公开(公告)号：US06639488B2

公开(公告)日：2003-10-28

申请号：US09948478

申请日：2001-09-07

申请人： Hariklia Deligianni ,  Robert Groves ,  Christopher Jahnes ,  Jennifer L. Lund ,  Panayotis Andricacos ,  John Cotte ,  L. Paivikki Buchwalter ,  David Seeger ,  Raul E. Acosta

发明人： Hariklia Deligianni ,  Robert Groves ,  Christopher Jahnes ,  Jennifer L. Lund ,  Panayotis Andricacos ,  John Cotte ,  L. Paivikki Buchwalter ,  David Seeger ,  Raul E. Acosta

IPC分类号： H01P110

CPC分类号： H01P1/12 ,  H01H59/0009 ,  H01H2059/0036

摘要： Disclosed is a capacitive electrostatic MEMS RF switch comprised of a lower electrode that acts as both a transmission line and as an actuation electrode. Also, there is an array of one or more fixed beams above the lower electrode that is connected to ground. The lower electrode transmits the RF signal when the top beam or beams are up and when the upper beams are actuated and bent down, the transmission line is shunted to ground ending the RF transmission. A high dielectric constant material is used in the capacitive portion of the switch to achieve a high capacitance per unit area thus reducing the required chip area and enhancing the insertion loss characteristics in the non-actuated state. A gap between beam and lower electrode of less than 1 &mgr;m is incorporated in order to minimize the electrostatic potential (pull-in voltage) required to actuate the switch.

摘要翻译： 公开了一种电容静电MEMS RF开关，其由作为传输线和致动电极两者的下电极组成。 此外，在下电极上方有一个或多个连接到地面的固定梁的阵列。 当顶部梁或梁向上时，下部电极发射RF信号，并且当上部梁被致动并向下弯曲时，传输线被分流到结束RF传输的地面。 在开关的电容部分中使用高介电常数材料以实现每单位面积的高电容，从而在非致动状态下减少所需的芯片面积并增强插入损耗特性。 引入小于1um的光束和下电极之间的间隙以便使致动开关所需的静电电位（拉入电压）最小化。

公开(公告)号：US20050156695A1

公开(公告)日：2005-07-21

申请号：US11053732

申请日：2005-02-08

申请人： Panayotis Andricacos ,  L. Buchwalter ,  Hariklia Deligianni ,  Robert Groves ,  Christopher Jahnes ,  Jennifer Lund ,  Michael Meixner ,  David Seeger ,  Timothy Sullivan ,  Ping-Chuan Wang

发明人： Panayotis Andricacos ,  L. Buchwalter ,  Hariklia Deligianni ,  Robert Groves ,  Christopher Jahnes ,  Jennifer Lund ,  Michael Meixner ,  David Seeger ,  Timothy Sullivan ,  Ping-Chuan Wang

IPC分类号： H01H59/00 ,  H01H57/00 ,  H01L41/08 ,  H02N1/00

CPC分类号： H01H59/0009 ,  H01H2001/0078

摘要： A microelectromechanical switch including: at least one pair of actuator electrodes; at least one input electrode and at least one output electrode for input and output, respectively, of a radio frequency signal; and a beam movable by an attraction between the at least one pair of actuator electrodes, the movable beam having at least a portion electrically connected to the at least one input electrode and to the at least one output electrode when moved by the attraction between the at least one pair of actuator electrodes to make an electrical connection between the at least one input and output electrodes; wherein the at least one pair of actuator electrodes are electrically isolated from each of the at least one input and output electrodes. The microelectromechanical switch can be configured in single or multiple-poles and/or single or multiple throws.

公开(公告)号：US20070210446A1

公开(公告)日：2007-09-13

申请号：US11735155

申请日：2007-04-13

申请人： Paul Andry ,  Evan Colgan ,  Lawrence Mok ,  Chirag Patel ,  David Seeger

发明人： Paul Andry ,  Evan Colgan ,  Lawrence Mok ,  Chirag Patel ,  David Seeger

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

摘要翻译： 提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。 电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。 此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

公开(公告)号：US20060103011A1

公开(公告)日：2006-05-18

申请号：US10987985

申请日：2004-11-12

申请人： Paul Andry ,  Evan Colgan ,  Lawrence Mok ,  Chirag Patel ,  David Seeger

发明人： Paul Andry ,  Evan Colgan ,  Lawrence Mok ,  Chirag Patel ,  David Seeger

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

公开(公告)号：US20060043002A1

公开(公告)日：2006-03-02

申请号：US11207566

申请日：2005-08-19

申请人： Bryan Petrinec ,  David Seeger

发明人： Bryan Petrinec ,  David Seeger

IPC分类号： C10G45/00

CPC分类号： C01B17/033 ,  C10L3/10

摘要： Sulfur sought to be removed from deposits formed at a subterranean gas producing well are dissolved in a high boiling point relatively pure and low cost non-aqueous solvent. The dissolved sulfur is then removed from the solvent by lowering the temperature of the solution to precipitate the sulfur which is then separated and recovered as a relatively pure product. After additional processing the regenerated solvent is injected back down the well hole to dissolve additional sulfur and reutilized in successive cycles of the process.

摘要翻译： 试图从在地下产气井形成的沉积物中除去的硫溶解在高沸点相对纯的和低成本的非水溶剂中。 然后通过降低溶液的温度将溶解的硫从溶剂中除去以沉淀出硫，然后将其分离和回收为相对纯的产物。 经额外处理后，将再生溶剂从井孔注回，以溶解额外的硫并在该方法的连续循环中重新使用。