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公开(公告)号：US09176072B2
公开(公告)日：2015-11-03
申请号：US12919760
申请日：2010-07-16
申请人： Guoheng Zhao , Mehdi Vaez-Iravani , Scott Young , Kris Bhaskar
发明人： Guoheng Zhao , Mehdi Vaez-Iravani , Scott Young , Kris Bhaskar
CPC分类号： G01N21/9501 , G01N21/8806 , G01N2021/8822
摘要： A dark field inspection system that minimizes the speckle noise due to sample surface roughness can include a plurality of beam shaping paths for generating a composite, focused illumination line on a wafer. Each beam shaping path can illuminate the wafer at an oblique angle. The plurality of beam shaping paths can form a ring illumination. This ring illumination can reduce the speckle effect, thereby improving SNR. An objective lens can capture scattered light from the wafer and an imaging sensor can receive an output of the objective lens. Because the wafer illumination occurs at oblique angles, the objective lens can have a high NA, thereby improving optical resolution of the imaging sensor, and the resulting signal level.
摘要翻译： 使样品表面粗糙度引起的斑点噪声最小化的暗场检查系统可以包括用于在晶片上产生复合聚焦照明线的多个光束整形路径。 每个光束成形路径可以倾斜角度照射晶片。 多个光束成形路径可以形成环形照明。 这种环形照明可以减少斑点效应，从而提高SNR。 物镜可以捕获来自晶片的散射光，成像传感器可以接收物镜的输出。 由于晶片照明以倾斜角度发生，所以物镜可以具有高NA，从而提高成像传感器的光学分辨率和所得到的信号电平。
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公开(公告)号：US20110169944A1
公开(公告)日：2011-07-14
申请号：US12919760
申请日：2010-07-16
申请人： Guoheng Zhao , Mehdi Vaez-Iravani , Scott Young , Kris Bhaskar
发明人： Guoheng Zhao , Mehdi Vaez-Iravani , Scott Young , Kris Bhaskar
CPC分类号： G01N21/9501 , G01N21/8806 , G01N2021/8822
摘要： A dark field inspection system that minimizes the speckle noise due to sample surface roughness can include a plurality of beam shaping paths for generating a composite, focused illumination line on a wafer. Each beam shaping path can illuminate the wafer at an oblique angle. The plurality of beam shaping paths can form a ring illumination. This ring illumination can reduce the speckle effect, thereby improving SNR. An objective lens can capture scattered light from the wafer and an imaging sensor can receive an output of the objective lens. Because the wafer illumination occurs at oblique angles, the objective lens can have a high NA, thereby improving optical resolution of the imaging sensor, and the resulting signal level.
摘要翻译： 使样品表面粗糙度引起的斑点噪声最小化的暗场检查系统可以包括用于在晶片上产生复合聚焦照明线的多个光束整形路径。 每个光束成形路径可以倾斜角度照射晶片。 多个光束成形路径可以形成环形照明。 这种环形照明可以减少斑点效应，从而提高SNR。 物镜可以捕获来自晶片的散射光，成像传感器可以接收物镜的输出。 由于晶片照明以倾斜角度发生，所以物镜可以具有高NA，从而提高成像传感器的光学分辨率和所得到的信号电平。
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公开(公告)号：US07869023B2
公开(公告)日：2011-01-11
申请号：US12123393
申请日：2008-05-19
IPC分类号： G01N21/00
CPC分类号： G01N21/9501
摘要： A cylindrical mirror or lens is used to focus an input collimated beam of light onto a line on the surface to be inspected, where the line is substantially in the plane of incidence of the focused beam. An image of the beam is projected onto an array of charge-coupled devices parallel to the line for detecting anomalies and/or features of the surface, where the array is outside the plane of incidence of the focused beam.
摘要翻译： 使用圆柱形镜或透镜将输入的准直光束聚焦到要检查的表面上的线上，其中线基本上在聚焦束的入射平面中。 光束的图像被投影到平行于线的电荷耦合器件的阵列上，用于检测表面的异常和/或特征，其中阵列位于聚焦光束的入射平面之外。
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公开(公告)号：US07607647B2
公开(公告)日：2009-10-27
申请号：US11688720
申请日：2007-03-20
申请人： Guoheng Zhao , Alexander Belyaev , Christian H. Wolters , Paul Andrew Doyle , Howard W. Dando , Mehdi Vaez-Iravani
发明人： Guoheng Zhao , Alexander Belyaev , Christian H. Wolters , Paul Andrew Doyle , Howard W. Dando , Mehdi Vaez-Iravani
IPC分类号： B25B11/00
CPC分类号： B25B11/005 , F16C29/025 , F16C32/0603 , H01L21/67784 , H01L21/6838
摘要： Substrate processing method and apparatus are disclosed. The substrate processing apparatus includes a non-contact air bearing chuck with a vacuum preload.
摘要翻译： 公开了基板处理方法和装置。 基板处理装置包括具有真空预载的非接触式空气轴承卡盘。
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公开(公告)号：US20080229811A1
公开(公告)日：2008-09-25
申请号：US11688720
申请日：2007-03-20
申请人： Guoheng Zhao , Alexander Belyaev , Christian H. Wolters , Paul Andrew Doyle , Howard W. Dando , Mehdi Vaez-Iravani
发明人： Guoheng Zhao , Alexander Belyaev , Christian H. Wolters , Paul Andrew Doyle , Howard W. Dando , Mehdi Vaez-Iravani
IPC分类号： G01N21/00
CPC分类号： B25B11/005 , F16C29/025 , F16C32/0603 , H01L21/67784 , H01L21/6838
摘要： Substrate processing method and apparatus are disclosed. The substrate processing apparatus includes a non-contact air bearing chuck with a vacuum preload.
