公开(公告)号：US20160155693A1

公开(公告)日：2016-06-02

申请号：US14556258

申请日：2014-12-01

Applicant: General Electric Company

Inventor： Scott Smith ,  Christopher James Kapusta ,  Glenn Alan Forman ,  Eric Patrick Davis

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/288 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/49827 ,  H01L21/2885 ,  H01L21/486 ,  H01L22/12 ,  H01L22/14 ,  H01L22/22 ,  H01L23/49838 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82106 ,  H01L2224/82138 ,  H01L2224/83129 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/82

Abstract: An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer and a conformal masking layer disposed on at least a portion of the dielectric layer. The electronic package further includes a routing layer disposed on at least a portion of the masking layer and a micro-via disposed at least in part in the conformal masking layer and the routing layer. Further, at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via. Also, the conformal masking layer is configured to define a size of the micro-via. The electronic package further includes a semiconductor die operatively coupled to the micro-via.

Abstract translation: 一种电子封装及其制造方法。 电子封装包括介电层和设置在电介质层的至少一部分上的保形掩模层。 电子封装还包括设置在掩模层的至少一部分上的布线层和至少部分地设置在保形掩模层和布线层中的微通孔。 此外，路由层的至少一部分在微通孔的至少一部分中形成共形导电层。 此外，共形掩模层被配置为限定微通孔的尺寸。 电子封装还包括可操作地耦合到微通孔的半导体管芯。

公开(公告)号：US09666516B2

公开(公告)日：2017-05-30

申请号：US14556258

申请日：2014-12-01

Applicant: General Electric Company

Inventor： Scott Smith ,  Christopher James Kapusta ,  Glenn Alan Forman ,  Eric Patrick Davis

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L21/48 ,  H01L21/288 ,  H01L21/66

CPC classification number: H01L23/49827 ,  H01L21/2885 ,  H01L21/486 ,  H01L22/12 ,  H01L22/14 ,  H01L22/22 ,  H01L23/49838 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82106 ,  H01L2224/82138 ,  H01L2224/83129 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/82

Abstract: An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer and a conformal masking layer disposed on at least a portion of the dielectric layer. The electronic package further includes a routing layer disposed on at least a portion of the masking layer and a micro-via disposed at least in part in the conformal masking layer and the routing layer. Further, at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via. Also, the conformal masking layer is configured to define a size of the micro-via. The electronic package further includes a semiconductor die operatively coupled to the micro-via.