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公开(公告)号：US10293433B2
公开(公告)日：2019-05-21
申请号：US15255926
申请日：2016-09-02
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： B23K26/04 , B23K26/046 , H01L21/67 , B23K26/53 , B28D5/00 , H01L21/78 , B23K26/06 , B23K26/00 , B23K26/38 , B23K26/40 , B23K101/40 , B23K103/00
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
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公开(公告)号：US09511449B2
公开(公告)日：2016-12-06
申请号：US14099236
申请日：2013-12-06
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
CPC分类号： B23K26/048 , B23K26/046 , B23K26/0648 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S 11 and S 12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
摘要翻译： 提供了一种可以有效地执行激光加工同时最小化激光束在待处理物体的端部中的会聚点的偏差的激光加工方法。 该激光加工方法包括：准备步骤，将透镜保持在初始位置，使得会聚点位于物体内的预定位置; 在将透镜保持在初始位置的同时发射用于处理的第一激光束并沿着主表面相对于彼此移动透镜和物体的第一处理步骤（S11和S12），以形成修改区域 在一端切割一条线; 以及第二处理步骤（S13和S14），其在形成要切割的线的一个端部中的改质区域之后，将透镜保持在初始位置，然后沿着彼此移动透镜和物体 主表面同时调整透镜与主表面之间的间隙释放后，形成改质区域。
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公开(公告)号：US20140015113A1
公开(公告)日：2014-01-16
申请号：US14029574
申请日：2013-09-17
发明人： Koji Kuno , Tatsuya Suzuki , Takeshi Sakamoto
IPC分类号： H01L23/00
CPC分类号： H01L23/562 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/0222 , H01L2924/0002 , H01L2924/00
摘要： A laser processing method which can reliably form a modified region within an object to be processed along a desirable part in a line to cut is provided.This laser processing method irradiates a substrate 4 with laser light L while locating a light-converging point P within the substrate 4, so as to form a quality modified region 71 to become a starting point region for cutting within the substrate 4 along a line to cut 5. Here, the laser light L is oscillated pulsewise along a desirable part RP in the line to cut 5, and continuously in a predetermined part RC in the line to cut 5. Consequently, the quality modified region 71 is formed within the substrate 4 along the desirable part RP in the line to cut 5, whereas no quality modified region 71 is formed within the substrate 4 along the predetermined part RC in the line to cut 5.
摘要翻译： 提供一种激光加工方法，其能够沿着切割线中的期望部分可靠地形成待处理物体内的改质区域。 该激光加工方法在将聚光点P定位在基板4内的状态下照射激光L的基板4，从而形成质量改质区域71，成为基板4内的切割起点区域， 这里，激光L沿着要切割的线5中的期望部分RP脉动地沿着切割线5中的预定部分RC连续振荡。因此，质量改质区域71形成在基板内 沿着要切割的线5中的期望部分RP 4，而沿着切割线5中的预定部分RC，在基板4内不形成质量改质区域71。
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公开(公告)号：US11241757B2
公开(公告)日：2022-02-08
申请号：US16380660
申请日：2019-04-10
发明人： Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki , Kenshi Fukumitsu , Fumitsugu Fukuyo
IPC分类号： B23K26/04 , B28D5/00 , H01L21/67 , B23K26/53 , B23K26/40 , B23K26/38 , B23K26/06 , B23K26/046 , H01L21/78 , B23K101/40 , B23K103/00
摘要： A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.
This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S11 and S12) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the ltd object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S13 and S14) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.
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