FORMING NOZZLES
    1.
    发明申请
    FORMING NOZZLES 有权
    成型喷嘴

    公开(公告)号:US20100165048A1

    公开(公告)日:2010-07-01

    申请号:US12346698

    申请日:2008-12-30

    IPC分类号: B41J2/16 H01L21/302

    摘要: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.

    摘要翻译: 描述了具有导向直壁的锥形部分的流体喷射嘴。 喷嘴的锥形部分和直壁孔均由半导体层的单侧形成,使得锥形部分和孔彼此对准,即使在模具之间形成喷嘴阵列并且多个模具是 形成在半导体衬底上。

    Forming nozzles
    2.
    发明授权
    Forming nozzles 有权
    成型喷嘴

    公开(公告)号:US08641171B2

    公开(公告)日:2014-02-04

    申请号:US13484117

    申请日:2012-05-30

    IPC分类号: B41J2/135

    摘要: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.

    摘要翻译: 描述了具有导向直壁的锥形部分的流体喷射嘴。 喷嘴的锥形部分和直壁孔均由半导体层的单侧形成,使得锥形部分和孔彼此对准,即使在模具之间形成喷嘴阵列并且多个模具是 形成在半导体衬底上。

    FORMING NOZZLES
    3.
    发明申请
    FORMING NOZZLES 有权
    成型喷嘴

    公开(公告)号:US20120234946A1

    公开(公告)日:2012-09-20

    申请号:US13484117

    申请日:2012-05-30

    IPC分类号: B41J2/16 B05B1/00

    摘要: Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.

    摘要翻译: 描述了具有导向直壁的锥形部分的流体喷射嘴。 喷嘴的锥形部分和直壁孔均由半导体层的单侧形成,使得锥形部分和孔彼此对准,即使在模具之间形成喷嘴阵列并且多个模具是 形成在半导体衬底上。

    Bonding on silicon substrate having a groove
    8.
    发明授权
    Bonding on silicon substrate having a groove 有权
    在具有凹槽的硅衬底上键合

    公开(公告)号:US08853915B2

    公开(公告)日:2014-10-07

    申请号:US12562618

    申请日:2009-09-18

    摘要: A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.

    摘要翻译: 公开了一种用于在硅衬底上接合的方法和装置。 一种装置包括具有膜表面的膜,膜表面中的槽,具有基本上平行于膜表面的换能器表面的换能器以及将膜表面连接到换能器表面的粘合剂。 凹槽可以被配置为允许粘合剂流入并穿过凹槽,同时最小化由于凹槽不完全填充可能导致的空隙或气隙。 可以在膜表面形成多个凹槽并且可以具有均匀的深度。

    Thermal Oxide Coating On A Fluid Ejector
    9.
    发明申请
    Thermal Oxide Coating On A Fluid Ejector 有权
    流体喷射器上的热氧化物涂层

    公开(公告)号:US20110109694A1

    公开(公告)日:2011-05-12

    申请号:US12614356

    申请日:2009-11-06

    IPC分类号: B41J2/16 B32B7/00

    摘要: A fluid ejection module includes a flow-path body, a first oxide layer, a membrane, and a second oxide layer. The flow-path body has a first outer surface and an opposing second outer surface and a plurality of flow paths, each flow path extending at least from the first outer surface to the second outer surface. The first oxide layer coats at least an interior surface of each of the flow paths and the first and second outer surfaces of the flow-path body and has a thickness that varies by less than 5% along {100} planes. The membrane has a first outer surface. The second oxide layer is coated on the first outer surface of the membrane and has a thickness that varies by less than 5% along {100} planes and is bonded to the first oxide layer.

    摘要翻译: 流体喷射模块包括流路主体,第一氧化物层,膜和第二氧化物层。 流路主体具有第一外表面和相对的第二外表面和多个流动通道,每个流动通道至少从第一外表面延伸到第二外表面。 第一氧化物层涂覆至少每个流路的内表面和流动通道体的第一和第二外表面,并且具有沿{100}平面变化小于5%的厚度。 膜具有第一外表面。 第二氧化物层被涂覆在膜的第一外表面上,并且具有沿{100}面变化小于5%的厚度并且结合到第一氧化物层。

    Bonding On Silicon Substrate Having A Groove
    10.
    发明申请
    Bonding On Silicon Substrate Having A Groove 有权
    具有凹槽的硅衬底上的键合

    公开(公告)号:US20100066206A1

    公开(公告)日:2010-03-18

    申请号:US12562618

    申请日:2009-09-18

    摘要: A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.

    摘要翻译: 公开了一种用于在硅衬底上接合的方法和装置。 一种装置包括具有膜表面的膜,膜表面中的槽,具有基本上平行于膜表面的换能器表面的换能器以及将膜表面连接到换能器表面的粘合剂。 凹槽可以被配置为允许粘合剂流入并穿过凹槽,同时最小化由于凹槽不完全填充可能导致的空隙或气隙。 可以在膜表面形成多个凹槽并且可以具有均匀的深度。