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    Air bearing for substrate inspection device
    1.
    发明授权
    Air bearing for substrate inspection device 有权
    基板检查装置用空气轴承

    公开(公告)号：US08817250B2

    公开(公告)日：2014-08-26

    申请号：US13226032

    申请日：2011-09-06

    申请人： Paul Doyle ,  Guoheng Zhao ,  Alexander Belyaev ,  Christian H. Wolters ,  Howard W. Dando ,  Mehdi Vaez-Iravani ,  Carmela C. Moreno

    发明人： Paul Doyle ,  Guoheng Zhao ,  Alexander Belyaev ,  J. Rex Runyon ,  Christian H. Wolters ,  Howard W. Dando ,  Mehdi Vaez-Iravani

    IPC分类号： G01N21/00

    CPC分类号： H01L21/6838

    摘要： A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.

    摘要翻译： 一种用于调查基板的工具，其中该工具具有用于检查基板的工具头，用于将基板的上表面设置在工具头附近的卡盘以及设置在与基板相邻的工具头上的空气轴承。 空气轴承具有压力源和真空源，其中真空源将基板拉向空气轴承，并且压力源防止基板物理接触空气轴承。 压力源和真空源协同工作，将衬底的上表面设置在与工具头一段已知距离处。 通过以这种方式使用空气轴承作为工具的一部分，基板相对于基板的上表面而不是基板的背面完成对准工具头。

    Referenced Inspection Device
    2.
    发明申请
    Referenced Inspection Device 有权
    参考检验装置

    公开(公告)号：US20120062877A1

    公开(公告)日：2012-03-15

    申请号：US13226032

    申请日：2011-09-06

    申请人： Paul Doyle ,  Guoheng Zhao ,  Alexander Belyaev ,  J. Rex Runyon ,  Christian H. Wolters ,  Howard W. Dando ,  Mehdi Vaez-Iravani

    发明人： Paul Doyle ,  Guoheng Zhao ,  Alexander Belyaev ,  J. Rex Runyon ,  Christian H. Wolters ,  Howard W. Dando ,  Mehdi Vaez-Iravani

    IPC分类号： G01N21/88 ,  G01R31/26

    CPC分类号： H01L21/6838

    摘要： A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.

    摘要翻译： 一种用于调查基板的工具，其中该工具具有用于检查基板的工具头，用于将基板的上表面设置在工具头附近的卡盘以及设置在与基板相邻的工具头上的空气轴承。 空气轴承具有压力源和真空源，其中真空源将基板拉向空气轴承，并且压力源防止基板物理接触空气轴承。 压力源和真空源协同工作，将衬底的上表面设置在与工具头一段已知距离处。 通过以这种方式使用空气轴承作为工具的一部分，基板相对于基板的上表面而不是基板的背面完成对准工具头。

    Referenced Inspection Device
    5.
    发明申请
    Referenced Inspection Device 审中-公开
    参考检验装置

    公开(公告)号：US20110069306A1

    公开(公告)日：2011-03-24

    申请号：US12994793

    申请日：2009-05-29

    申请人： Paul Doyle ,  Guoheng Zhao ,  Alexander Belyaev ,  J. Rex Runyon

    发明人： Paul Doyle ,  Guoheng Zhao ,  Alexander Belyaev ,  J. Rex Runyon

    IPC分类号： G01N21/88 ,  G01R31/26

    CPC分类号： H01L21/6838

    摘要： A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.

    摘要翻译： 一种用于调查基板的工具，其中该工具具有用于检查基板的工具头，用于将基板的上表面设置在工具头附近的卡盘以及设置在与基板相邻的工具头上的空气轴承。 空气轴承具有压力源和真空源，其中真空源将基板拉向空气轴承，并且压力源防止基板物理接触空气轴承。 压力源和真空源协同工作，将衬底的上表面设置在与工具头一段已知距离处。 通过以这种方式使用空气轴承作为工具的一部分，基板相对于基板的上表面而不是基板的背面完成对准工具头。

    Method for improving edge handling chuck aerodynamics
    6.
    发明授权
    Method for improving edge handling chuck aerodynamics 有权
    改善边缘处理卡盘空气动力学的方法

    公开(公告)号：US08042254B1

    公开(公告)日：2011-10-25

    申请号：US11963271

    申请日：2007-12-21

    申请人： Alexander Belyaev ,  Christian H. Wolters ,  Aleksey Petrenko ,  Paul Doyle

    发明人： Alexander Belyaev ,  Christian H. Wolters ,  Aleksey Petrenko ,  Paul Doyle

    IPC分类号： B23B31/18 ,  B05C13/00

    CPC分类号： H01L21/68785 ,  Y10T29/49998 ,  Y10T279/18

    摘要： An edge-handling chuck, a system for holding and rotating a test substrate at a high speed and a method for chucking a rotating substrate are disclosed. The Chuck includes a plate having a central axis, a fluid opening and a top surface with a varied topography characterized by symmetry about the central axis. The topography is such that a volume flow rate of fluid between the fluid opening and a periphery of the top surface sufficient to counteract substrate sagging is significantly less than a volume flow rate needed for a similar but flat-surfaced chuck to similarly counteract such sagging. The system may further include a spindle motor and a gas system that supplies gas through the fluid opening to a gap between the top surface and a back surface of the substrate. A radial velocity of the fluid through the gap is approximately constant.

