Time-distributed ECC scrubbing to correct memory errors
    1.
    发明授权
    Time-distributed ECC scrubbing to correct memory errors 失效
    时间分配的ECC擦除来纠正内存错误

    公开(公告)号:US5978952A

    公开(公告)日:1999-11-02

    申请号:US777252

    申请日:1996-12-31

    摘要: Error correction circuitry attempts to detect and correct on the fly erroneous words within random access memory (RAM) within a computer system. RAM errors are scrubbed or corrected back in the memory without delaying the memory access cycle. Rather, the address of the section or row of RAM that contains the correctable error is latched for later used by an interrupt-driven firmware memory-error scrub routine. This routine reads and rewrites each word within the indicated memory section--the erroneous word is read, corrected on-the-fly as it is read, and then rewritten back into memory correctly. If the size of the memory section exceeds a predetermined threshold, then the process of reading and re-writing that section is divided into smaller sub-processes that are distributed in time using a delayed interrupt mechanism. Duration of each memory scrubbing subprocess is kept short enough that the response time of the computer system is not impaired with the housekeeping task of scrubbing RAM memory errors. System management interrupts and firmware may be used to implement the memory-error scrub routine, which makes it independent of and transparent to the various operating systems that may be run on the computer system.

    摘要翻译: 误差校正电路尝试检测并校正计算机系统内随机存取存储器(RAM)内的错误字。 RAM错误被擦除或校正回内存,而不会延迟内存访问周期。 相反,包含可纠正错误的部分或一行RAM的地址被锁存,供以后由中断驱动的固件内存错误擦除例程使用。 该例程读取并重写所指示的存储器部分中的每个单词 - 读取该错误的单词,在读取时在其上进行正确校正,然后将其重写回存储器。 如果存储器部分的大小超过预定阈值,则将该部分的读取和重写的处理分成使用延迟的中断机制在时间上分布的更小的子进程。 每个内存清理子进程的持续时间保持足够短,以免在擦除RAM内存错误的内务任务时计算机系统的响应时间不会受损。 可以使用系统管理中断和固件来实现内存错误擦除例程,这使其独立于可能在计算机系统上运行的各种操作系统的透明度。

    Packetized Interface For Coupling Agents
    4.
    发明申请
    Packetized Interface For Coupling Agents 审中-公开
    耦合代理的分组接口

    公开(公告)号:US20140307748A1

    公开(公告)日:2014-10-16

    申请号:US14310164

    申请日:2014-06-20

    IPC分类号: H04L29/06

    摘要: In one embodiment, the present invention includes a fabric on a first semiconductor die to communicate with at least one agent on the die according to an on-chip protocol and a packetization layer coupled to the fabric to receive command and data information from the fabric on multiple links and to packetize the information into a packet for transmission from the die to another die via an in-package packetized link. Other embodiments are described and claimed.

    摘要翻译: 在一个实施例中,本发明包括在第一半导体管芯上的结构,以根据片上协议与管芯上的至少一个代理进行通信,以及耦合到该结构的分组层,以从该结构接收命令和数据信息 多个链路并且将信息分组成分组,以经由内部分组化链路从芯片传输到另一个管芯。 描述和要求保护其他实施例。