公开(公告)号：US20230095425A1

公开(公告)日：2023-03-30

申请号：US17911206

申请日：2021-03-15

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takahide OCHIAI ,  Naota AKIKUSA ,  Kousuke SHIBATA ,  Nobutaka SUZUKI

IPC: H01S5/34 ,  H01S5/02253 ,  H01S5/02325 ,  H01S5/024

Abstract: A quantum cascade laser device includes a QCL element; a lens; and a lens holder having a small-diameter hole, a large-diameter hole, and a counterbore surface. At least a part of a side surface of the lens is fixed to an inner surface of the large-diameter hole in a state where an edge portion of an incident surface of the lens is in contact with the counterbore surface. A central axis of the small-diameter hole is eccentric from that of the large-diameter hole. The side surface of the lens is positioned with respect to the inner surface of the large-diameter hole along a direction from the central axis of the large-diameter hole toward the central axis of the small-diameter hole. A central axis of the lens is disposed at a position closer to the central axis of the small-diameter hole than to the central axis of the large-diameter hole.

公开(公告)号：US20230163558A1

公开(公告)日：2023-05-25

申请号：US17911189

申请日：2021-03-15

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takahide OCHIAI ,  Naota AKIKUSA ,  Kousuke SHIBATA ,  Nobutaka SUZUKI

IPC: H01S5/02257 ,  H01S5/02253 ,  H01S5/02216 ,  H01S5/00

CPC classification number: H01S5/02257 ,  H01S5/0064 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/3402

Abstract: A quantum cascade laser device includes a QCL element and a package. A light-emitting window through which laser light emitted from the QCL element passes is provided on a side wall of the package. The light-emitting window includes a small-diameter hole, a large-diameter hole larger than the small-diameter hole, a counterbore surface having an annular shape that connects the small-diameter hole and the large-diameter hole, and a window member disposed inside the large-diameter hole. An incident surface of a window member includes a first region in which an anti-reflection film is provided, and a second region metallized and formed in an annular shape to be separated from the first region and to surround the first region. The second region is joined to the counterbore surface through a solder member.

公开(公告)号：US20240030678A1

公开(公告)日：2024-01-25

申请号：US18033623

申请日：2021-07-15

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Nobutaka SUZUKI ,  Naota AKIKUSA ,  Tadataka EDAMURA

IPC: H01S5/024 ,  H01S5/34 ,  H01S5/02315

CPC classification number: H01S5/02423 ,  H01S5/3401 ,  H01S5/02315

Abstract: In a semiconductor laser device, a supply path that guides a cooling fluid supplied from a supply port side, toward a disposition region, spray holes that spray the cooling fluid guided by the supply path, from below the disposition region, and a discharge path that guides the cooling fluid sprayed from the spray holes, toward a discharge port are provided within a body portion of a heat sink. The spray holes are disposed along a resonance direction of a semiconductor laser element disposed in the disposition region, and the discharge path extends in a direction intersecting with the resonance direction of the semiconductor laser element disposed in the disposition region.