公开(公告)号：US20060027393A1

公开(公告)日：2006-02-09

申请号：US11195965

申请日：2005-08-03

申请人： Hidenori Aonuma ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

发明人： Hidenori Aonuma ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

IPC分类号： H05K1/00 ,  C25D5/02

CPC分类号： H05K3/242 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/28 ,  H05K2201/0969

摘要： The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.

摘要翻译： 本发明提供了一种部分完成的布线电路板组装片，即使在用于使金属片的电镀用引线绝缘的绝缘层中产生针孔时，也能够防止电镀金属在金属片的表面上的沉积。 本发明的组装片100具有金属片1，金属片上的隔室中的多个布线电路板形成区域1A和金属片1上的隔室中形成用于电镀的导线的区域1B。 每个区域1A具有部分完成的布线电路板10。 部分完成的布线电路板10配备有基底绝缘层2，布线图案3和覆盖绝缘层4。 在区域1B中，依次层叠第一绝缘层12，电镀用引线13和第二绝缘层14。 在金属片1中，在引线13下面的部分中形成开口16。

公开(公告)号：US07329817B2

公开(公告)日：2008-02-12

申请号：US11195965

申请日：2005-08-03

申请人： Hidenori Aonuma ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

发明人： Hidenori Aonuma ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

IPC分类号： H01R12/04

CPC分类号： H05K3/242 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/28 ,  H05K2201/0969

摘要： The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet.The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.

摘要翻译： 本发明提供了一种部分完成的布线电路板组装片，即使在用于使金属片的电镀用引线绝缘的绝缘层中产生针孔时，也能够防止电镀金属在金属片的表面上的沉积。 本发明的组装片100具有金属片1，金属片上的隔室中的多个布线电路板形成区域1A和金属片1上的隔室中形成用于电镀的导线的区域1B。 每个区域1A具有部分完成的布线电路板10。 部分完成的布线电路板10配备有基底绝缘层2，布线图案3和覆盖绝缘层4。 在区域1B中，依次层叠第一绝缘层12，电镀用引线13和第二绝缘层14。 在金属片1中，在引线13下面的部分中形成开口16。

公开(公告)号：US20050061542A1

公开(公告)日：2005-03-24

申请号：US10944827

申请日：2004-09-21

申请人： Hidenori Aonuma ,  Yasuhito Ohwaki

发明人： Hidenori Aonuma ,  Yasuhito Ohwaki

IPC分类号： G11B5/60 ,  H05K1/05 ,  H05K1/11 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/38 ,  H05K3/40 ,  H05K3/44 ,  H05K7/02

CPC分类号： H05K3/243 ,  H05K1/056 ,  H05K3/06 ,  H05K3/108 ,  H05K3/244 ,  H05K3/28 ,  H05K3/384 ,  H05K3/388 ,  H05K3/4007 ,  H05K3/44 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/0723

摘要： A producing method of a suspension board with circuit that can permit a terminal portion to be formed by electrolysis plating without exposing a conductor layer to outside and also can reduce the number of processes, and the suspension board with circuit produced by the same producing method. After an insulating base layer 3 is formed on a suspension board 2 in a specific pattern in which a second opening 12 is formed, a thin metal film 13 is formed on an entire surface of the insulating base layer 3 and on a surface of the suspension board 2 including the second opening 12 exposed from the insulating base layer 3.Then, a conductor layer 4 is formed in the form of a wired circuit pattern on the thin metal film 13. Thereafter, the insulating cover layer 10 is formed in such a manner that a pad opening 11 is formed in the insulating cover layer 10 and then a pad portion 16 is formed in the pad opening 11 using the suspension board 2 as a lead portion of the electrolysis plating. Thereafter, a first opening 25 larger than the second opening 12 is formed in the suspension board 2 at a portion thereof corresponding to the second opening 12.

