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公开(公告)号：US20220200268A1
公开(公告)日：2022-06-23
申请号：US17133499
申请日：2020-12-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Xin Wu , Bo Liu , Parag M. Kshirsagar
Abstract: A solid state circuit breaker comprising, includes a first switch unit including, a first switch configured to be connected to a first terminal, a second switch connected to the first switch configured to be connected to a second terminal, a third switch connected to the second switch and configured to be connected to the second terminal, a fourth switch connected to the first switch and configured to be connected to the first terminal, and a fifth switch joining a connection of the first switch and the second switch to the connection of the third switch and the fourth switch.
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公开(公告)号：US11218086B2
公开(公告)日：2022-01-04
申请号：US16827528
申请日：2020-03-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Bo Liu , Xin Wu , Yongduk Lee
IPC: H02M7/5395 , H02M7/487 , H02M7/5387 , H02P27/14 , H02P6/08 , H02M3/335 , H02M1/00
Abstract: A power conversion system includes a hybrid power converter phase unit including three voltage inputs, a voltage output, a pair of outer switches between the voltage inputs and voltage output, and a pair of inner switches between the voltage inputs and the outer switches. The power conversion system includes a controller in electrical communication with the inner and outer switches. The controller is configured to selectively disable or enable the inner switches by switching the inner switches OFF or ON. A method includes selectively disabling or enabling inner switches in a hybrid power converter phase unit with a controller such that the hybrid power converter phase unit is a 3-level converter when the inner switches are ON and enabled in a 3-level mode and a 2-level converter when the inner switches are OFF and disabled in a 2-level mode.
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公开(公告)号：US20210347465A1
公开(公告)日：2021-11-11
申请号：US17307416
申请日：2021-05-04
Applicant: Hamilton Sundstrand Corporation
Inventor： Jung Muk Choe , Yongduk Lee , Junsok Yi , Jin Lee , Xin Wu
Abstract: A system comprises a resonant coupling having a first coil and a second coil, wherein the first coil is mounted to a first body that is stationary relative to a second body that is configured to rotate relative to the first body, and wherein the second coil is mounted to the second body to rotate relative to the first coil. The first and second coils are configured so that alternating current in the first coil induces an alternating current in the second coil to transfer electrical power from the first coil to the second coil wirelessly. The first and second coils do not contact one another regardless of whether the first and second bodies rotate relative to one another.
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公开(公告)号：US12261098B2
公开(公告)日：2025-03-25
申请号：US17889511
申请日：2022-08-17
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Ankit Gupta , Parag M. Kshirsagar
IPC: H01L23/44 , H01L23/473 , H05K1/02 , H05K7/20
Abstract: Embodiments have two approaches as follows: (1) Embedded PCB-based fabrication and (2) PCB assembly-based fabrication. An embedded printed circuit board (PCB) type approach involves the creation of a space of coolant direct interconnection, using immersion cooling to link on any type of power semiconductor device hot spots to convectively and evaporatively cool directly. This means fabricating PCB embedded channels, to utilize the microgap between die and PCB as the cooling channel. A printed circuit board (PCB) assembly embodiment includes a PCB having at least one heat generating component. A lid is mounted to the PCB, wherein the lid defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path.
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公开(公告)号：US12213240B2
公开(公告)日：2025-01-28
申请号：US17946160
申请日：2022-09-16
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Ankit Gupta , Abbas A. Alahyari , Parag M. Kshirsagar
Abstract: Direct pin-fin cooling assemblies are disclosed for a high-power printed circuit boards (PCBs). The disclosure can solve the classical coldplate problem associated with liquid cooling of high-power PCBs namely: (1) Inhomogeneous cooling due to the calorimetric heating up of the coolant, (2) thermal interface material (TIM) related quality issues such as dry-out effects, (3) high cost due to complicated metal coldplate structure, and (4) low thermal conductivity due to multi-layer structure. This includes incorporating pin-fin direct cooling into high-power PCB structures without additional coldplate structure or TIM. In this approach, a TIM and a top plate of coldplate can be removed. Thus, the cooling performance can be improved because the thermal conductivity between a liquid coolant and a power device is increased.
