摘要:
The high resistance lead layers of a read head extend straight back into the head from each of the first and second edges of the read sensor. This lessens the length of each of the high resistance lead layers so that they do not have to be made thicker to satisfy resistance requirements. Accordingly, a lateral width of each high resistance lead portion along the ABS and a thickness thereof are chosen so as to minimize the thickness while yet satisfying the resistance requirements. Further, a method of making the first and second lead layers is provided that minimizes the thickness of the high resistance lead layers. Instead of constructing the high resistance lead layers first, the present method constructs the high resistance lead layers last so that the high resistance lead layers are not altered by subsequent processing steps.
摘要:
The present invention extends the high resistance lead layers of a read head straight back into the head from each of the first and second edges of the read sensor. This lessens the length of each of the high resistance lead layers so that they do not have to be made thicker to satisfy resistance requirements. Accordingly, a lateral width of each high resistance lead portion along the ABS and a thickness thereof are chosen so as to minimize the thickness while yet satisfying the resistance requirements. Further, a method of making the first and second lead layers is provided that minimizes the thickness of the high resistance lead layers. Instead of constructing the high resistance lead layers first, the present method constructs the high resistance lead layers after defining a stripe height of the read sensor so that the lateral expanse of the high resistance lead layers is not altered by ion milling, which ion milling increases the resistance of the high resistance lead layers.
摘要:
The present invention extends the high resistance lead layers of a read head straight back into the head from each of the first and second edges of the read sensor. This lessens the length of each of the high resistance lead layers so that they do not have to be made thicker to satisfy resistance requirements. Accordingly, a lateral width of each high resistance lead portion along the ABS and a thickness thereof are chosen so as to minimize the thickness while yet satisfying the resistance requirements. Further, a method of making the first and second lead layers is provided that minimizes the thickness of the high resistance lead layers. Instead of constructing the high resistance lead layers first, the present method constructs the high resistance lead layers after defining a stripe height of the read sensor so that the lateral expanse of the high resistance lead layers is not altered by ion milling, which ion milling increases the resistance of the high resistance lead layers.
摘要:
The present invention extends the high resistance lead layers of a read head straight back into the head from each of the first and second edges of the read sensor. This lessens the length of each of the high resistance lead layers so that they do not have to be made thicker to satisfy resistance requirements. Accordingly, a lateral width of each high resistance lead portion along the ABS and a thickness thereof are chosen so as to minimize the thickness while yet satisfying the resistance requirements. Further, a method of making the first and second lead layers is provided that minimizes the thickness of the high resistance lead layers. Instead of constructing the high resistance lead layers first, the present method constructs the high resistance lead layers last so that the high resistance lead layers are not altered by subsequent processing steps.
摘要:
A dual current-perpendicular-to-plane scissor sensor according to one embodiment includes a middle free layer; two outer free layers positioned on opposite sides of the middle free layer; spacer layers between the middle free layer and each of the outer free layers; and a hard bias layer positioned behind the free layers relative to a media-facing surface of the sensor, wherein the free layers are about magnetostatically balanced.
摘要:
An inductive write head has a pole tip region between an air bearing surface (ABS) and a flare point, and a yoke region located between the flare point and a back gap. The write head includes first and second pole piece layers, wherein the second pole piece layer has first and second components. The first component extends from an ABS end, which is located at the ABS, to a recessed end which is located in the yoke region. The second component extends from a recessed end, which is spaced from the ABS, to the back gap. The second component interfaces with the first component in a stitched region so that the first component defines a pole tip in the pole tip region and the second component defines a yoke in the yoke region. A first insulation layer extends from a recessed end, which is spaced from the ABS, into the yoke region. The recessed end of the first insulation layer defines a zero throat height. The first component is sandwiched between the first insulation layer and the second component. The pole tip of the first component can be formed with well-defined side walls during a photoresist step since a flared portion of the second pole piece is located in a planar region of the first insulation layer. With this arrangement, reflective notching into the second pole piece region is avoided. Secondly, a large pedestal formed by the second pole piece provides a large region to stitch the yoke. Due to the large real estate available to stitch the yoke, its forward placement can be recessed from the ABS.
摘要:
An inductive write head has a pole tip region between an air bearing surface (ABS) and a flare point, and a yoke region located between the flare point and a back gap. The write head includes first and second pole piece layers, wherein the second pole piece layer has first and second components. The first component extends from an ABS end, which is located at the ABS, to a recessed end which is located in the yoke region. The second component extends from a recessed end, which is spaced from the ABS, to the back gap. The second component interfaces with the first component in a stitched region so that the first component defines a pole tip in the pole tip region and the second component defines a yoke in the yoke region. A first insulation layer extends from a recessed end, which is spaced from the ABS, into the yoke region. The recessed end of the first insulation layer defines a zero throat height. The first component is sandwiched between the first insulation layer and the second component. The pole tip of the first component can be formed with well-defined side walls during a photoresist step since a flared portion of the second pole piece is located in a planar region of the first insulation layer. With this arrangement, reflective notching into the second pole piece region is avoided. Secondly, a large pedestal formed by the second pole piece provides a large region to stitch the yoke. Due to the large real estate available to stitch the yoke, its forward placement can be recessed from the ABS.
摘要:
A method for fabricating a thin film component according to one embodiment comprises forming a wafer having a thin film layer, a release layer, and a patterned layer of photoresist; transferring the pattern of the layer of photoresist to the release layer and the thin film layer; adding a layer of metal to the wafer; heating the wafer to a predetermined temperature for a period of time sufficient to cause deformation of the photoresist to an extent that the photoresist creates cracks in the metal layer; applying a solvent to dissolve at least a portion of the release layer, the solvent penetrating the cracks in the metal layer to reach the release layer; and removing the release layer and any portions of the layers above the release layer.
摘要:
A method for fabricating a thin film component includes forming a wafer having a thin film layer, a release layer, and a patterned layer of photoresist. The pattern of the layer of photoresist is transferred to the release layer and the thin film layer. A layer of metal is added to the wafer. The wafer is heated to a temperature above a glass transition temperature of the photoresist for a period of time sufficient to cause deformation of the photoresist to an extent that the photoresist creates cracks in the metal layer. A solvent is applied to the wafer to dissolve the release layer, the solvent penetrating the cracks in the metal layer to reach the release layer. The release layer and any material above the release layer are removed.
摘要:
An orthogonal spin valve read head is provided wherein a spin valve sensor is asymmetrically located between first and second shield layers so that image currents in the first and second shield layers produce a resultant image field which partially or completely counterbalances a stiffening field from antiferromagnetic, pinned and spacer layers in the MR sensor when sense current is conducted therethrough. Accordingly, the spin valve sensor may be located a greater distance from the second shield layer by providing a mid-gap layer between the spin valve sensor and a second gap layer. In one example, the total thickness of the mid-gap and second gap layer is four times as thick as the first gap layer which results in the image fields from the first and second shield layers completely counterbalancing the field from the antiferromagnetic, pinned and spacer layers due to the sense current.