公开(公告)号：US10028392B2

公开(公告)日：2018-07-17

申请号：US15231392

申请日：2016-08-08

Applicant: General Electric Company

Inventor： John Andrew Trelford ,  William Lonzo Woods, Jr. ,  Thang Danh Truong

IPC: B05C17/06 ,  H05K3/34 ,  H05K3/12 ,  B23K3/06 ,  H05K1/11 ,  B05D1/32 ,  H05K3/40 ,  B23K1/00 ,  B23K3/08 ,  H05K1/09 ,  C23C18/06 ,  B05C17/08 ,  B41N1/24 ,  B23K101/42

Abstract: A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.

公开(公告)号：US20160345443A1

公开(公告)日：2016-11-24

申请号：US15231392

申请日：2016-08-08

Applicant: General Electric Company

Inventor： John Andrew Trelford ,  William Lonzo Woods, Jr. ,  Thang Danh Truong

IPC: H05K3/34 ,  H05K1/11 ,  B23K3/08 ,  H05K1/09 ,  B23K1/00 ,  B23K3/06 ,  H05K3/12 ,  H05K3/40

CPC classification number: H05K3/3484 ,  B05C17/06 ,  B05C17/08 ,  B05D1/32 ,  B23K1/0016 ,  B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  B41N1/247 ,  C23C18/06 ,  H05K1/09 ,  H05K1/112 ,  H05K1/115 ,  H05K3/1216 ,  H05K3/1225 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0305 ,  H05K2203/1476

Abstract: A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.

Abstract translation: 公开了一种在组件板中印刷焊膏的方法和用于进行该焊膏的模板。 在一个实施例中，该方法包括使用具有第一厚度的第一模板将焊膏印刷到部件板中的至少一个通孔中。 该方法还包括在使用第一模板之后，使用具有第二厚度的第二模板来在组件板上的至少一个表面安装部件上印刷焊膏。

公开(公告)号：US09426901B2

公开(公告)日：2016-08-23

申请号：US13650988

申请日：2012-10-12

Applicant: General Electric

Inventor： John Andrew Trelford ,  William Lonzo Woods, Jr. ,  Thang Dahn Truong

IPC: B05D1/32 ,  H05K3/10 ,  H05K3/40 ,  C23C18/06 ,  H05K1/11 ,  H05K3/12

CPC classification number: H05K3/3484 ,  B05C17/06 ,  B05C17/08 ,  B05D1/32 ,  B23K1/0016 ,  B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  B41N1/247 ,  C23C18/06 ,  H05K1/09 ,  H05K1/112 ,  H05K1/115 ,  H05K3/1216 ,  H05K3/1225 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0305 ,  H05K2203/1476

Abstract: A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil.

Abstract translation: 公开了一种在组件板中印刷焊膏的方法和用于进行该焊膏的模板。 在一个实施例中，该方法包括使用具有第一厚度的第一模板将焊膏印刷到部件板中的至少一个通孔中。 该方法还包括在使用第一模板之后，使用具有第二厚度的第二模板来在组件板上的至少一个表面安装部件上印刷焊膏。