Gas sensor and method for the production thereof
    1.
    发明申请
    Gas sensor and method for the production thereof 审中-公开
    气体传感器及其制造方法

    公开(公告)号:US20070062812A1

    公开(公告)日:2007-03-22

    申请号:US10565991

    申请日:2004-07-23

    IPC分类号: G01N27/26

    CPC分类号: G01N27/128

    摘要: The invention relates to a gas sensor comprising a membrane layer (3) formed on a semiconductor substrate (2), an evaluation structure (7) being arranged on said substrate in an evaluation area (8) and a heating structure (9) outside the evaluation area (8), in addition to a gas-sensitive layer (10) arranged above the evaluation structure (7) and the heating structure (9), wherein said gas-sensitive layer (10) can be heated by the heating structure (9) and the electrical resistance of the gas-sensitive layer (10) can be evaluated by the evaluation structure (7). The heating structure (9) is arranged on an adhesion-promoting oxide layer (6) on the top surface of the membrane layer (3) and is separated from the gas-sensitive layer by a cover oxide layer (11). In order to enable reliable functionality of the gas sensor, that in the evaluation area (8), an adhesion-promoting layer (13) insensitive to oxide etching is arranged between the membrane layer (3) and the evaluation structure (7) or the evaluation structure (7) in the evaluation area (8) corresponding to the heating structure (9) is separated from the gas-sensitive layer (10) by the cover oxide layer (11), wherein the cover oxide layer (11) has contact holes (12) which uncover a central area of the surface of the evaluation structure (7) in order to produce a direct contact between the evaluation structure (7) and the gas-sensitive layer (10).

    摘要翻译: 本发明涉及一种气体传感器,包括形成在半导体衬底(2)上的膜层(3),评估结构(7)布置在评估区域(8)和加热结构(9)的所述衬底上 评价区域(8),除了设置在评价结构(7)和加热结构(9)之上的气敏层(10)之外,其中所述气敏层(10)可以被加热结构( 9),气敏层(10)的电阻可以通过评价结构(7)进行评价。 加热结构(9)设置在膜层(3)的上表面上的粘附促进氧化物层(6)上,并通过覆盖氧化物层(11)与气敏层分离。 为了实现气体传感器的可靠功能,在评价区域(8)中,在膜层(3)和评价结构(7)之间设置对氧化物蚀刻不敏感的粘附促进层(13) 对应于加热结构(9)的评价区域(8)的评价结构(7)通过覆盖氧化物层(11)与气体敏感层(10)分离,其中,覆盖氧化物层(11)具有接触 孔(12),其露出评估结构(7)的表面的中心区域,以便产生评估结构(7)和气敏层(10)之间的直接接触。

    Microstructured chemical sensor
    3.
    发明授权
    Microstructured chemical sensor 有权
    微结构化学传感器

    公开(公告)号:US07453254B2

    公开(公告)日:2008-11-18

    申请号:US10565984

    申请日:2004-07-23

    IPC分类号: G01N27/00 G01N27/12

    CPC分类号: G01N27/12 G01N27/128

    摘要: A chemical sensor has a substrate, a first metallization plane on the substrate, an electrode structure formed in the first metallization plane, a passivation layer applied to the first metallization plane and formed with contact holes, a sensitive ceramic layer on the passivation layer and in the contact holes, and a bond-promoting layer configured as a second metallization plane and between the passivation layer and the ceramic layer.

    摘要翻译: 化学传感器具有衬底,衬底上的第一金属化平面,形成在第一金属化平面中的电极结构,钝化层施加到第一金属化平面并形成有接触孔,钝化层上的敏感陶瓷层 所述接触孔和构造为第二金属化平面并且在所述钝化层和所述陶瓷层之间的增粘层。

    Microstructured Chemical Sensor
    4.
    发明申请
    Microstructured Chemical Sensor 有权
    微结构化学传感器

    公开(公告)号:US20070234801A1

    公开(公告)日:2007-10-11

    申请号:US10565984

    申请日:2004-07-23

    IPC分类号: G01N27/12

    CPC分类号: G01N27/12 G01N27/128

    摘要: The invention relates to a sensor comprising a first metallization plane located on a substrate (1), a passivation layer (6) that is structured by contact holes (7) and is applied to said substrate and a sensitive ceramic layer (9) formed by thick-film technology on the passivation layer and in the contact holes (7). The aim of the invention is to improve the adhesion of the ceramic layer (9). To achieve this, the sensor is provided with an adhesion promoter layer (8) that is configured as a second metallization plane and is located between the passivation layer (6) and the ceramic layer (9).

    摘要翻译: 本发明涉及一种传感器,其包括位于基板(1)上的第一金属化平面,由接触孔(7)构成的钝化层(6),并被施加到所述基板和敏感陶瓷层(9) 在钝化层和接触孔(7)中的厚膜技术。 本发明的目的是提高陶瓷层(9)的粘合性。 为了实现这一点,传感器设置有被配置为第二金属化平面并且位于钝化层(6)和陶瓷层(9)之间的粘附促进层(8)。

    Method for producing a micromechanical component and mircomechanical component
    5.
    发明授权
    Method for producing a micromechanical component and mircomechanical component 有权
    微机械部件和微机械部件的制造方法

    公开(公告)号:US08207585B2

    公开(公告)日:2012-06-26

    申请号:US12300544

    申请日:2007-04-03

    IPC分类号: H01L29/84

    摘要: A method is provided for producing a micromechanical component and a micromechanical component is provided, particularly a microphone, a micro-loudspeaker or a pressure sensor (an absolute pressure sensor or a relative pressure sensor) having a substrate and having a diaphragm pattern, for the production of the diaphragm pattern, process steps being provided that are compatible only with a circuit that is monolithically integrated into or on the substrate, a sacrificial pattern applied onto the substrate being removed for the production of the diaphragm pattern.

    摘要翻译: 提供了一种用于制造微机械部件并提供微机械部件的方法,特别是麦克风,具有基板并具有光阑图案的微型扬声器或压力传感器(绝对压力传感器或相对压力传感器),用于 膜片图案的生产,仅提供与单片集成到基板中或基板上的电路相兼容的工艺步骤,施加到基板上的牺牲图案被去除以用于生产隔膜图案。

    METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT AND MIRCOMECHANICAL COMPONENT
    8.
    发明申请
    METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT AND MIRCOMECHANICAL COMPONENT 有权
    生产微机电组件和微机电组件的方法

    公开(公告)号:US20090162619A1

    公开(公告)日:2009-06-25

    申请号:US12300544

    申请日:2007-04-03

    IPC分类号: B32B5/02 B44C1/22

    摘要: A method is provided for producing a micromechanical component and a micromechanical component is provided, particularly a microphone, a micro-loudspeaker or a pressure sensor (an absolute pressure sensor or a relative pressure sensor) having a substrate and having a diaphragm pattern, for the production of the diaphragm pattern, process steps being provided that are compatible only with a circuit that is monolithically integrated into or on the substrate, a sacrificial pattern applied onto the substrate being removed for the production of the diaphragm pattern.

    摘要翻译: 提供了一种用于制造微机械部件并提供微机械部件的方法,特别是麦克风,具有基板并具有光阑图案的微型扬声器或压力传感器(绝对压力传感器或相对压力传感器),用于 膜片图案的生产,仅提供与单片集成到基板中或基板上的电路相兼容的工艺步骤,施加到基板上的牺牲图案被去除以用于生产隔膜图案。