公开(公告)号：US20150216056A1

公开(公告)日：2015-07-30

申请号：US14422477

申请日：2013-08-15

Applicant: HITACHI METALS, LTD.

Inventor： Hiroyuki Teshima ,  Hisayuki Imamura ,  Junichi Watanabe

IPC: H05K3/02 ,  B23K1/00 ,  B23K1/19

CPC classification number: H05K3/022 ,  B23K1/0016 ,  B23K1/19 ,  C04B37/026 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/68 ,  C04B2237/70 ,  C23F1/02 ,  C23F1/30 ,  C23F1/44 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/26 ,  H05K2203/04 ,  H05K2203/0766 ,  Y10T428/12056

Abstract: A method for producing a ceramic circuit substrate comprising the steps of forming brazing regions each comprising brazing material powder and an organic binder on a ceramic substrate; setting metal plates on the ceramic substrate via the brazing regions, and heating the ceramic substrate, the brazing regions and the metal plates to bond the metal plates to the ceramic substrate via brazing layers made of the brazing material, thereby forming a bonded body; and cleaning the bonded body with a hypochlorite-containing agent.

Abstract translation: 一种陶瓷电路基板的制造方法，其特征在于，在陶瓷基板上形成各自包含钎焊材料粉末和有机粘合剂的钎焊区域， 通过钎焊区域在陶瓷基板上设置金属板，加热陶瓷基板，钎焊区域和金属板，通过由钎焊材料制成的钎焊层将金属板接合到陶瓷基板，从而形成接合体; 并用含次氯酸盐的试剂清洗粘结体。

公开(公告)号：US10057992B2

公开(公告)日：2018-08-21

申请号：US14422477

申请日：2013-08-15

Applicant: HITACHI METALS, LTD.

Inventor： Hiroyuki Teshima ,  Hisayuki Imamura ,  Junichi Watanabe

IPC: B23K31/02 ,  H05K3/02 ,  C23F1/02 ,  C23F1/44 ,  C23F1/30 ,  B23K1/00 ,  B23K1/19 ,  C04B37/02 ,  H05K3/06 ,  H05K3/26 ,  H05K1/03

CPC classification number: H05K3/022 ,  B23K1/0016 ,  B23K1/19 ,  C04B37/026 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/68 ,  C04B2237/70 ,  C23F1/02 ,  C23F1/30 ,  C23F1/44 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/26 ,  H05K2203/04 ,  H05K2203/0766 ,  Y10T428/12056

Abstract: A method for producing a ceramic circuit substrate comprising the steps of forming brazing regions each comprising brazing material powder and an organic binder on a ceramic substrate; setting metal plates on the ceramic substrate via the brazing regions, and heating the ceramic substrate, the brazing regions and the metal plates to bond the metal plates to the ceramic substrate via brazing layers made of the brazing material, thereby forming a bonded body; and cleaning the bonded body with a hypochlorite-containing agent.