公开(公告)号：US09713285B2

公开(公告)日：2017-07-18

申请号：US14780482

申请日：2013-03-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Tahir Cader ,  Niru Kumari ,  John Franz ,  Cullen E. Bash ,  David A. Moore ,  Sergio Escobar-Vargas

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  F28D15/04 ,  F28D15/06 ,  F28D21/00

CPC classification number: H05K7/20263 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/04 ,  F28D15/06 ,  F28D2021/0028 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/427 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20836 ,  Y02D10/16

Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.

公开(公告)号：USD752053S1

公开(公告)日：2016-03-22

申请号：US29533984

申请日：2015-07-23

Applicant: Hewlett-Packard Development Company, L.P.

Designer： John Franz ,  Chris F. Felcman ,  Belgie B. McClelland ,  Keith J. Kuehn ,  Robert J. Kelley

公开(公告)号：USD741868S1

公开(公告)日：2015-10-27

申请号：US29482442

申请日：2014-02-18

Applicant: Hewlett-Packard Development Company, L.P.

Designer： John Franz ,  Chris F. Felcman ,  Belgie B. McClelland ,  Keith J. Kuehn ,  Robert J. Kelley

公开(公告)号：USD751562S1

公开(公告)日：2016-03-15

申请号：US29533983

申请日：2015-07-23

Applicant: Hewlett-Packard Development Company, L.P.

Designer： John Franz ,  Chris F. Felcman ,  Belgie B. McClelland ,  Keith J. Kuehn ,  Robert J. Kelley

公开(公告)号：US20160066472A1

公开(公告)日：2016-03-03

申请号：US14780482

申请日：2013-03-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Tahir Cader ,  Niru Kumari ,  John Franz ,  Cullen E. Bash ,  David A. Moore ,  Sergio Escobar-Vargas

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/04 ,  F28D15/06 ,  F28D2021/0028 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/427 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20836 ,  Y02D10/16

Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.

Abstract translation: 根据一个实例，冷却系统包括冷却流体储存器，与冷却流体储存器流体连通的冷却装置，具有与发热部件的一部分热接触的一侧的室，其中由 冷却装置将通过从发热部件接收热量，一定距离并与腔室分离的冷却板加热，以及连接腔室和冷却板的冷却流体管，其中加热的冷却流体为 流经冷却流体管至冷却板。 冷却板也将与热交换器热接触，热交换器是从冷却流体中除去热量。