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    In vitro model for priocidal activity
    5.
    发明申请
    In vitro model for priocidal activity 审中-公开
    亲子活动的体外模型

    公开(公告)号：US20060263821A1

    公开(公告)日：2006-11-23

    申请号：US11491814

    申请日：2006-07-24

    申请人： Kathleen Antloga ,  Gerald McDonnell

    发明人： Kathleen Antloga ,  Gerald McDonnell

    IPC分类号： C12Q1/70 ,  C12Q1/68

    CPC分类号： A61L2/186 ,  A61K31/327 ,  A61L2/0082 ,  A61L2/0088 ,  A61L2/14 ,  A61L2/208 ,  A61L2/28 ,  A61L2202/17 ,  A61L2202/24 ,  C11D3/3947 ,  C11D11/0023

    摘要： A proteinaceous material has been found to show similar activity and treatment response to that of disease causing prions, such as CJD. A prion model which incorporates the proteinaceous material has a variety of applications. The model has an ability to be cultured either in vivo or in vitro, allowing rapid screening of potential drugs for treating animals or humans, or methods of treating food products or items which may come into contact with prions, such as medical or dental devices. Several treatment methods and materials have been developed using the model.

    摘要翻译： 已经发现蛋白质材料显示与引起朊病毒的疾病相似的活性和治疗反应，例如CJD。 结合蛋白质材料的朊病毒模型具有多种应用。 该模型具有在体内或体外培养的能力，允许对用于治疗动物或人的潜在药物的快速筛选，或处理可能与朊病毒例如医疗或牙科装置接触的食品或物品的方法。 已经使用该模型开发了几种处理方法和材料。

    System and methods for cooling electronic equipment
    7.
    发明授权
    System and methods for cooling electronic equipment 有权
    冷却电子设备的系统和方法

    公开(公告)号：US09119326B2

    公开(公告)日：2015-08-25

    申请号：US13821623

    申请日：2012-05-14

    申请人： Gerald McDonnell ,  Earl Keisling ,  John Costakis

    发明人： Gerald McDonnell ,  Earl Keisling ,  John Costakis

    IPC分类号： H05K7/20 ,  F25B31/00

    CPC分类号： H05K7/20381 ,  F25B31/006 ,  F25B2600/021 ,  H05K7/2029 ,  H05K7/20327 ,  H05K7/20745 ,  H05K7/20827 ,  Y02B30/741 ,  Y10T29/49359

    摘要： Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid circuit that cools electronic equipment using a first fluid flowing therethrough and a second fluid circuit that free cools a second fluid flowing therethrough. The second fluid circuit cools the first fluid using the free-cooled second fluid. The system further includes a third fluid circuit that mechanically cools the second fluid using a third fluid flowing therethrough as a function of the wet bulb temperature of atmospheric air. The third fluid circuit includes at least one compressor compresses the third fluid and is driven by a motor coupled to the variable frequency drive. At least a portion of the first fluid flowing through the third fluid circuit is diverted to cool the inverter of the variable frequency drive.

    摘要翻译： 公开了用于冷却驱动电子设备的冷却系统中的压缩机的变频驱动器的逆变器的系统和方法。 该系统包括使用流过其中的第一流体冷却电子设备的第一流体回路，以及第二流体回路，其自由地冷却流过其中的第二流体。 第二流体回路使用自由冷却的第二流体冷却第一流体。 该系统还包括第三流体回路，其使用流过其中的第三流体作为大气空气的湿球温度的函数机械地冷却第二流体。 第三流体回路包括至少一个压缩机压缩第三流体并由耦合到变频驱动器的马达驱动。 流过第三流体回路的第一流体的至少一部分被转向以冷却变频驱动器的逆变器。

    SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS
    9.
    发明申请
    SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS 有权
    节省空间的高密度模块化数据系统和能源效率冷却系统

    公开(公告)号：US20120127657A1

    公开(公告)日：2012-05-24

    申请号：US13338987

    申请日：2011-12-28

    申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

    发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

    摘要： A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.

    摘要翻译： 公开了一种节省空间的高密度模块化数据中心和用于模块化数据中心的节能冷却系统。 模块化数据中心包括包括主冷却装置和多个模块化数据盒的第一冷却回路。 每个模块化数据盒包括多个服务器，耦合到第一冷却回路的热交换构件和耦合到热交换构件并被配置为冷却多个服务器的第二冷却回路，第二冷却回路包括配置的第二冷却装置 以冷却流过第二冷却回路的流体。 每个模块化数据盒还包括包含分布式机械冷却系统的至少一部分的辅助机箱，其被配置为修剪由中央自由冷却系统执行的冷却。

    SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS
    10.
    发明申请
    SPACE-SAVING HIGH-DENSITY MODULAR DATA POD SYSTEMS AND ENERGY-EFFICIENT COOLING SYSTEMS 有权
    节省空间的高密度模块化数据系统和能源效率冷却系统

    公开(公告)号：US20120127653A1

    公开(公告)日：2012-05-24

    申请号：US13339091

    申请日：2011-12-28

    申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

    发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

    摘要： A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system.

    摘要翻译： 公开了一种部署节省空间的高密度模块化数据盒的方法。 该方法包括安装彼此靠近的多个模块化数据盒，每个数据盒包括与模块化数据盒流体和电气通信的流体和电路部分; 以及将多个流体和电路部分彼此串联联接以形成具有第一端和第二端的流体和电路。 模块化数据中心包括耦合到中央冷却流体回路的中央冷却装置。 中央冷却装置支持模块化数据盒链的至少一部分冷却要求。 相邻的公共流体和电路部分形成连接到中央冷却系统的公共流体和电路。