公开(公告)号：US20130047653A1

公开(公告)日：2013-02-28

申请号：US13662636

申请日：2012-10-29

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： F25B49/02 ,  G05D23/00 ,  F25B1/00

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

摘要翻译： 公开了一种节省空间的高密度模块化数据盒系统和节能冷却系统。 模块化数据盒系统包括中央自由冷却系统和多个模块化数据盒，每个模块化数据盒包括耦合到中央自由冷却系统的热交换组件和耦合到热交换组件的分布式机械冷却系统。 模块化数据盒包括具有布置成多边形形状的至少五个壁的数据外壳，以圆形或U形图案布置的多个计算机机架以及用于产生热和冷通道的盖子，以及空气循环器 配置为在热通道和冷通道之间连续循环空气。 每个模块化数据盒还包括一个包含公共流体和电路部分的辅助外壳，其配置成连接到相邻的公共流体和电路部分，以形成连接到中央自由冷却系统的公共流体和电路。 辅助外壳包含分布式机械冷却系统的至少一部分，其被配置为修剪由中央自由冷却系统执行的冷却。

公开(公告)号：US08297067B2

公开(公告)日：2012-10-30

申请号：US13339044

申请日：2011-12-28

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： F25B49/00 ,  F25D17/00

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system for cooling electronic equipment and method of cooling are disclosed. The cooling system includes a free-cooling system cooling a first fluid in thermal communication with the electronic equipment using atmospheric air and a mechanical sub-cooling system coupled to the free-cooling system. The mechanical system cools a second fluid flowing in the free-cooling system as a function of an amount by which the free-cooling system has exceeded its maximum cooling capacity. The method of cooling includes using a first fluid, enabling heat transfer from the first fluid to a second fluid that has been cooled using atmospheric air, and mechanically cooling the second fluid to the extent that free cooling the first fluid is insufficient to cool the first fluid. The cooling system operates by the wet bulb temperature exceeding a first predetermined wet bulb temperature.

摘要翻译： 公开了一种节省空间的高密度模块化数据盒系统和用于冷却电子设备和冷却方法的节能冷却系统。 该冷却系统包括一个自由冷却系统，该冷却系统使用大气进行冷却与电子设备热连通的第一流体，以及与自由冷却系统连接的机械子冷却系统。 机械系统冷却在自由冷却系统中流动的第二流体作为自由冷却系统超过其最大冷却能力的量的函数。 冷却方法包括使用第一流体，使得能够从第一流体到已经使用大气空气冷却的第二流体的热传递，以及将第二流体机械冷却到第一流体的自由冷却不足以冷却第一流体 流体。 冷却系统通过湿球温度超过第一预定湿球温度来操作。

公开(公告)号：US09763366B2

公开(公告)日：2017-09-12

申请号：US13338939

申请日：2011-12-28

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： H05K7/20 ,  H01L23/473 ,  F28D15/00 ,  H01L23/34 ,  F25D17/00 ,  F25B49/00 ,  G06F1/20

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

公开(公告)号：US08305757B2

公开(公告)日：2012-11-06

申请号：US13339091

申请日：2011-12-28

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： H05K7/20

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system.

摘要翻译： 公开了一种部署节省空间的高密度模块化数据盒的方法。 该方法包括安装彼此靠近的多个模块化数据盒，每个数据盒包括与模块化数据盒流体和电气通信的流体和电路部分; 以及将多个流体和电路部分彼此串联联接以形成具有第一端和第二端的流体和电路。 模块化数据中心包括耦合到中央冷却流体回路的中央冷却装置。 中央冷却装置支持模块化数据盒链的至少一部分冷却要求。 相邻的公共流体和电路部分形成连接到中央冷却系统的公共流体和电路。

公开(公告)号：US08254124B2

公开(公告)日：2012-08-28

申请号：US13338987

申请日：2011-12-28

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： H05K7/20

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.

摘要翻译： 公开了一种节省空间的高密度模块化数据中心和用于模块化数据中心的节能冷却系统。 模块化数据中心包括包括主冷却装置和多个模块化数据盒的第一冷却回路。 每个模块化数据盒包括多个服务器，耦合到第一冷却电路的热交换构件和耦合到热交换构件并被配置为冷却多个服务器的第二冷却回路，第二冷却回路包括配置 以冷却流过第二冷却回路的流体。 每个模块化数据盒还包括包含分布式机械冷却系统的至少一部分的辅助机箱，其被配置为修剪由中央自由冷却系统执行的冷却。

公开(公告)号：US08601827B2

公开(公告)日：2013-12-10

申请号：US13662636

申请日：2012-10-29

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： F25B49/00 ,  F25D17/00

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

摘要翻译： 公开了一种节省空间的高密度模块化数据盒系统和节能冷却系统。 模块化数据盒系统包括中央自由冷却系统和多个模块化数据盒，每个模块化数据盒包括耦合到中央自由冷却系统的热交换组件和耦合到热交换组件的分布式机械冷却系统。 模块化数据盒包括具有布置成多边形形状的至少五个壁的数据外壳，以圆形或U形图案布置的多个计算机机架以及用于产生热和冷通道的盖子，以及空气循环器 配置为在热通道和冷通道之间连续循环空气。 每个模块化数据盒还包括一个包含公共流体和电路部分的辅助外壳，其配置成连接到相邻的公共流体和电路部分，以形成连接到中央自由冷却系统的公共流体和电路。 辅助外壳包含分布式机械冷却系统的至少一部分，其被配置为修剪由中央自由冷却系统执行的冷却。

