公开(公告)号：US20240063088A1

公开(公告)日：2024-02-22

申请号：US17889511

申请日：2022-08-17

Applicant: Hamilton Sundstrand Corporation

Inventor： Yongduk Lee ,  Ankit Gupta ,  Parag M. Kshirsagar

IPC: H01L23/44 ,  H01L23/473 ,  H05K7/20 ,  H05K1/02

CPC classification number: H01L23/445 ,  H01L23/473 ,  H05K7/20272 ,  H05K1/0203 ,  H05K7/20236

Abstract: Embodiments have two approaches as follows: (1) Embedded PCB-based fabrication and (2) PCB assembly-based fabrication. An embedded printed circuit board (PCB) type approach involves the creation of a space of coolant direct interconnection, using immersion cooling to link on any type of power semiconductor device hot spots to convectively and evaporatively cool directly. This means fabricating PCB embedded channels, to utilize the microgap between die and PCB as the cooling channel. A printed circuit board (PCB) assembly embodiment includes a PCB having at least one heat generating component. A lid is mounted to the PCB, wherein the lid defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path.

公开(公告)号：US20240015881A1

公开(公告)日：2024-01-11

申请号：US17861584

申请日：2022-07-11

Applicant: Raytheon Technologies Corporation ,  Hamilton Sundstrand Corporation

Inventor： Yongduk Lee ,  Parag M. Kshirsagar ,  Ankit Gupta

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0209 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/064

Abstract: A printed circuit board (PCB) assembly includes a first PCB including at least one heat generating component. A second PCB is mounted to the first PCB. The second PCB defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path. A plurality of power pillars extend from the first PCB and across the cooling path.

公开(公告)号：US12261098B2

公开(公告)日：2025-03-25

申请号：US17889511

申请日：2022-08-17

Applicant: Hamilton Sundstrand Corporation

Inventor： Yongduk Lee ,  Ankit Gupta ,  Parag M. Kshirsagar

IPC: H01L23/44 ,  H01L23/473 ,  H05K1/02 ,  H05K7/20

Abstract: Embodiments have two approaches as follows: (1) Embedded PCB-based fabrication and (2) PCB assembly-based fabrication. An embedded printed circuit board (PCB) type approach involves the creation of a space of coolant direct interconnection, using immersion cooling to link on any type of power semiconductor device hot spots to convectively and evaporatively cool directly. This means fabricating PCB embedded channels, to utilize the microgap between die and PCB as the cooling channel. A printed circuit board (PCB) assembly embodiment includes a PCB having at least one heat generating component. A lid is mounted to the PCB, wherein the lid defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path.

公开(公告)号：US12213240B2

公开(公告)日：2025-01-28

申请号：US17946160

申请日：2022-09-16

Applicant: Hamilton Sundstrand Corporation

Inventor： Yongduk Lee ,  Ankit Gupta ,  Abbas A. Alahyari ,  Parag M. Kshirsagar

IPC: H05K1/02 ,  H05K3/30

Abstract: Direct pin-fin cooling assemblies are disclosed for a high-power printed circuit boards (PCBs). The disclosure can solve the classical coldplate problem associated with liquid cooling of high-power PCBs namely: (1) Inhomogeneous cooling due to the calorimetric heating up of the coolant, (2) thermal interface material (TIM) related quality issues such as dry-out effects, (3) high cost due to complicated metal coldplate structure, and (4) low thermal conductivity due to multi-layer structure. This includes incorporating pin-fin direct cooling into high-power PCB structures without additional coldplate structure or TIM. In this approach, a TIM and a top plate of coldplate can be removed. Thus, the cooling performance can be improved because the thermal conductivity between a liquid coolant and a power device is increased.

公开(公告)号：US11670967B1

公开(公告)日：2023-06-06

申请号：US17739809

申请日：2022-05-09

Applicant: Hamilton Sundstrand Corporation

Inventor： Yongduk Lee ,  Ankit Gupta ,  Parag M. Kshirsagar

IPC: H02J50/10 ,  H02J50/80 ,  H03K17/14 ,  H05K7/20 ,  H02J50/12 ,  H03K17/687

CPC classification number: H02J50/10 ,  H02J50/12 ,  H02J50/80 ,  H03K17/145 ,  H03K17/687 ,  H05K7/20254 ,  H05K7/20372

Abstract: A device can include a first circuit configured to be exposed to a first environment, the first circuit comprising one or more first transfer inductors, and a second circuit isolated from the first circuit and configured to be exposed to a second environment, the second circuit comprising one or more second transfer inductors. The second environment can be a harsh environment. The first circuit and the second circuit can be wirelessly coupled via the one or more first transfer inductors and the one or more second transfer inductors to allow transfer of power and/or signals between the first circuit and the second circuit.