利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

62 条记录 (耗时 0.029 秒)

    Tube-joining apparatus and tube-joining method
    1.
    发明申请
    Tube-joining apparatus and tube-joining method 有权
    管接合装置和管接合方法

    公开(公告)号：US20060054275A1

    公开(公告)日：2006-03-16

    申请号：US10525979

    申请日：2003-08-29

    申请人： Hiroaki Sano ,  Masaru Nagashimada ,  Shinji Ishida ,  Satoshi Yamanushi ,  Hideya Fujihara ,  Osamu Sumiya

    发明人： Hiroaki Sano ,  Masaru Nagashimada ,  Shinji Ishida ,  Satoshi Yamanushi ,  Hideya Fujihara ,  Osamu Sumiya

    IPC分类号： B29C65/00 ,  B29C65/78

    CPC分类号： B29C66/7373 ,  A61M39/146 ,  B29C65/2046 ,  B29C65/2076 ,  B29C65/30 ,  B29C65/7802 ,  B29C65/7841 ,  B29C66/1142 ,  B29C66/5221 ,  B29C66/71 ,  B29C66/818 ,  B29C66/857 ,  B29L2023/007 ,  Y10T156/1322 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1744 ,  B29K2027/06

    摘要： A tube-joining apparatus capable of stably and reliably joining tubes where liquid is contained and sealed. In a tube joining apparatus, a first clamp (6) and second clamp (7) for pressing and holding tubes (8, 9) are arranged in a contact state. When a second moving mechanism is driven to separate the second clamp (7) from the first clamp (6), the first clamp (6) is slid on the tubes by a shaft (121) supporting the first clamp (6) in a vertically movable manner and is moved from a first position (P1) to a second position (P2). The tubes are squeezed with a pressing force being gradually increased while the tubes are slid between slants (67, 77) of an engagement portion (68) and second engagement portion (78). Residual liquid in the tubes is removed from inside the tubes by the squeezing operation of the first clamp 6. The tubes from which the residual liquid is removed are cut by a cutting plate (41), the tubes are moved by first and second moving mechanisms, and then the tubes are joined.

    摘要翻译： 一种能够稳定可靠地接合含有液体并密封的管的管接合装置。 在管接合装置中，用于按压和保持管（8,9）的第一夹具（6）和第二夹具（7）以接触状态布置。 当第二移动机构被驱动以将第二夹具（7）与第一夹具（6）分离时，第一夹具（6）通过竖直地支撑第一夹具（6）的轴（121）在管上滑动 并且从第一位置（P 1）移动到第二位置（P 2）。 当管在接合部分（68）和第二接合部分（78）的倾斜（67,77）之间滑动时，挤压力被逐渐增加的挤压力挤压。 通过第一夹具6的挤压操作，从管内部除去管中的残留液体。 通过切割板​​（41）切割除去残留液体的管，通过第一和第二移动机构移动管，然后将管接合。

    Tube connecting apparatus and tube connecting method
    4.
    发明授权
    Tube connecting apparatus and tube connecting method 有权
    管连接装置和管连接方法

    公开(公告)号：US07371305B2

    公开(公告)日：2008-05-13

    申请号：US10525979

    申请日：2003-08-29

    申请人： Hiroaki Sano ,  Masaru Nagashimada ,  Shinji Ishida ,  Satoshi Yamanushi ,  Hideya Fujihara ,  Osamu Sumiya

    发明人： Hiroaki Sano ,  Masaru Nagashimada ,  Shinji Ishida ,  Satoshi Yamanushi ,  Hideya Fujihara ,  Osamu Sumiya

    IPC分类号： B32B37/00 ,  B29C65/00

    CPC分类号： B29C66/7373 ,  A61M39/146 ,  B29C65/2046 ,  B29C65/2076 ,  B29C65/30 ,  B29C65/7802 ,  B29C65/7841 ,  B29C66/1142 ,  B29C66/5221 ,  B29C66/71 ,  B29C66/818 ,  B29C66/857 ,  B29L2023/007 ,  Y10T156/1322 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1744 ,  B29K2027/06

    摘要： A tube-joining apparatus capable of stably and reliably joining tubes where liquid is contained and sealed. In a tube joining apparatus, a first clamp (6) and second clamp (7) for pressing and holding tubes (8, 9) are arranged in a contact state. When a second moving mechanism is driven to separate the second clamp (7) from the first clamp (6), the first clamp (6) is slid on the tubes by a shaft (121) supporting the first clamp (6) in a vertically movable manner and is moved from a first position (P1) to a second position (P2). The tubes are squeezed with a pressing force being gradually increased while the tubes are slid between slants (67, 77) of an engagement portion (68) and second engagement portion (78). Residual liquid in the tubes is removed from inside the tubes by the squeezing operation of the first clamp 6. The tubes from which the residual liquid is removed are cut by a cutting plate (41), the tubes are moved by first and second moving mechanisms, and then the tubes are joined.

    摘要翻译： 一种能够稳定可靠地接合含有液体并密封的管的管接合装置。 在管接合装置中，用于按压和保持管（8,9）的第一夹具（6）和第二夹具（7）以接触状态布置。 当第二移动机构被驱动以将第二夹具（7）与第一夹具（6）分离时，第一夹具（6）通过竖直地支撑第一夹具（6）的轴（121）在管上滑动 并且从第一位置（P 1）移动到第二位置（P 2）。 当管在接合部分（68）和第二接合部分（78）的倾斜（67,77）之间滑动时，挤压力被逐渐增加的挤压力挤压。 通过第一夹具6的挤压操作，从管内部除去管中的残留液体。 通过切割板​​（41）切割除去残留液体的管，通过第一和第二移动机构移动管，然后将管接合。

    Method for manufacturing semiconductor device and semiconductor wafer
    10.
    发明授权
    Method for manufacturing semiconductor device and semiconductor wafer 有权
    制造半导体器件和半导体晶片的方法

    公开(公告)号：US08669190B2

    公开(公告)日：2014-03-11

    申请号：US13366720

    申请日：2012-02-06

    申请人： Kenji Togo ,  Hiroaki Sano

    发明人： Kenji Togo ,  Hiroaki Sano

    IPC分类号： H01L21/461

    CPC分类号： H01L27/14687 ,  H01L21/28518 ,  H01L21/76801 ,  H01L21/76877 ,  H01L27/14636

    摘要： In a method for manufacturing a semiconductor device, a process of providing a semiconductor wafer having a wiring layer having conductive patterns and a plurality of insulation films containing a first insulation film surrounding side surfaces of the conductive patterns are provided. After the process of providing the semiconductor wafer, a process of removing some regions of the plurality of insulation films to form openings is provided. Herein, the first insulation film is disposed to a position closer to the circumference of the semiconductor wafer than a position closest to the outermost circumference of the wafer among the arrangement positions of the conductive patterns.

    摘要翻译： 在制造半导体器件的方法中，提供了具有具有导电图案的布线层的半导体晶片和包含围绕导电图案的侧表面的第一绝缘膜的多个绝缘膜的工艺。 在提供半导体晶片的过程之后，提供去除多个绝缘膜的一些区域以形成开口的过程。 这里，在导电图案的配置位置之中，第一绝缘膜设置在比半导体晶片的圆周更靠近晶片的最外周的位置。