Light-sensitive composition for use as a soldermask and process
    1.
    发明授权
    Light-sensitive composition for use as a soldermask and process 失效
    用作焊接掩模和工艺的光敏组合物

    公开(公告)号:US5206116A

    公开(公告)日:1993-04-27

    申请号:US663604

    申请日:1991-03-04

    IPC分类号: G03F7/038 H05K3/28

    摘要: A light sensitive composition and process for using said composition. The light sensitive composition comprises a phenolic resin, a multifunctional epoxy or vinyl compound, a photoinitiator and a thermal crosslinking agent. The process for using the same comprises application of the light sensitive composition to a substrate, drying of the same, exposing the dried coating to activating radiation, partially heat curing the coating, developing the coating and thermally curing the developed image. The composition is especially useful as a solder mask.

    摘要翻译: 光敏组合物和使用所述组合物的方法。 光敏组合物包含酚醛树脂,多官能环氧或乙烯基化合物,光引发剂和热交联剂。 使用该方法的方法包括将光敏组合物施用于基材,干燥基材,将干燥的涂料暴露于活化辐射,部分热固化涂层,显影涂层和热固化显影图像。 该组合物作为阻焊剂特别有用。

    Light-sensitive composition and process
    3.
    发明授权
    Light-sensitive composition and process 失效
    光敏组合物和工艺

    公开(公告)号:US5397685A

    公开(公告)日:1995-03-14

    申请号:US157312

    申请日:1993-11-26

    IPC分类号: G03F7/038 H05K3/28 G03C5/00

    摘要: A photoimageable composition and process for use of the same. The composition comprises a binder that is a mixture of a phenolic resin and a multifunctional epoxy or vinyl compound and a curing system comprising a photoactive compound capable of generating a curing catalyst capable of crosslinking the binder components. The process for use of the composition comprises application of the composition to a substrate, drying of the same, exposing the dried coating to activating radiation, curing the binder in light exposed areas, developing the coating and thermally curing the developed image. The composition is especially useful as a solder mask.

    摘要翻译: 一种可光成像的组合物及其使用方法。 该组合物包含作为酚醛树脂和多官能环氧基或乙烯基化合物的混合物的粘合剂和包含能够产生能够交联粘合剂组分的固化催化剂的光活性化合物的固化体系。 使用该组合物的方法包括将组合物施用于基材,干燥该组合物,使干燥的涂层暴露于活化辐射,固化曝光区域中的粘合剂,显影涂层和热固化显影图像。 该组合物作为阻焊剂特别有用。

    Method of applying photoresist by screening in the formation of printed
circuits
    4.
    发明授权
    Method of applying photoresist by screening in the formation of printed circuits 失效
    通过在形成印刷电路中进行筛选来施加光致抗蚀剂的方法

    公开(公告)号:US4376815A

    公开(公告)日:1983-03-15

    申请号:US87223

    申请日:1979-10-22

    摘要: This invention is directed to processes for using a light sensitive photoresist material in the manufacture of an article having a surface permanently modified in an image pattern. The process comprises applying the photoresist to a substrate through a screen, preferably as a continuous, incompletely imaged layer and thereafter, imaging and developing to provide a relief image in the photoresist layer and treating the substrate to provide a permanent image in the finished article. The process is particularly useful in the manufacture of printed circuits. The process is believed to be a departure from conventional processes in the step of screening a light sensitive photoresist material over a substrate.

    摘要翻译: 本发明涉及在制造具有以图像图案永久修改的表面的制品时使用光敏光致抗蚀剂材料的方法。 该方法包括通过筛网将光致抗蚀剂施加到基底上,优选地作为连续不完全成像的层,然后进行成像和显影以在光致抗蚀剂层中提供浮雕图像并处理基底以在成品中提供永久图像。 该方法在印刷电路的制造中特别有用。 据信这种方法是在衬底上筛选光敏光刻胶材料的步骤中的常规方法的偏离。

    Positive acting photoresist comprising diazide ester, novolak resin and
rosin
    6.
    发明授权
    Positive acting photoresist comprising diazide ester, novolak resin and rosin 失效
    包含二叠氮酯,酚醛清漆树脂和松香的正性光致抗蚀剂

    公开(公告)号:US4148654A

    公开(公告)日:1979-04-10

    申请号:US707672

    申请日:1976-07-22

    申请人: Michael J. Oddi

    发明人: Michael J. Oddi

    CPC分类号: G03F7/0233 Y10S430/106

    摘要: Rosinous material is added to photoresist compositions to improve flexiblity, rheology and other physical properties. The rosinous material may be a rosin or a hydrogenated, esterified or neutralized derivative of a rosin. Particular advantages are achieved when the photoresists also contain a polyvinyl alkyl ether.

    摘要翻译: 将松香材料加入到光致抗蚀剂组合物中以提高柔韧性,流变性和其它物理性能。 松香物质可以是松香或氢化,酯化或中和的松香衍生物。 当光致抗蚀剂还含有聚乙烯基烷基醚时,可以实现特别的优点。