Method of fabricating patterned CZT and CdTe devices
    3.
    发明授权
    Method of fabricating patterned CZT and CdTe devices 有权
    制造图案化CZT和CdTe器件的方法

    公开(公告)号:US08476101B2

    公开(公告)日:2013-07-02

    申请号:US12654646

    申请日:2009-12-28

    IPC分类号: H01L21/00

    摘要: A method of making a semiconductor radiation detector includes the steps of providing a semiconductor substrate having front and rear major opposing surfaces, forming a solder mask layer over the rear major surface, patterning the solder mask layer into a plurality of pixel separation regions, and after the step of patterning the solder mask layer, forming anode pixels over the rear major surface. Each anode pixel is formed between adjacent pixel-separation regions and a cathode electrode is located over the front major surface of the substrate. The solder mask can be used as a permanent photoresist in developing patterned electrodes on CdZnTe/CdTe devices as well as a permanent reliability protection coating. The method is very robust and ensures long-term reliability, outstanding detector performance, and may be used in applications such as medical imaging and for demanding other highly spectroscopic applications.

    摘要翻译: 制造半导体辐射检测器的方法包括以下步骤:提供具有前和后主要相对表面的半导体衬底,在后主表面上形成焊接掩模层,将焊接掩模层图案化成多个像素分离区域,之后 图案化焊料掩模层的步骤,在后主表面上形成阳极像素。 每个阳极像素形成在相邻像素分离区域之间,阴极电极位于衬底的前主表面上方。 焊接掩模可以用作CdZnTe / CdTe器件上的图案化电极中的永久性光刻胶,以及永久可靠性保护涂层。 该方法非常强大,确保了长期的可靠性,出色的检测器性能,可用于医疗成像和苛刻的其他高光谱应用。

    Solid-state radiation detector with improved sensitivity
    4.
    发明授权
    Solid-state radiation detector with improved sensitivity 有权
    固态放射线检测器灵敏度提高

    公开(公告)号:US08614423B2

    公开(公告)日:2013-12-24

    申请号:US12364042

    申请日:2009-02-02

    IPC分类号: G01T1/24 H01L27/146

    摘要: A radiation detector includes a semiconductor substrate having opposing front and rear surfaces, a cathode electrode located on the front surface of the semiconductor substrate configured so as to receive radiation, and a plurality of anode electrodes formed on the rear surface of said semiconductor substrate. A work function of the cathode electrode material contacting the front surface of the semiconductor substrate is lower than a work function of the anode electrode material contacting the rear surface of the semiconductor substrate.

    摘要翻译: 辐射检测器包括具有相对的前表面和后表面的半导体衬底,位于半导体衬底的前表面上以便接收辐射的阴极,以及形成在所述半导体衬底的后表面上的多个阳极。 与半导体基板的前表面接触的阴极电极的功函数低于与半导体基板的背面接触的阳极电极材料的功函数。

    Method of fabricating patterned CZT and CdTe devices
    5.
    发明申请
    Method of fabricating patterned CZT and CdTe devices 有权
    制造图案化CZT和CdTe器件的方法

    公开(公告)号:US20110156198A1

    公开(公告)日:2011-06-30

    申请号:US12654646

    申请日:2009-12-28

    IPC分类号: H01L31/0224 H01L31/18

    摘要: A method of making a semiconductor radiation detector includes the steps of providing a semiconductor substrate having front and rear major opposing surfaces, forming a solder mask layer over the rear major surface, patterning the solder mask layer into a plurality of pixel separation regions, and after the step of patterning the solder mask layer, forming anode pixels over the rear major surface. Each anode pixel is formed between adjacent pixel-separation regions and a cathode electrode is located over the front major surface of the substrate. The solder mask can be used as a permanent photoresist in developing patterned electrodes on CdZnTe/CdTe devices as well as a permanent reliability protection coating. The method is very robust and ensures long-term reliability, outstanding detector performance, and may be used in applications such as medical imaging and for demanding other highly spectroscopic applications.

