-
公开(公告)号：US5817987A
公开(公告)日：1998-10-06
申请号：US819913
申请日：1997-03-18
CPC分类号： H02G3/086 , H01L23/32 , H01L23/4093 , H01L2924/0002
摘要： The present invention provides a housing for an auxiliary circuit to be connected to a main circuit. The housing includes a heat tab for conducting the heat away from the auxiliary circuit components and an insulating case which is molded together with the heat tab to interlock the heat tab to the case. The case is molded around a chamfered edge of the heat tab. The insulating case includes a back and two sides extending from the back to define an area which contains the auxiliary circuit components. The heat tab is molded into the back and faces the component area so heat generated from the components can be spread to the main circuit by the heat tab. Openings may be provided through the back of the insulating case. The heat tab and legs on the sides of the housing are used to mount the power supply to a circuit board.
摘要翻译： 本发明提供一种用于连接到主电路的辅助电路的壳体。 壳体包括用于将热量从辅助电路部件导出的热接头和与热接头模制在一起以将热接头互锁到壳体的绝缘壳体。 壳体围绕加热片的倒角边缘模制。 绝缘壳体包括从后部延伸的背面和两侧以限定包含辅助电路部件的区域。 热片被模制到背部并面向组件区域，使得由组件产生的热量可以通过热片扩散到主电路。 可以通过绝缘壳体的背面提供开口。 外壳侧面的散热片和支脚用于将电源安装到电路板上。
-
公开(公告)号：US6157543A
公开(公告)日：2000-12-05
申请号：US833237
申请日：1997-04-14
CPC分类号： H05K7/1461 , H05K3/301 , H05K3/366
摘要： The present invention generally provides a case for a printed circuit board which forms a single in-line pin configuration from an edge connected circuit board. The case includes a frame enclosing the edges of the circuit board and a base at a mounting plane side of the frame. Connector pins affixed to the edge connectors of a printed circuit board are secured to the printed circuit board and extend from the base. A tab extending generally parallel to the frame from an edge of the base provides a smooth vacuum pick up engagement surface for handling and placement of the present case.
摘要翻译： 本发明总体上提供了一种从边缘连接电路板形成单一直列引脚配置的印刷电路板的情况。 壳体包括围绕电路板的边缘的框架和在框架的安装平面侧的基座。 固定到印刷电路板的边缘连接器的连接器针固定到印刷电路板并从基底延伸。 从基座的边缘大致平行于框架延伸的突出部提供平滑的真空拾取接合表面，用于处理和放置本案件。
-
公开(公告)号：US6125038A
公开(公告)日：2000-09-26
申请号：US392555
申请日：1999-09-09
IPC分类号： H01L23/367 , H05K7/20
CPC分类号： H05K7/205 , H01L23/3675 , H05K7/20509 , H01L2924/0002
摘要： The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is u-shaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.
摘要翻译： 散热器安装在辅助电路板的背面，辅助电路板安装在主电路板上。 在一个实施例中，散热器是平面的并且在平行的辅助电路板和主电路板之间延伸。 翅片式散热构件位于平面部分的一侧。 通道中的安装销将散热器安装到主电路板上。 第二实施例是u形的并且站立在边缘以将辅助电路板垂直于主电路板安装。 第二实施例的通道中的安装销同样将散热器安装到主电路板。
-
4.发明授权公开(公告)号：US06812562B2
公开(公告)日：2004-11-02
申请号：US09747599
申请日：2000-12-22
IPC分类号： H01L2334
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A surface mounted power transistor is provided with a heat sink by positioning a mounting plate of a heat sink between the power transistor and a solder pad on the circuit board. The mounting plate of the heat sink is provided with a plurality of openings through which the solder of the solder pad flows during the solder reflow process so that the mounting plate is securely adhered between the power transistor and the circuit board. The mounting plate of the heat sink is connected thermally to an extension member which extends generally perpendicular to the mounting plate, the extension member in turn being connected to a heat dissipation surface which may be one or several fins.
摘要翻译： 表面安装的功率晶体管通过将散热器的安装板定位在功率晶体管和电路板上的焊盘之间而设置有散热器。 散热器的安装板设置有多个开口，焊料焊料的焊料在焊料回流工艺期间流过该开口，使得安装板牢固地粘附在功率晶体管和电路板之间。 散热器的安装板热量连接到大致垂直于安装板延伸的延伸构件，延伸构件又连接到可以是一个或多个翅片的散热表面。
-
公开(公告)号：US06759278B2
公开(公告)日：2004-07-06
申请号：US10108885
申请日：2002-03-28
IPC分类号： H01L2144
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A surface mounted power transistor is provided with a heat sink by positioning a mounting plate of a heat sink between the power transistor and a solder pad on the circuit board. The mounting plate of the heat sink is provided with a plurality of openings through which the solder of the solder pad flows during the solder reflow process so that the mounting plate is securely adhered between the power transistor and the circuit board. The mounting plate of the heat sink is connected thermally to an extension member which extends generally perpendicular to the mounting plate, the extension member in turn being connected to a heat dissipation surface which may be one or several fins.
