-
公开(公告)号：USD951259S1
公开(公告)日：2022-05-10
申请号：US29819178
申请日：2021-12-13
设计人： Yinggang Du , Keith J. Kuehn , John P. Franz , Alan B. Doerr
-
公开(公告)号：USD939510S1
公开(公告)日：2021-12-28
申请号：US29662780
申请日：2018-09-07
设计人： Yinggang Du , Keith J. Kuehn , John P. Franz , Alan B. Doerr
-
公开(公告)号：US20190025896A1
公开(公告)日：2019-01-24
申请号：US16139109
申请日：2018-09-24
发明人： Thomas Robert Bowden , Alan B. Doerr , John Franz , Melvin K. Benedict , Joseph Allen , John Norton , Binh Nguyen
IPC分类号： G06F1/20 , G06F13/42 , G06F1/18 , H01L23/40 , H01L23/367
CPC分类号： G06F1/206 , G06F1/185 , G06F1/20 , G06F13/42 , H01L23/367 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.
-
-
搜索结果
3 条记录 (耗时 0.016 秒)