摘要翻译： 一种具有电路的悬挂板的制造方法，其能够通过电解电镀形成端子部，而不会使导体层暴露于外部，并且还可以减少工序数，以及通过相同制造方法制造的电路的悬架板。 在形成有第二开口12的特定图案的悬垂基板2上形成绝缘基底层3之后，在绝缘基底层3的整个表面上和悬浮液的表面上形成薄金属膜13 包括从绝缘基底层3露出的第二开口12.然后，在金属薄膜13上形成布线电路图形形式的导体层4.此后，绝缘覆盖层10形成为 在绝缘覆盖层10中形成焊盘开口11，然后使用悬挂板2作为电解电镀的引导部分在焊盘开口11中形成焊盘部分16。 此后，在悬挂板2的与第二开口12对应的部分处形成有大于第二开口12的第一开口25。

公开(公告)号：US07571540B2

公开(公告)日：2009-08-11

申请号：US11505995

申请日：2006-08-18

申请人： Hidenori Aonuma ,  Yasuhito Ohwaki

发明人： Hidenori Aonuma ,  Yasuhito Ohwaki

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/108 ,  H05K3/243 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/0969 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion to electrically connect the ground connecting portion and the metal supporting board.

摘要翻译： 一种制造具有电路的悬挂板的方法，其中在金属支撑板上形成绝缘基底层之后，在绝缘基底层上形成包括接地布线图案和信号布线图案的导电图案。 然后，在绝缘基底层上形成覆盖导电图案的绝缘覆盖层，使得在绝缘覆盖层中形成第一盖开口部和第二盖开口部。 然后，在从第一盖开口部露出的接地端子的表面和从第二盖开口部露出的接地连接部的表面上形成电解镀层，从地线供电。 此后，在基座开口部分形成金属填充层，以电连接接地连接部分和金属支撑板。

公开(公告)号：US07272889B2

公开(公告)日：2007-09-25

申请号：US11156607

申请日：2005-06-21

申请人： Hidenori Aonuma ,  Yasuhito Ohwaki

发明人： Hidenori Aonuma ,  Yasuhito Ohwaki

IPC分类号： H01K3/10

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/06 ,  H05K3/108 ,  H05K3/243 ,  H05K2201/09554 ,  H05K2201/0969 ,  H05K2203/0323 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer 4 having a base opening portion 3 is formed on a metal board 2 at a ground terminal 13 forming position, and a thin metal film 5 is formed on the metal board 2 exposed in the base opening portion 3 and on the insulating base layer 4. Then, a conductive pattern 7 is formed on the thin metal film 5. Then, an insulating cover layer 9 covering the conductive pattern 7 and having a cover opening portion 8 which correspond in position to the base opening portion 3 is formed on the insulating base layer 4. Then, a metal board opening portion 11 from which the base opening portion 3 and the insulating base layer 4 around it are exposed is formed in the metal board 2. Then, an electrolytic plating layer 12 is formed on each side of the conductive pattern 7 exposed in the cover opening portion 8, feeding electric power from the conductive pattern 7, and a metal filling layer 14 is formed in the metal board opening portion 11, to allow the electrolytic plating layer 12 and the metal board 2 to be conductive with each other.

摘要翻译： 一种具有电路的悬挂板的制造方法，其能够提供减少的工时数量和复杂的用于形成接地端子的工艺，以提供生产成本降低。 在接地端子13的形成位置的金属板2上形成具有基部开口部3的绝缘基底层4，在露出于基部开口部3的绝缘金属板2上形成金属薄膜5， 基层4。 然后，在金属薄膜5上形成导电图案7。 然后，在基底绝缘层4上形成覆盖导电图案7并且具有与基部开口部3相对应的盖开口部8的绝缘覆盖层9。 然后，在金属板2上形成金属基板开口部11，基部开口部3及其周围的绝缘基底层4露出。 然后，在暴露于盖开口部8的导电图案7的两侧形成电解镀层12，从导电图案7供给电力，在金属板开口部11形成有金属填充层14， 以使电解镀层12和金属板2彼此导电。

公开(公告)号：US20070074899A1

公开(公告)日：2007-04-05

申请号：US11505995

申请日：2006-08-18

申请人： Hidenori Aonuma ,  Yasuhito Ohwaki

发明人： Hidenori Aonuma ,  Yasuhito Ohwaki

IPC分类号： H05K1/16

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/108 ,  H05K3/243 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/0969 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A production method of a suspension board with circuit that can form the ground terminal for connection with the ground, while reducing the number of man-hour and complicated processes, and reduce production cost. After an insulating base layer is formed on a metal supporting board in such a manner that the base opening portion is formed in the metal supporting board, a conductive pattern comprising a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion so as to conduct the ground connecting portion and the metal supporting board.

