wavelength imaging 有权
    用于短波长成像的聚合物和光致抗蚀剂组合物

    公开(公告)号:US06749986B2

    公开(公告)日:2004-06-15

    申请号:US09948459

    申请日:2001-09-08

    IPC分类号: G03F7004

    摘要: The present invention includes new polymers and use of such polymers as a resin component for photoresist compositions, particularly chemically-amplified positive-acting photoresist compositions. Polymers and resists of the invention are particularly useful for imaging with short wavelength radiation, such as sub-200 nm and preferably about 157 nm. Polymers of the invention contain one or more groups alpha to an acidic site that are substituted by one or more electron-withdrawing groups.

    摘要翻译: 本发明包括新的聚合物和这种聚合物作为光致抗蚀剂组合物的树脂组分,特别是化学增强的正性光致抗蚀剂组合物的用途。 本发明的聚合物和抗蚀剂对于使用短波长辐射如亚200nm,优选约157nm的成像特别有用。 本发明的聚合物含有被一个或多个吸电子基团取代的酸性位点的一个或多个基团α。