摘要:
A golf club shaft selecting system includes a head speed detecting unit detecting a head speed at impact in a swing of a golfer, a swing tempo detecting unit detecting a swing tempo of the golfer, a chart indicative of a shaft mass and a shaft flex point corresponding to the swing characteristics of each golfer, a selecting unit selecting a golf club shaft suitable for the golfer referring to the chart and based on the head speed and the swing tempo detected by the head speed detecting unit and the swing tempo detecting unit, and a displaying apparatus displaying the golf club shaft selected by the selecting unit.
摘要:
A golf club shaft selecting system includes a head speed detecting unit detecting a head speed at impact in a swing of a golfer, a swing tempo detecting unit detecting a swing tempo of the golfer, a chart indicative of a shaft mass and a shaft flex point corresponding to the swing characteristics of each golfer, a selecting unit selecting a golf club shaft suitable for the golfer referring to the chart and based on the head speed and the swing tempo detected by the head speed detecting unit and the swing tempo detecting unit, and a displaying apparatus displaying the golf club shaft selected by the selecting unit.
摘要:
An optical modulator includes: a semiconductor chip; a waveguide in the semiconductor chip; a traveling wave electrode including an input portion and an output portion, to which a signal is applied for modulating light passing through the waveguide; a power supply line connected to the input portion via a first wire; and a termination resistor connected to the output portion via a second wire. Capacitance between the output portion and a grounding point is larger than capacitance between the input portion and the grounding point.
摘要:
The present invention relates to a random-number generating apparatus and method for generating physical random numbers in accordance with noises randomly generated by a noise generating element, and allows for generating true random numbers at a high speed and uniformizing the generation frequency of each random number value, even in a simplified circuit configuration. The random-number generating apparatus is operable to amplify a waveform based on thermal noises generated in a thermal-noise generating element, and generate a random pulse at the time when the amplified output signal exceeds a given threshold from the state of being less than the threshold. The random-number generating apparatus is also provided with a reference-pulse generator for generating a reference pulse having a constant period, and a timer for measuring a time interval between the reference pulse and the random pulse. The measured value in the timer is output as a random number value.
摘要:
The display computer displays a management screen having a first area and a second area. In the first area, information related to a computer system, and an input object for a work operation that is a user operation for registering a task of a processing to a computer system into a management computer or an object for displaying the input object are displayed. In the second area, a summary view related to at least one task registered into the management computer is displayed. The summary view has a status object for each status of task, the status object includes an object indicating a status and a value indicating a number of tasks of the status. When the management computer detects a modification of a status of each task that has been registered, the display computer updates a value of a number of tasks in the second area.
摘要:
In a conventional adhesive sheet laminated with a die attachment film, the die attachment film sometimes drops off from the die chip at the time of pick-up after die chip formation by dicing a wafer. The present invention provides an adhesive including a (meth)acrylate ester polymer, a urethane acrylate oligomer having 4 or more vinyl groups, and silicone microparticles. Another aspect of the invention, provides a process for producing electronic components, the process including: a wafer-pasting step of pasting a wafer on a surface of a die attachment film of an adhesive sheet; a dicing step of dicing the wafer into die chips; and a pick-up step of peeling the die attachment film from the adhesive layer after the dicing step, and picking up the die chip together with the die attachment film.
摘要:
A mount member (5) has a contact surface (27a) touching the bottom surface of an LED module (3) and protrusions (5a) protruding from the periphery of the contact surface (27a) in the thickness direction of the LED module (3) and regulating sliding motions thereof. A fixing member (6) made of a resilient, plate-like member comprises an opposing pair of flat portions (43) near the contact surface (27a) of the mount member (5) and flat tabs (44) projecting from the flat portions (43) toward the contact surface (27a) touching the upper surface of a substrate (17). The flat portions (43) of the fixing member (6) are fastened to be lower than the top surface of the substrate (17) of the LED module (3). Thus, elastically deformed areas extending from the fastened parts of the flat portions (43) through the flat tabs (44) press the substrate (17) into the mount member (5).
摘要:
The objective is to limit pickup defects when chips with a semi-cured adhesive layer are picked up following dicing by lowering the adhesive strength of an ultraviolet curable adhesive beforehand while improving the cohesive force. Provided is a dicing method for semiconductor wafers with a semi-cured adhesive layer that comprises a process to coat the back surface of semiconductor wafers with a paste-like adhesive and semi-cure the paste-like adhesive in a sheet form using heating or ultraviolet irradiation to form a semi-cured adhesive layer, a gluing process to glue an adhesive sheet, wherein an ultraviolet curable adhesive is laminated on a base film, onto the semi-cured adhesive layer, an ultraviolet irradiation process to apply ultraviolet irradiation to the ultraviolet curable adhesive, and a dicing process to dice the semi-cured adhesive layer glued to the adhesive sheet and the semiconductor wafers.
摘要:
An image processing apparatus, has: a conversion unit that converts input image information including a first color component and a second color component into output image information in which, with regard to each of the color components, the number of gray levels per pixel is smaller than the number of gray levels per pixel in the input image information and a gray level of the input image information is expressed by a gray level value of each pixel and a dot density and in which the size of a dot is different between the first color component and the second color component; and an output unit that outputs the output image information obtained by the conversion unit.
摘要:
A solid electrolytic capacitor includes a valve metal formed with an anodized film; an inner conductive polymer film formed on the anodized film; and an outer conductive polymer film formed on the inner conductive polymer film. The outer conductive polymer film is obtained by: preparing a first polymer solution (PEDOT/PSSA); dissolving a predetermined dissolved substance in a non-aqueous solvent, the predetermined dissolved substance being selected from the group consisting of boric acid, 1-naphthalenesulfonic acid, 2-naphthalenesulfonic acid, 1,3,6-naphthalenetrisulfonic acid, and polystyrenesulfonic acid, and a salt thereof; mixing the dissolved solvent with pure water to obtain an additive solution; adding the additive solution into the first polymer solution to obtain a second polymer solution; and applying the second polymer solution to the inner conductive polymer film.