公开(公告)号：US20120279684A1

公开(公告)日：2012-11-08

申请号：US13517089

申请日：2011-07-13

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： G06F1/20 ,  F25B39/02 ,  H05K7/20

CPC分类号： H05K7/20818 ,  F28D1/0477 ,  F28D1/05383 ,  F28D2021/0028 ,  F28D2021/0068 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20827

摘要： A system for cooling electronic equipment includes first and second heat exchangers and a condenser. The first exchanger is disposed in an airflow in thermal communication with electronic equipment and is configured to receive a cooling fluid at a first temperature. The first exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a second temperature. The second exchanger is disposed in the airflow between the first exchanger and the electronic equipment and is configured to receive the cooling fluid at the second temperature. The second exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a third temperature. The condenser is configured to receive the cooling fluid at the third temperature and is configured to enable heat transfer from the cooling fluid to a cooling source to cool the cooling fluid to the first temperature.

摘要翻译： 一种用于冷却电子设备的系统包括第一和第二热交换器和冷凝器。 第一交换器设置在与电子设备热连通的气流中，并且被配置为在第一温度下接收冷却流体。 第一交换器允许从气流到冷却流体的热传递，以将冷却流体加热到第二温度。 第二交换器设置在第一交换器和电子设备之间的气流中，并且被配置为在第二温度下接收冷却流体。 第二交换器使得能够从气流到冷却流体的热传递，以将冷却流体加热到第三温度。 冷凝器被配置为在第三温度下接收冷却流体，并且被配置为使得能够从冷却流体到冷却源的热传递以将冷却流体冷却至第一温度。

公开(公告)号：US20120133256A1

公开(公告)日：2012-05-31

申请号：US13338939

申请日：2011-12-28

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

发明人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC分类号： H05K7/20 ,  H05K5/02

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

摘要翻译： 公开了一种节省空间的高密度模块化数据盒和冷却多个计算机机架的方法。 所述模块化数据盒包括一个外壳，其包括沿多边形形状的每个壁构件的至少一个边缘和数据盒盖构件彼此连续地连接的壁构件。 布置在外壳内的计算机机架形成在壁构件的内表面和计算机机架的第一侧之间的第一容积。 第二容积由计算机机架的第二面形成。 计算机机架覆盖构件包围第二容积，并且数据盒盖构件形成将第一容积耦合到第二容积的第三容积。 空气循环器使空气连续地循环通过第一，第二和第三容积。 该方法包括经由第三体积和计算机机架在第一和第二体积之间循环空气。

公开(公告)号：US09119326B2

公开(公告)日：2015-08-25

申请号：US13821623

申请日：2012-05-14

申请人： Gerald McDonnell ,  Earl Keisling ,  John Costakis

发明人： Gerald McDonnell ,  Earl Keisling ,  John Costakis

IPC分类号： H05K7/20 ,  F25B31/00

CPC分类号： H05K7/20381 ,  F25B31/006 ,  F25B2600/021 ,  H05K7/2029 ,  H05K7/20327 ,  H05K7/20745 ,  H05K7/20827 ,  Y02B30/741 ,  Y10T29/49359

摘要： Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid circuit that cools electronic equipment using a first fluid flowing therethrough and a second fluid circuit that free cools a second fluid flowing therethrough. The second fluid circuit cools the first fluid using the free-cooled second fluid. The system further includes a third fluid circuit that mechanically cools the second fluid using a third fluid flowing therethrough as a function of the wet bulb temperature of atmospheric air. The third fluid circuit includes at least one compressor compresses the third fluid and is driven by a motor coupled to the variable frequency drive. At least a portion of the first fluid flowing through the third fluid circuit is diverted to cool the inverter of the variable frequency drive.

摘要翻译： 公开了用于冷却驱动电子设备的冷却系统中的压缩机的变频驱动器的逆变器的系统和方法。 该系统包括使用流过其中的第一流体冷却电子设备的第一流体回路，以及第二流体回路，其自由地冷却流过其中的第二流体。 第二流体回路使用自由冷却的第二流体冷却第一流体。 该系统还包括第三流体回路，其使用流过其中的第三流体作为大气空气的湿球温度的函数机械地冷却第二流体。 第三流体回路包括至少一个压缩机压缩第三流体并由耦合到变频驱动器的马达驱动。 流过第三流体回路的第一流体的至少一部分被转向以冷却变频驱动器的逆变器。

公开(公告)号：USD686999S1

公开(公告)日：2013-07-30

申请号：US29414697

申请日：2012-03-02

申请人： Earl Keisling ,  John Costakis ,  Gerald McDonnell

设计人： Earl Keisling ,  John Costakis ,  Gerald McDonnell