摘要翻译： 表面安装的功率晶体管通过将散热器的安装板定位在功率晶体管和电路板上的焊盘之间而设置有散热器。 散热器的安装板设置有多个开口，焊料焊料的焊料在焊料回流工艺期间流过该开口，使得安装板牢固地粘附在功率晶体管和电路板之间。 散热器的安装板热量连接到大致垂直于安装板延伸的延伸构件，延伸构件又连接到可以是一个或多个翅片的散热表面。
-
公开(公告)号：US07367276B2
公开(公告)日：2008-05-06
申请号：US11172673
申请日：2005-07-01
IPC分类号： B63B15/00
摘要： A bowsprit, or spar, for supporting a spinnaker sail at the front of a sailboat is mounted on the deck of the sailboat. The bowsprit is retractable and extendable in telescoping fashion and includes a rope or tack line extending from the forward end thereof that connects to the corner or tack of the spinnaker sail. The aft or back end of the bowsprit is clipped to the mast and may be unclipped therefrom and secured to the deck so as to position the bowsprit at an angle to the boat to present the spinnaker sail to the wind. The present bowsprit is mounted along the midline of the boat and extends through a swivel bridle that connects the forestay to the deck. Extension of the bowsprit is accomplished by pulling a line connected to the inner pole of the bowsprit and passing around a pulley so that the inner pole slides out to an extended position from the outer sleeve of the bowsprit.
摘要翻译： 用于在帆船前面支撑三角帆帆船的弓箭或翼梁安装在帆船的甲板上。 弓形管是可伸缩的并且可伸缩的并且包括从连接到三角帆风帆的角落或钉的前端延伸的绳索或钉线。 蝴蝶结的后端或后端被夹紧到桅杆上，并且可以从其上松开并固定到甲板上，以便将弓形杆与船形成一定角度，以将三角帆风帆向风中呈现。 目前的蝴蝶结沿着船的中线安装，并延伸穿过将森林与甲板连接的旋转桁架。 蝴蝶结的延伸是通过拉动连接到蝴蝶结的内极并绕过滑轮的线来实现的，使得内极从弹珠的外套滑出到延伸位置。
-
公开(公告)号：US5875097A
公开(公告)日：1999-02-23
申请号：US871235
申请日：1997-06-09
IPC分类号： H01L23/367 , H05K7/20
CPC分类号： H05K7/205 , H01L23/3675 , H05K7/20509 , H01L2924/0002
摘要： The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is unshaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.
摘要翻译： 散热器安装在辅助电路板的背面，辅助电路板安装在主电路板上。 在一个实施例中，散热器是平面的并且在平行的辅助电路板和主电路板之间延伸。 翅片式散热构件位于平面部分的一侧。 通道中的安装销将散热器安装到主电路板上。 第二实施例是未成形的，并且站立在边缘以将辅助电路板垂直于主电路板安装。 第二实施例的通道中的安装销同样将散热器安装到主电路板。
-
公开(公告)号：US06177632B1
公开(公告)日：2001-01-23
申请号：US09183612
申请日：1998-10-30
IPC分类号： H02G308
CPC分类号： H05K9/0022 , H05K1/141 , H05K3/301 , H05K3/3426 , H05K3/3447 , H05K3/366 , H05K3/368 , H05K2201/09954 , H05K2201/10386
摘要： A case for an auxiliary circuit board to be mounted on a main circuit board includes a copper sheet formed into a U-shape in which the auxiliary circuit board is mounted. Mounting pins extend from two edges of the case for positioning the auxiliary circuit board perpendicularly to or parallel to the main circuit board. Mounting pins for through hole mounting and support tabs for surface mounting are provided, the unneeded features being removed prior to use of the case.
摘要翻译： 安装在主电路板上的辅助电路板的壳体包括形成为辅助电路板的U形的铜片。 安装销从壳体的两个边缘延伸，以将辅助电路板垂直于或平行于主电路板。 提供了用于通孔安装的安装销和用于表面安装的支撑卡舌，在使用外壳之前，不需要的特征被移除。
-
公开(公告)号：US6081180A
公开(公告)日：2000-06-27
申请号：US158089
申请日：1998-09-22
CPC分类号： H01F17/062 , H01F27/027 , H05K3/301
摘要： A housing for a toroid coil has side walls closely formed around the coil and a top connected at a gap from the side walls by attachments. The top provides a flat, relatively smooth vacuum pick up surface for mounting the coil on a circuit board and is removable by breaking off the attachments. The side walls have a front wall with wire wrap posts extending therefrom positioned so that the wire of the coil lies in the mounting plane for surface mount connection when wrapped on the posts. Slots are provided in the front wall to receive the wire to prevent cutting or scoring of the wire or its coating or cover during removal of the top. The back of the walls is open to reduce length and thickened supports are provided at the edges of the walls adjacent the back.
摘要翻译： 用于环形线圈的壳体具有围绕线圈紧密地形成的侧壁和通过附件与侧壁间隔开的顶部。 顶部提供平坦的，相对平滑的真空拾取表面，用于将线圈安装在电路板上，并通过断开附件而被移除。 所述侧壁具有前壁，所述前壁具有从其延伸的线缠绕柱定位，使得当缠绕在所述柱上时，所述线圈的线位于所述安装平面中用于表面安装连接。 插槽设置在前壁中以接收电线，以防止在顶部移除期间电线或其涂层或覆盖物的切割或刻痕。 墙的后部是敞开的以减小长度，并且在靠近背部的墙壁的边缘处设置增厚的支撑。
-
公开(公告)号：US5986888A
公开(公告)日：1999-11-16
申请号：US193926
申请日：1998-11-17
IPC分类号： H01L23/367 , H05K7/20
CPC分类号： H05K7/205 , H01L23/3675 , H05K7/20509 , H01L2924/0002
摘要： The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is u-shaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.
-
-
-
-
-
-
-
-
-
搜索结果
10 条记录 (耗时 0.018 秒)
