公开(公告)号：US5536906A

公开(公告)日：1996-07-16

申请号：US097336

申请日：1993-07-23

申请人： Glen R. Haas, Jr. ,  John E. Barnett, Jr. ,  Stephen R. Nelson ,  Douglas J. Darrow ,  Susan V. Bagen ,  Henry Breit ,  James Forster

发明人： Glen R. Haas, Jr. ,  John E. Barnett, Jr. ,  Stephen R. Nelson ,  Douglas J. Darrow ,  Susan V. Bagen ,  Henry Breit ,  James Forster

IPC分类号： H01L23/433 ,  H01L23/495 ,  H01L23/66 ,  H01L23/02

CPC分类号： H01L24/49 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/66 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111

摘要： In one form of the invention, a package for integrated circuits and devices (42), (46) is disclosed, the package including: a package base (44), the base having a first top surface; a layer of material (43) on the first top surface of the base (44) wherein the material (43) is patterned to cover a portion of the base, and wherein the layer of material (43) forms a substrate having a second top surface; a microstrip transmission line (45) on the second top surface; and a plastic encapsulant (50), wherein the encapsulant covers the first top surface of the base.

摘要翻译： 在本发明的一种形式中，公开了一种用于集成电路和器件（42），（46）的封装，所述封装包括：封装基座（44），所述基座具有第一顶表面; 在所述基座（44）的所述第一顶表面上的材料层（43），其中所述材料（43）被图案化以覆盖所述基部的一部分，并且其中所述材料层（43）形成具有第二顶部 表面; 在第二顶表面上的微带传输线（45）; 和塑料密封剂（50），其中所述密封剂覆盖所述基底的第一顶表面。

公开(公告)号：US06553661B2

公开(公告)日：2003-04-29

申请号：US09754834

申请日：2001-01-04

申请人： Richard W. Arnold ,  Lester Wilson ,  James Forster

发明人： Richard W. Arnold ,  Lester Wilson ,  James Forster

IPC分类号： H05K302

CPC分类号： G01R1/0408 ,  G01R1/073 ,  G01R3/00 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49156 ,  Y10T29/49167

摘要： A test structure that is readily and inexpensively configurable to interface with dies having different bond pad configurations is achieved by providing a blank test membrane having a conductive coating or a matrix of conductive lines formed thereon. Once a die bond pad configuration is known, the test membrane can be configured for the die bond pads by using a laser under software control to define connection pads correlating to the die bond pads and also to define interconnecting conductive traces from the connecting pads to contact pads that can be connected to test equipment. In one embodiment, the laser operates to ablate a continuous conductive coating, so as to form conductive pads and traces. In another embodiment, the laser is used to cut various lines in a matrix of conductive lines, so as to define conductive paths from the bond pads to the contact pads for connection to the test equipment.

公开(公告)号：US20080188154A1

公开(公告)日：2008-08-07

申请号：US11957763

申请日：2007-12-17

申请人： Terry Leis ,  James Forster ,  David Hopkins

发明人： Terry Leis ,  James Forster ,  David Hopkins

IPC分类号： B32B27/12 ,  B32B7/12 ,  B32B5/16

CPC分类号： B32B7/12 ,  Y10T428/25 ,  Y10T428/2848 ,  Y10T442/30 ,  Y10T442/674

摘要： A laminate includes at least one layer of an environmentally degradable film, for example, a polylactide (“PLA”) polymer made from an annually-renewable, readily-available resource such as corn. A second layer may be a substrate made from, for example, paper, woven or non-woven fabrics or metallic foils. The environmentally degradable film and the substrate are adhered to one another using, for example, polymeric extrudates or adhesives such as water-based, hot melt, solvent-based or solvent-less adhesives. The choice of adherent depends on the type of substrate to be laminated to the environmentally degradable film and the desired properties of the resultant composite laminated structure (i.e., “laminate”). Such film laminates find use, for example, in the packaging, envelope, tag and label, forms, commercial publication, and digital print industries. Traditional converting equipment may be used to convert the film laminate into rolls, folio sheets and cut size formats as required.