摘要翻译： 具有电路的悬挂板的制造方法，其可以形成用于与地面连接的接地端子，同时减少工时数量和复杂的工艺，并降低生产成本。 在基板开口部分形成在金属支撑板上的金属支撑板上形成绝缘基底层之后，在绝缘基底层上形成包括接地布线图形和信号布线图形的导电图案。 然后，在绝缘基底层上形成覆盖导电图案的绝缘覆盖层，使得在绝缘覆盖层中形成第一盖开口部和第二盖开口部。 然后，在从第一盖开口部露出的接地端子的表面和从第二盖开口部露出的接地连接部的表面上形成电解镀层，从地线供电。 此后，在基部开口部分形成金属填充层，以便导通接地连接部分和金属支撑板。

公开(公告)号：US07129418B2

公开(公告)日：2006-10-31

申请号：US10944827

申请日：2004-09-21

申请人： Hidenori Aonuma ,  Yasuhito Ohwaki

发明人： Hidenori Aonuma ,  Yasuhito Ohwaki

IPC分类号： H05K1/03

CPC分类号： H05K3/243 ,  H05K1/056 ,  H05K3/06 ,  H05K3/108 ,  H05K3/244 ,  H05K3/28 ,  H05K3/384 ,  H05K3/388 ,  H05K3/4007 ,  H05K3/44 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/0723

摘要： A suspension board with circuit permits a terminal portion to be formed by electrolysis plating without exposing a conductor layer to outside and a production method thereof. After an insulating base layer is formed on a suspension board in a specific pattern in which a second opening is formed, a thin metal film is formed on the insulating base layer and on the suspension board including the second opening exposed from the insulating base layer. A conductor layer is formed in the form of a wired circuit pattern on the thin metal film. An insulating cover layer is formed with a pad opening therein, and a pad portion formed in the pad opening using the suspension board as a lead portion of the electrolysis plating. A first opening larger than the second opening is formed in the suspension board at a portion thereof corresponding to the second opening.

摘要翻译： 具有电路的悬挂板允许通过电解电镀形成端子部分而不将导体层暴露于外部及其制造方法。 在形成有第二开口的特定图案的悬垂基板上形成绝缘基底层之后，在绝缘基底层和包括从绝缘基底层露出的第二开口的悬挂基板上形成薄金属膜。 在薄金属膜上以布线电路图案的形式形成导体层。 绝缘覆盖层在其中形成有焊盘开口，并且使用悬挂板形成在焊盘开口中的焊盘部分作为电解电镀的引线部分。 在悬挂板上形成有比第二开口大的第一开口，在其对应于第二开口的部分。

公开(公告)号：US20050282088A1

公开(公告)日：2005-12-22

申请号：US11156607

申请日：2005-06-21

申请人： Hidenori Aonuma ,  Yasuhito Ohwaki

发明人： Hidenori Aonuma ,  Yasuhito Ohwaki

IPC分类号： G03C5/00 ,  H05K1/03 ,  H05K1/05 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/44

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/06 ,  H05K3/108 ,  H05K3/243 ,  H05K2201/09554 ,  H05K2201/0969 ,  H05K2203/0323 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer 4 having a base opening portion 3 is formed on a metal board 2 at a ground terminal 13 forming position, and a thin metal film 5 is formed on the metal board 2 exposed in the base opening portion 3 and on the insulating base layer 4. Then, a conductive pattern 7 is formed on the thin metal film 5. Then, an insulating cover layer 9 covering the conductive pattern 7 and having a cover opening portion 8 which correspond in position to the base opening portion 3 is formed on the insulating base layer 4. Then, a metal board opening portion 11 from which the base opening portion 3 and the insulating base layer 4 around it are exposed is formed in the metal board 2. Then, an electrolytic plating layer 12 is formed on each side of the conductive pattern 7 exposed in the cover opening portion 8, feeding electric power from the conductive pattern 7, and a metal filling layer 14 is formed in the metal board opening portion 11, to allow the electrolytic plating layer 12 and the metal board 2 to be conductive with each other.