摘要翻译： 公开了基板处理方法和装置。 基板处理装置包括具有真空预载的非接触式空气轴承卡盘。
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公开(公告)号：US07345754B1
公开(公告)日：2008-03-18
申请号：US11228584
申请日：2005-09-16
CPC分类号： G01N21/9501 , G01N21/4738 , G01N21/956 , G03F7/7065
摘要： Fourier filters and wafer inspection systems are provided. One embodiment relates to a one-dimensional Fourier filter configured to be included in a bright field inspection system such that the bright field inspection system can be used for broadband dark field inspection of a wafer. The Fourier filter includes an asymmetric illumination aperture configured to be positioned in an illumination path of the inspection system. The Fourier filter also includes an asymmetric imaging aperture complementary to the illumination aperture. The imaging aperture is configured to be positioned in a light collection path of the inspection system such that the imaging aperture blocks light reflected and diffracted from structures on the wafer and allows light scattered from defects on the wafer to pass through the imaging aperture.
摘要翻译： 提供傅立叶滤波器和晶片检测系统。 一个实施例涉及被配置为包括在明场检查系统中的一维傅立叶滤波器，使得明场检查系统可以用于晶片的宽带暗视场检查。 傅里叶滤波器包括被配置为定位在检查系统的照明路径中的非对称照明孔。 傅立叶滤波器还包括与照明孔径互补的非对称成像孔。 成像孔被配置为定位在检查系统的光采集路径中，使得成像孔口阻挡从晶片上的结构反射和衍射的光，并允许从晶片上的缺陷散射的光通过成像孔。
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公开(公告)号：US07119897B2
公开(公告)日：2006-10-10
申请号：US11007729
申请日：2004-12-07
IPC分类号： G01N21/00
CPC分类号： G01N21/956 , G01N21/47 , G01N21/9501
摘要： A curved mirrored surface is used to collect radiation scattered by a sample surface and originating from a normal illumination beam and an oblique illumination beam. The collected radiation is focused to a detector. Scattered radiation originating from the normal and oblique illumination beams may be distinguished by employing radiation at two different wavelengths, by intentionally introducing an offset between the spots illuminated by the two beams or by switching the normal and oblique illumination beams on and off alternately. Beam position error caused by change in sample height may be corrected by detecting specular reflection of an oblique illumination beam and changing the direction of illumination in response thereto. Butterfly-shaped spatial filters may be used in conjunction with curved mirror radiation collectors to restrict detection to certain azimuthal angles.
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公开(公告)号：US20050099621A1
公开(公告)日：2005-05-12
申请号：US11007729
申请日：2004-12-07
CPC分类号： G01N21/956 , G01N21/47 , G01N21/9501
摘要： A curved mirrored surface is used to collect radiation scattered by a sample surface and originating from a normal illumination beam and an oblique illumination beam. The collected radiation is focused to a detector. Scattered radiation originating from the normal and oblique illumination beams may be distinguished by employing radiation at two different wavelengths, by intentionally introducing an offset between the spots illuminated by the two beams or by switching the normal and oblique illumination beams on and off alternately. Beam position error caused by change in sample height may be corrected by detecting specular reflection of an oblique illumination beam and changing the direction of illumination in response thereto. Butterfly-shaped spatial filters may be used in conjunction with curved mirror radiation collectors to restrict detection to certain azimuthal angles.
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公开(公告)号：US08817250B2
公开(公告)日：2014-08-26
申请号：US13226032
申请日：2011-09-06
申请人： Paul Doyle , Guoheng Zhao , Alexander Belyaev , Christian H. Wolters , Howard W. Dando , Mehdi Vaez-Iravani , Carmela C. Moreno
发明人： Paul Doyle , Guoheng Zhao , Alexander Belyaev , J. Rex Runyon , Christian H. Wolters , Howard W. Dando , Mehdi Vaez-Iravani
IPC分类号： G01N21/00
CPC分类号： H01L21/6838
摘要： A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.
摘要翻译： 一种用于调查基板的工具，其中该工具具有用于检查基板的工具头，用于将基板的上表面设置在工具头附近的卡盘以及设置在与基板相邻的工具头上的空气轴承。 空气轴承具有压力源和真空源，其中真空源将基板拉向空气轴承，并且压力源防止基板物理接触空气轴承。 压力源和真空源协同工作，将衬底的上表面设置在与工具头一段已知距离处。 通过以这种方式使用空气轴承作为工具的一部分，基板相对于基板的上表面而不是基板的背面完成对准工具头。
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公开(公告)号：US20140009759A1
公开(公告)日：2014-01-09
申请号：US13822281
申请日：2011-12-07
IPC分类号： G01N21/88
CPC分类号： G01N21/9501 , G01N21/21 , G01N21/47 , G01N21/8806 , G01N2201/06113 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different. portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.
摘要翻译： 提供了用于检查晶片的系统和方法。 一个系统包括配置成照亮晶片的照明子系统; 收集子系统，被配置为收集从晶片散射的光并保持散射光的偏振; 光学元件，被配置为将收集在收集子系统的收集数值孔径的不同段中的散射光分离，其中所述光学元件位于所述收集子系统的傅立叶平面或所述傅立叶平面的共轭处; 偏振元件，被配置为基于极化将所述不同段中的一个中的散射光分离成所述散射光的不同部分; 以及检测器，被配置为检测不同的一个。 散射光的一部分并且响应于检测到的光而产生输出，用于检测晶片上的缺陷。
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