摘要翻译： 层压体包括至少一层可环境降解的膜，例如由每年可再生的易于获得的资源如玉米制成的聚丙交酯（“PLA”）聚合物。 第二层可以是由例如纸，织造或非织造织物或金属箔制成的基底。 使用例如聚合物挤出物或粘合剂如水基，热熔体，溶剂型或无溶剂粘合剂将环境可降解的膜和基材彼此粘合。 粘合剂的选择取决于层压到环境可降解膜上的基材的类型和所得复合层压结构（即“层压板”）的期望性能。 这种薄膜层压板可用于例如包装，信封，标签和标签，表格，商业出版物和数字印刷行业。 传统的转换设备可以根据需要将薄膜叠层转换成卷，对开片和切割尺寸格式。

公开(公告)号：US06636063B2

公开(公告)日：2003-10-21

申请号：US09968963

申请日：2001-10-02

申请人： Richard W. Arnold ,  James Forster ,  Reynaldo M. Rincon ,  Lester Wilson

发明人： Richard W. Arnold ,  James Forster ,  Reynaldo M. Rincon ,  Lester Wilson

IPC分类号： G01R3102

CPC分类号： G01R1/06744 ,  G01R1/07342 ,  G01R3/00

摘要： A probe card having reliable “micro probe” contacts which include a base and an angled probe tip fabricated as a single unit from a thin sheet of a conductive metal having high tensile and yield strength, and coated with a noble metal. The micro probes are secured into precisely dimensioned, and positioned locations on the card, and are electrically connected to traces on the card. Design of the micro probes includes not only the base and probe tip, but also locking features, a stand-off to prevent over compression, and a necked down stem feature for release from the support strap used in transporting and plating during the manufacturing processes.

公开(公告)号：US5653379A

公开(公告)日：1997-08-05

申请号：US459440

申请日：1995-06-02

申请人： James Forster ,  Premkumar Hingorany ,  Henry F. Breit

发明人： James Forster ,  Premkumar Hingorany ,  Henry F. Breit

IPC分类号： B23K35/00 ,  C04B37/02 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  B23K31/02 ,  B23K35/24

CPC分类号： B23K35/007 ,  C04B37/021 ,  C04B2237/32 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/407 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/38

摘要： Ceramic to metal stock or substrates having a relatively large and thick metal core and a relatively thin ceramic layer or layers are bonded to the metal core or a selected portion thereof by providing a metal core material having a temperature coefficient of expansion which is tailored to the temperature coefficient of expansion of the ceramic layer to be bonded thereto. The typical core materials include multilayer composite metal laminates embodying Cu/Mo/Cu, Cu/Kovar/Cu, Cu/Invar/Cu and the like and including powdered metal composites embodying Cu-W, Ag-Mo, Ag-W, Al-Si, Cu/Mo/Cu, Cu/Kovar/Cu, SiC-Cu, Ni-Fe alloys having from about 20% Ni to about 80% Ni, etc. The ceramic layer is chosen primarily for the properties of dielectric strength and isolation properties and typically include such ceramics as alumina, beryllium oxide, aluminum nitride, silicon carbide, etc. Where the core composite includes copper outer surface materials or is plated to have copper outer surface materials, the core and ceramic materials and particularly multiple sections of the ceramic materials are provided in spaced relation on the metal cores of relatively large area and are preferably bonded to the core using a copper oxide eutectic formed on the core surface.

摘要翻译： 具有相对较大和较厚的金属芯和相对较薄的陶瓷层的陶瓷与金属原料或基底通过提供具有温度膨胀系数的金属芯材料结合到金属芯或其选定部分，该金属芯材料适合于 要结合的陶瓷层的温度膨胀系数。 典型的核心材料包括体现Cu / Mo / Cu，Cu / Kovar / Cu，Cu / Invar / Cu等的多层复合金属层压体，包括体现Cu-W，Ag-Mo，Ag-W，Al- Si，Cu / Mo / Cu，Cu / Kovar / Cu，具有约20％Ni至约80％Ni等的SiC-Cu，Ni-Fe合金等。陶瓷层主要用于介电强度和隔离性能 性质，并且通常包括诸如氧化铝，氧化铍，氮化铝，碳化硅等的陶瓷。其中芯复合材料包括铜外表面材料或被电镀以具有铜外表面材料，芯和陶瓷材料，特别是多个部分 在相对较大面积的金属芯上以间隔设置陶瓷材料，并且优选使用在芯表面上形成的铜氧化物共晶体将其结合到芯上。