摘要翻译： 一种具有电路的悬挂板的制造方法，其能够提供减少的工时数量和复杂的用于形成接地端子的工艺，以提供生产成本降低。 在接地端子13的形成位置的金属板2上形成具有基部开口部3的绝缘基底层4，在露出于基部开口部3的绝缘金属板2上形成金属薄膜5， 基层4。 然后，在金属薄膜5上形成导电图案7。 然后，在基底绝缘层4上形成覆盖导电图案7并且具有与基部开口部3相对应的盖开口部8的绝缘覆盖层9。 然后，在金属板2上形成金属基板开口部11，基部开口部3及其周围的绝缘基底层4露出。 然后，在暴露于盖开口部8的导电图案7的两侧形成电解镀层12，从导电图案7供给电力，在金属板开口部11形成有金属填充层14， 以使电解镀层12和金属板2彼此导电。

公开(公告)号：US06398854B1

公开(公告)日：2002-06-04

申请号：US09501576

申请日：2000-02-10

申请人： Hidenori Aonuma

发明人： Hidenori Aonuma

IPC分类号： C23C1852

CPC分类号： C23C18/44 ,  C23C18/28

摘要： The present invention relates to a chemical solution for forming a silver film on a substrate. This chemical solution has (1) an ammoniac silver nitrate solution; (2) a reducing solution containing a reducing agent and a base component; and (3) an additive containing a compound of a polyvalent metal. This additive is contained in at least one of the ammoniac silver nitrate solution and the reducing solution. The present invention further relates to a process for forming a silver film on a substrate, using the chemical solution. This process includes (a) bringing a hydrochloric acid acidified stannous chloride solution into contact with a surface of the substrate, thereby conducting a pretreatment of the surface; (b) bringing another ammoniac silver nitrate solution into contact with the surface of the substrate; and (c) bringing the ammoniac silver nitrate solution into contact with the reducing solution, on the surface of the substrate, thereby forming the silver film. It becomes possible to form a compact, uniform silver film with a high silver plating rate that allows the obtaining of high-resolution reflected images, excellent adhesion to a glass substrate, and improved corrosion resistance of the silver.

摘要翻译： 本发明涉及在基板上形成银膜的化学溶液。 该化学溶液具有（1）氨硝酸银溶液; （2）含有还原剂和碱成分的还原溶液; 和（3）含有多价金属化合物的添加剂。 该添加剂包含在氨硝酸银溶液和还原溶液中的至少一种中。 本发明还涉及使用该化学溶液在基片上形成银膜的方法。 该方法包括（a）使盐酸酸化的氯化亚锡溶液与基材的表面接触，从而进行表面的预处理; （b）使另一个硝酸银溶液与基材的表面接触; 和（c）使氨硝酸银溶液与还原溶液接触，在基材的表面上形成银膜。 可以形成具有高镀银率的紧凑均匀的银膜，其允许获得高分辨率的反射图像，对玻璃基板的优异的粘附性和改善的银的耐腐蚀性。

公开(公告)号：US5716433A

公开(公告)日：1998-02-10

申请号：US719602

申请日：1996-09-26

申请人： Hidenori Aonuma ,  Shigeki Morimoto

发明人： Hidenori Aonuma ,  Shigeki Morimoto

IPC分类号： C23C18/18 ,  C03C17/10 ,  C23C18/44 ,  C23C18/31

CPC分类号： C23C18/44 ,  C03C17/10 ,  C03C2217/256 ,  C03C2218/11

摘要： The invention relates to a coating liquid for forming a silver film on a substrate. The coating liquid includes a first ammoniacal aqueous solution containing silver nitrate and a second aqueous solution containing a reducer, a strong alkali, and at least one member selected from the group consisting halides and water-soluble proteins. The first and second aqueous solutions are reacted for forming the silver film on the substrate. The silver film formed from the coating liquid is fine and in texture, is superior in adhesion to the substrate, and enables a precise reflection image.

摘要翻译： 本发明涉及一种用于在基材上形成银膜的涂布液。 涂布液包括含有硝酸银的第一氨水溶液和含有还原剂，强碱和选自卤化物和水溶性蛋白质的至少一种的第二水溶液。 使第一和第二水溶液反应以在基底上形成银膜。 由涂布液形成的银膜细小且质感优异，与基板的粘合性优异，能够得到精确的反射图像。