摘要:
Test equipment provides interrupt capability to automatic testing as a means of actively controlling temperature of the device under test. A processor coupled to memory is responsive to computer-executable instructions contained in the memory. A test socket is coupled to a device under test and coupled to the processor. The processor is configured to interrupt an application pattern running on the device under test. In response to interrupting the application pattern, the processor is configured to cause a control pattern to run on the device under test and then cause the application pattern to restart running from the point of interruption on the device under test.
摘要:
Test equipment provides interrupt capability to automatic testing as a means of actively controlling temperature of the device under test. A processor coupled to memory is responsive to computer-executable instructions contained in the memory. A test socket is coupled to a device under test and coupled to the processor. The processor is configured to interrupt an application pattern running on the device under test. In response to interrupting the application pattern, the processor is configured to cause a control pattern to run on the device under test and then cause the application pattern to restart running from the point of interruption on the device under test.
摘要:
According to the present invention, a method of controlling the burning in of at least one I/C device in a burn in tool is provided. For high power device, the tool has a heat sink positioned to contact each device being burned in, and has a socket for mounting each device to be burned in, and a power source to supply electrical current to burn in each device. The method includes the steps of continuously monitoring at least one process parameter selected from the group of current, voltage, power and temperature, and varying the voltage to maintain at least one of the parameters at or below a given value. Also, a technique for burning in low power devices without a heat sink is provided. The invention also contemplates a tool for performing the above method.
摘要:
An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burning to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation. Evacuation also provides atmospheric pressure augmentation of contact for connection between boards and contact to wafer. Probes for parallel testing of chips are arranged in crescent shaped stripes to significantly increase tester throughput as compared with probes arranged in an area array.
摘要:
A method of assigning replacement rows and colums in a two dimensionally redundant array in which if the number of failures along a row exceeds the number of remaining redundant columns, then replacing that row with one of the redundant rows. The process is repeated in the opposite direction with the number of remaining redundant rows and columns being properly decremented. The process of reversing directions continues until the above condition is no longer satisfied.
摘要:
Disclosed is an integrated circuit chip test apparatus that has a module test fixture having contact pads that are adapted to make contact with signal input/output pins on an integrated circuit chip being tested. An intermediate banking box is connected to the module text fixture and a tester is connected to the intermediate banking box. The tester includes at least one bank of channels there are more pins on the integrated circuit chip than there are channels in the tester. The intermediate banking box includes switches that are connected between the contact pads and the channels. The switches are adapted to selectively connect a subset of the contact pads to the channels to connect the tester to a subset of pins, thereby allowing the tester to test a portion of the integrated circuit that corresponds to the subset of pins.