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Patent Agency Ranking
公开(公告)号：US11670967B1
公开(公告)日：2023-06-06
申请号：US17739809
申请日：2022-05-09
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Ankit Gupta , Parag M. Kshirsagar
CPC classification number: H02J50/10 , H02J50/12 , H02J50/80 , H03K17/145 , H03K17/687 , H05K7/20254 , H05K7/20372
Abstract: A device can include a first circuit configured to be exposed to a first environment, the first circuit comprising one or more first transfer inductors, and a second circuit isolated from the first circuit and configured to be exposed to a second environment, the second circuit comprising one or more second transfer inductors. The second environment can be a harsh environment. The first circuit and the second circuit can be wirelessly coupled via the one or more first transfer inductors and the one or more second transfer inductors to allow transfer of power and/or signals between the first circuit and the second circuit.
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公开(公告)号：US20220393585A1
公开(公告)日：2022-12-08
申请号：US17342229
申请日：2021-06-08
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Xin Wu , Parag M. Kshirsagar , Bo Liu
Abstract: Systems and methods of operating for a smart power router for boosting and protection are provided. Aspects include a power router comprising a plurality of terminals, a first DC power supply coupled to the first terminal, a second DC power supply coupled to the second terminal, a first power converter, an interface bi-directional switch coupled between the first terminal and the second terminal, a first bi-directional switch coupled between the first terminal and the third terminal, the first bi-directional switch comprising a first transistor and a second transistor, a first RL circuit, a controller configured to operate the power router in a plurality of modes comprising a first voltage boosting mode, wherein operating the power router in the first voltage boosting mode comprises operating the interface bi-directional switch in an on state, operating the first transistor in an off state, and operating the second transistor in a switching state.
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公开(公告)号：US20210351770A1
公开(公告)日：2021-11-11
申请号：US17246839
申请日：2021-05-03
Applicant: Hamilton Sundstrand Corporation
Inventor： Bo Liu , Yongduk Lee , Xin Wu
IPC: H03K17/082 , H02H1/00 , H03K5/01
Abstract: A desaturation protection circuit is provided. Aspects includes a main gate driver circuit driving a gate for a switch, a desaturation gate driver circuit coupled to a drain terminal of the switch, a PWM signal supply circuit configured to supply a PWM signal to the desaturation gate driver circuit, and a delay circuit, the delay circuit configured to delay the PWM signal from the PWM signal supply circuit to the desaturation gate driver circuit during a turn-on event for the switch.
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公开(公告)号：US12193201B2
公开(公告)日：2025-01-07
申请号：US17847769
申请日：2022-06-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Jin Lee , Yongduk Lee , Parag M. Kshirsagar
IPC: H05K7/20
Abstract: The present disclosure provides for cooling systems, assemblies and methods (e.g., for semiconductor devices; for refrigerant cooling; for cryogenic cooling). More particularly, the present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods for semiconductor devices (e.g., wide-bandgap (WBG) power semiconductor devices), with the cooling assemblies, systems and methods utilizing three-dimensional adaptive flow-paths using bi-metal fins. The present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods that may improve cooling performance and/or enable local cooling control. The present disclosure provides for bi-metal strips that operate as both the surface-temperature sensors and actuators without input energy. The bi-metal strips guide the coolant flow to a low-drag channel when the surface temperature is low, and guide the coolant flow to the near-surface channel when the surface temperature is high.
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公开(公告)号：US12088108B2
公开(公告)日：2024-09-10
申请号：US17342229
申请日：2021-06-08
Applicant: Hamilton Sundstrand Corporation
Inventor： Yongduk Lee , Xin Wu , Parag M. Kshirsagar , Bo Liu
CPC classification number: H02J4/00 , B64D41/00 , B64D2221/00 , H02M3/155
Abstract: Systems and methods of operating for a smart power router for boosting and protection are provided. Aspects include a power router comprising a plurality of terminals, a first DC power supply coupled to the first terminal, a second DC power supply coupled to the second terminal, a first power converter, an interface bi-directional switch coupled between the first terminal and the second terminal, a first bi-directional switch coupled between the first terminal and the third terminal, the first bi-directional switch comprising a first transistor and a second transistor, a first RL circuit, a controller configured to operate the power router in a plurality of modes comprising a first voltage boosting mode, wherein operating the power router in the first voltage boosting mode comprises operating the interface bi-directional switch in an on state, operating the first transistor in an off state, and operating the second transistor in a switching state.
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