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45 条记录 (耗时 0.028 秒)

    High efficiency fluid mover
    1.
    发明申请
    High efficiency fluid mover 审中-公开
    高效流体动力

    公开(公告)号：US20070177349A1

    公开(公告)日：2007-08-02

    申请号：US11603533

    申请日：2006-11-22

    申请人： Himanshu Pokharna ,  Eric Baugh ,  Eric DiStefano ,  Jason Ku ,  Rajiv Mongia ,  Yoshifumi Nishi ,  Theodore Hill ,  Charles Hill

    发明人： Himanshu Pokharna ,  Eric Baugh ,  Eric DiStefano ,  Jason Ku ,  Rajiv Mongia ,  Yoshifumi Nishi ,  Theodore Hill ,  Charles Hill

    IPC分类号： H05K7/20

    CPC分类号： F04D29/703 ,  F04D17/167 ,  F04D29/281 ,  F04D29/681

    摘要： A fluid mover includes a rotor to transfer momentum with a fluid when operated at a given volumetric flow rate through the rotor. The rotor includes a plurality of enclosed passages to transfer momentum in or out of the fluid as the fluid passes through the enclosed passages in response to rotation of the rotor. The passages are formed with a cross sectional shape and cross sectional dimensions along their entire length sufficient to establish and maintain laminar flow of the fluid along the entire length of the enclosed passages when the fluid is passing through the rotor at the given volumetric flow rate. The fluid mover also includes a housing having at least one inlet and at least one outlet for the fluid.

    摘要翻译： 流体驱动器包括转子，以通过转子的给定体积流速操作时用流体传递动量。 转子包括多个封闭通道，用于随着流体响应于转子的旋转而流过封闭通道而将动量传入或流出流体。 通道沿其整个长度形成横截面形状和横截面尺寸，足以在流体以给定的体积流速通过转子时沿着封闭通道的整个长度建立并保持流体的层流。 流体驱动器还包括具有用于流体的至少一个入口和至少一个出口的壳体。

    Method, apparatus and computer system for providing for the transfer of thermal energy
    2.
    发明申请
    Method, apparatus and computer system for providing for the transfer of thermal energy 审中-公开
    用于提供热能转移的方法，装置和计算机系统

    公开(公告)号：US20070076376A1

    公开(公告)日：2007-04-05

    申请号：US11239987

    申请日：2005-09-30

    申请人： Rajiv Mongia ,  Himanshu Pokharna ,  Eric DiStefano

    发明人： Rajiv Mongia ,  Himanshu Pokharna ,  Eric DiStefano

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method, apparatus and computer system are described for providing for the transfer of heat from electronic components. The computer system includes a frame and an apparatus. The apparatus includes a chassis component with a heat pipe, a heat exchanger, a conduit of tubing, a cold plate, and a pump to provide for the flow of the fluid between the heat exchanger and the cold plate. The heat pipe is thermally coupled between the cold plate and the heat exchanger to provide for the transfer of thermal energy from the cold plate to the heat exchanger independently of the conduit of tubing. The heat pipe may transfer a substantial amount of the thermal energy from the cold plate to the heat exchanger. The heat pipe may operate passively and provide cooling in an ambient manner.

    摘要翻译： 描述了用于提供从电子部件传递热量的方法，装置和计算机系统。 计算机系统包括框架和装置。 该装置包括具有热管的底盘部件，热交换器，管道导管，冷板和泵，以在热交换器和冷板之间提供流体的流动。 热管在冷板和热交换器之间热耦合，以提供独立于管道导管的热能从冷板传递到热交换器。 热管可将大量的热能从冷板传递到热交换器。 热管可以被动地操作并且以环境方式提供冷却。

    IC coolant microchannel assembly with integrated attachment hardware
    9.
    发明申请
    IC coolant microchannel assembly with integrated attachment hardware 有权
    IC冷却液微通道组件，集成附件硬件

    公开(公告)号：US20070076374A1

    公开(公告)日：2007-04-05

    申请号：US11239957

    申请日：2005-09-30

    申请人： Rajiv Mongia ,  Himanshu Pokharna ,  Eric DiStefano ,  Shawn McEuen ,  Brian Wilk

    发明人： Rajiv Mongia ,  Himanshu Pokharna ,  Eric DiStefano ,  Shawn McEuen ,  Brian Wilk

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  F28F3/12 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus includes a microchannel structure that has microchannels formed therein. The microchannels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus further includes a cover positioned on the microchannel structure. The cover has formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of the cover and a second port on a vertical surface of the cover. The cover includes a plurality of tabs. Each tab extends from a respective corner of the cover. The tabs each have an aperture formed therein. The apertures are shaped and sized to receive a fastener.

    摘要翻译： 一种装置包括其中形成微通道的微通道结构。 微通道用于运输冷却剂，并且旨在靠近集成电路以将热量从集成电路传递到冷却剂。 该装置还包括位于微通道结构上的盖。 盖上形成有直角通道，以在盖的下水平表面上的第一端口与盖的垂直表面上的第二端口之间提供流体连通。 盖子包括多个翼片。 每个突舌从盖的相应角延伸。 翼片各自具有形成在其中的孔。 孔的形状和尺寸适于接收紧固件。