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    THERMAL RELIEF PAD
    4.
    发明申请
    THERMAL RELIEF PAD 有权
    热挽垫

    公开(公告)号：US20160330832A1

    公开(公告)日：2016-11-10

    申请号：US15109177

    申请日：2014-01-30

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Mark Vinod Kapoor ,  David W. Engler

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0271 ,  H05K1/0209 ,  H05K1/0228 ,  H05K1/0243 ,  H05K1/116 ,  H05K2201/10159 ,  H05K2201/10189

    Abstract: A printed circuit board (PCB) having a thermal relief pad around at least one via. The thermal relief pad includes at least four thermal cut-outs and at least four conductive bands. The at least four conductive bands are formed between the at least four thermal cut-outs such that adjacent conductive pads are orthogonal to each other. Each pair of mutually opposite conductive bands have substantially equal lengths and each pair of adjacent conductive bands have unequal lengths.

    Abstract translation: 一种印刷电路板（PCB），其具有围绕至少一个通孔的热释放垫。 热释放垫包括至少四个热切口和至少四个导电带。 至少四个导电带形成在至少四个热切口之间，使得相邻的导电焊盘彼此正交。 每对相互相对的导电带具有基本上相等的长度，并且每对相邻的导电带具有不相等的长度。

    Modular server design
    5.
    发明授权
    Modular server design 有权

    公开(公告)号：US11051422B2

    公开(公告)日：2021-06-29

    申请号：US16131441

    申请日：2018-09-14

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： John Norton ,  David W. Engler ,  Hermann Wienchol

    IPC: H05K7/14 ,  G02B6/42

    Abstract: A modular compute platform including an enclosure, a first module including an application specific integrated circuit, the first module being disposed in the enclosure, a second module including an input/output device, the second module being disposed in the enclosure, the input/output device connected to the first module through a first cable, and a third module including a media device disposed in the enclosure, the media device connected to the first module through a second cable.

    SOLDER MASK VOID REGIONS FOR PRINTED CIRCUIT BOARDS
    6.
    发明申请
    SOLDER MASK VOID REGIONS FOR PRINTED CIRCUIT BOARDS 审中-公开

    公开(公告)号：US20200084876A1

    公开(公告)日：2020-03-12

    申请号：US16126424

    申请日：2018-09-10

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： David W. Engler ,  Stephen F. Contreras

    IPC: H05K1/02 ,  H05K3/00 ,  H05K3/28

    Abstract: A printed circuit board having a substrate layer, at least one electrically conductive trace disposed on the substrate layer, and a solder mask layer disposed over the substrate layer and the electrically conductive trace, wherein the solder mask later includes a void region over at least a portion of the electrically conductive trace. Also, a method of optimizing printed circuit board designing including selecting printed circuit board data comprising at least a solder mask layer area, varying the solder mask layer area, determining an insertion loss value for each varied solder mask layer area, comparing the insertion loss values for each varied solder mask layer area, and selecting a solder mask layer area based on the comparing.

    Backup power supply support
    7.
    发明授权
    Backup power supply support 有权

    公开(公告)号：US10261571B2

    公开(公告)日：2019-04-16

    申请号：US15325179

    申请日：2014-10-31

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Edgar Hance ,  David W. Engler ,  Han Wang

    IPC: G06F1/32 ,  G06F1/3287 ,  G06F1/28 ,  G06F1/30 ,  G06F1/3234 ,  G06F1/3296 ,  G06F1/26

    Abstract: Example implementations relate to backup power supply support. For example, a backup power supply support system can include a shared backup power supply controlled by a backup power control module and a support switch coupled to the shared backup power supply. The support switch enables a transition from a primary power supply to the shared backup power supply and the support switch includes system firmware. The system firmware detects a primary power supply compromise, isolates a hardware switch from the shared backup power supply, enables the hardware switch, and transitions to the shared backup power supply.

    BACKUP POWER SUPPLY SUPPORT
    8.
    发明申请
    BACKUP POWER SUPPLY SUPPORT 审中-公开

    公开(公告)号：US20170160789A1

    公开(公告)日：2017-06-08

    申请号：US15325179

    申请日：2014-10-31

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Edgar Hance ,  David W. Engler ,  Han Wang

    IPC: G06F1/32

    CPC classification number: G06F1/3287 ,  G06F1/26 ,  G06F1/28 ,  G06F1/30 ,  G06F1/3275 ,  G06F1/3296

    Abstract: Example implementations relate to backup power supply support. For example, a backup power supply support system can include a shared backup power supply controlled by a backup power control module and a support switch coupled to the shared backup power supply. The support switch enables a transition from a primary power supply to the shared backup power supply and the support switch includes system firmware. The system firmware detects a primary power supply compromise, isolates a hardware switch from the shared backup power supply, enables the hardware switch, and transitions to the shared backup power supply.

    SERVER NODE SHUTDOWN
    10.
    发明申请
    SERVER NODE SHUTDOWN 审中-公开

    公开(公告)号：US20180253131A1

    公开(公告)日：2018-09-06

    申请号：US15760617

    申请日：2015-09-21

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： David F. Heinrich ,  David W. Engler ,  Patrick Raymond ,  William C. Hallowell

    IPC: G06F1/26 ,  G06F1/30 ,  G06F12/0804 ,  G06F11/10

    Abstract: Example implementations relate to a server node shutdown. For example, a system includes a control module and a secondary power supply. The control module includes a detect engine to detect an even that triggers a sequenced shutdown of a server node and prevent execution of the sequenced shutdown and execution of a data transfer. The control module also includes an initiate engine to initiate a data backup process, by a basic input/output system (BIOS) of the server node, to write data from a volatile memory location of the server node to a non-volatile memory location of the server node. The secondary power supply is to support the data backup process.

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