BST on low-loss substrates for frequency agile applications
    1.
    发明授权
    BST on low-loss substrates for frequency agile applications 失效
    BST用于频率敏捷应用的低损耗衬底

    公开(公告)号:US06764864B1

    公开(公告)日:2004-07-20

    申请号:US10418372

    申请日:2003-04-17

    IPC分类号: H01L2100

    摘要: An exemplary system and method for providing a microwave regime, frequency-agile device is disclosed as comprising inter alia: a low-loss, insulating substrate (200); a layer of SiO2 (210) over the surface of said substrate; and a layer of BST (220) deposited over the SiO2 layer (210). Disclosed features and specifications may be variously controlled, configured, adapted or otherwise optionally modified to further improve or otherwise optimize frequency response or other material characteristics. Exemplary embodiments of the present invention representatively provide for integrated high-efficiency, low-loss microwave components that may be readily incorporated with existing technologies for the improvement of frequency response, device package form factors, weights and/or other manufacturing, device or material performance metrics.

    摘要翻译: 公开了一种用于提供微波状态的频率敏捷装置的示例性系统和方法,其特别包括:低损耗绝缘基板(200); 在所述衬底的表面上的SiO 2层(210); 以及沉积在SiO 2层(210)上的BST(220)层。 公开的特征和规范可以被不同地控制,配置,适配或以其他方式任意地修改,以进一步改进或以其它方式优化频率响应或其他材料特性。 本发明的示例性实施例代表性地提供了集成的高效率低损耗微波部件,其可以容易地与用于改进频率响应,装置包装形状因子,重量和/或其他制造,装置或材料性能的现有技术结合 指标