    摘要翻译: 制造半导体辐射检测器的方法包括以下步骤:提供具有前和后主要相对表面的半导体衬底,在后主表面上形成焊接掩模层,将焊接掩模层图案化成多个像素分离区域,之后 图案化焊料掩模层的步骤,在后主表面上形成阳极像素。 每个阳极像素形成在相邻像素分离区域之间,阴极电极位于衬底的前主表面上方。 焊接掩模可以用作CdZnTe / CdTe器件上的图案化电极中的永久性光刻胶,以及永久可靠性保护涂层。 该方法非常强大,确保了长期的可靠性,出色的检测器性能,可用于医疗成像和苛刻的其他高光谱应用。

    Use of solder mask as a protective coating for radiation detector
    8.
    发明授权
    Use of solder mask as a protective coating for radiation detector 有权
    使用焊接掩模作为辐射探测器的保护涂层

    公开(公告)号:US07589324B2

    公开(公告)日:2009-09-15

    申请号:US11642819

    申请日:2006-12-21

    IPC分类号: G01T1/24

    CPC分类号: G01T1/2928 G01T1/241

    摘要: A radiation detector is described having a semiconductor substrate with opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, a plurality of anode electrodes located on the rear surface of said semiconductor substrate and a solder mask disposed above the anode electrodes. The solder mask has openings extending to the anode electrodes for placing solder in said openings.

    摘要翻译: 描述了一种辐射检测器,其具有具有相对的前后表面的半导体衬底,位于所述半导体衬底的前表面上的阴极电极,位于所述半导体衬底的后表面上的多个阳极电极和设置在所述半导体衬底的上表面上的焊接掩模 阳极电极。 焊接掩模具有延伸到阳极电极的开口,用于将焊料放置在所述开口中。

    Use of solder mask as a protective coating for radiation detector
    9.
    发明申请
    Use of solder mask as a protective coating for radiation detector 有权
    使用焊接掩模作为辐射探测器的保护涂层

    公开(公告)号:US20080149844A1

    公开(公告)日:2008-06-26

    申请号:US11642819

    申请日:2006-12-21

    IPC分类号: G01T1/24

    CPC分类号: G01T1/2928 G01T1/241

    摘要: A radiation detector is described having a semiconductor substrate with opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, a plurality of anode electrodes located on the rear surface of said semiconductor substrate and a solder mask disposed above the anode electrodes. The solder mask has openings extending to the anode electrodes for placing solder in said openings.

    摘要翻译: 描述了一种辐射检测器,其具有具有相对的前后表面的半导体衬底,位于所述半导体衬底的前表面上的阴极电极,位于所述半导体衬底的后表面上的多个阳极电极和设置在所述半导体衬底的上表面上的焊接掩模 阳极电极。 焊接掩模具有延伸到阳极电极的开口,用于将焊料放置在所述开口中。

    ACF attachment for radiation detector
    10.
    发明授权
    ACF attachment for radiation detector 有权
    用于辐射探测器的ACF附件

    公开(公告)号:US08071953B2

    公开(公告)日:2011-12-06

    申请号:US12111413

    申请日:2008-04-29

    IPC分类号: H01L27/146

    摘要: A device includes (a) radiation detector including a semiconductor substrate having opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, and a plurality of anode electrodes on the rear surface of said semiconductor substrate, (b) a printed circuit board, and (c) an electrically conductive polymeric film disposed between circuit board and the anode electrodes. The polymeric film contains electrically conductive wires. The film bonds and electrically connects the printed circuit board and anode electrodes.

    摘要翻译: (a)包括具有相对的前表面和后表面的半导体衬底的放射线检测器,位于所述半导体衬底的前表面上的阴极电极和在所述半导体衬底的后表面上的多个阳极电极,(b) 印刷电路板,以及(c)设置在电路板和阳极之间的导电聚合物膜。 聚合物膜包含导电线。 膜结合并电连接印刷电路板和阳极电极。