    摘要翻译： 公开了一种边缘处理卡盘，用于高速保持和旋转测试基板的系统以及用于夹持旋转基板的方法。 卡盘包括具有中心轴线的板，流体开口和具有以围绕中心轴线对称为特征的不同形貌的顶部表面。 这种形状使得流体开口和足以抵消底物下垂的顶表面周边之间的流体的体积流速显着小于类似但平坦表面的卡盘相似地抵消这种下垂所需的体积流量。 该系统还可以包括主轴电动机和气体系统，其将气体通过流体开口提供到衬底的顶表面和后表面之间的间隙。 通过间隙的流体的径向速度近似恒定。

    AIR FLOW MANAGEMENT IN A SYSTEM WITH HIGH SPEED SPINNING CHUCK
    9.
    发明申请
    AIR FLOW MANAGEMENT IN A SYSTEM WITH HIGH SPEED SPINNING CHUCK 审中-公开
    在高速旋转切割系统中的空气流量管理

    公开(公告)号：US20130038866A1

    公开(公告)日：2013-02-14

    申请号：US13565212

    申请日：2012-08-02

    申请人： George J. Kren ,  Paul Doyle ,  Alexander Belyaev

    发明人： George J. Kren ,  Paul Doyle ,  Alexander Belyaev

    IPC分类号： G01N21/00 ,  B23B31/30 ,  B23B31/02

    CPC分类号： H01L21/68735 ,  Y10T279/11 ,  Y10T279/21 ,  Y10T279/34

    摘要： The present invention is directed to a high speed, spinning chuck for use in a semiconductor wafer inspection system. The chuck of the present disclosure is configured with a turbulence-reducing lip. Spinning of the chuck produces radial airflows proximal to a surface of the wafer and proximal to the bottom of the chuck. The turbulence-reducing lip of the chuck of the present disclosure directs the radial airflows off of the top surface of the wafer and the bottom surface of the chuck in a manner that minimizes the size of the low pressure zone formed between these radial airflows. The minimization of the low pressure zone reduces air turbulence about the periphery of the chuck and substrate, thereby reducing the possibility of contaminants in the system being directed onto the surface of the substrate by such air turbulence.

    摘要翻译： 本发明涉及一种用于半导体晶片检查系统的高速纺丝卡盘。 本公开的卡盘配置有减少湍流的唇部。 卡盘的旋转产生靠近晶片表面并靠近卡盘底部的径向气流。 本公开的卡盘的减少湍流的唇部以使得在这些径向气流之间形成的低压区域的尺寸最小化的方式引导径向气流离开晶片的顶表面和卡盘的底表面。 低压区域的最小化减小了卡盘和基板周围的空气紊流，从而降低了系统中的污染物通过这种空气湍流被引导到基板的表面上的可能性。

    Methods and systems for inspection of a wafer
    10.
    发明授权
    Methods and systems for inspection of a wafer 有权
    用于检查晶片的方法和系统

    公开(公告)号：US07554656B2

    公开(公告)日：2009-06-30

    申请号：US11244451

    申请日：2005-10-06

    申请人： David Shortt ,  Stephen Biellak ,  Alexander Belyaev

    发明人： David Shortt ,  Stephen Biellak ,  Alexander Belyaev

    IPC分类号： G01N21/00

    CPC分类号： G01N21/9501 ,  G01N21/47 ,  G01N2021/4711 ,  G01N2021/8854

    摘要： Methods and systems for inspection of a wafer are provided. One method includes illuminating the wafer with light at a first wavelength that penetrates into the wafer and light at a second wafer that does not substantially penetrate into the wafer. The method also includes generating output signals responsive to light from the wafer resulting from the illuminating step. In addition, the method includes detecting defects on the wafer using the output signals. The method further includes determining if the defects are subsurface defects or surface defects using the output signals.

    摘要翻译： 提供了用于检查晶片的方法和系统。 一种方法包括用穿透晶片的第一波长的光照射晶片，并且在基本上不渗入晶片的第二晶片处照射晶片。 该方法还包括产生响应于来自晶片的光的输出信号，其由照明步骤产生。 此外，该方法包括使用输出信号检测晶片上的缺陷。 该方法还包括使用输出信号确定缺陷是否是地下缺陷或表面缺陷。