公开(公告)号：US20090148720A1

公开(公告)日：2009-06-11

申请号：US12390566

申请日：2009-02-23

申请人： Hiroki KITAYAMA ,  Yoshitsugu HORI

发明人： Hiroki KITAYAMA ,  Yoshitsugu HORI

IPC分类号： B32B3/10 ,  B23K31/02

CPC分类号： H01L25/165 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/14 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15763 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  Y10T428/12396 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/014

摘要： An electronic component device includes an electronic component element including a lower surface having a metal surface provided thereon, a metal plate arranged so that a first principal surface thereof faces the lower surface of the electronic component element, and a first solder provided between the lower surface of the electronic component element and the first principal surface of the metal plate, the first solder arranged to connect the electronic component element to the metal plate. At least a portion of a peripheral portion of the first principal surface of the metal plate is located outwardly beyond an outer periphery of the lower surface of the electronic component element. A ridge defined by the first solder is provided in the peripheral portion of the first principal surface of the metal plate along the outer periphery of the lower surface of the electronic component element.

摘要翻译： 一种电子部件装置，包括：电子部件，具有设置有金属表面的下表面;金属板，其配置成使其第一主面朝向所述电子部件的下表面，所述第一焊料设置在所述下表面 所述电子元件和所述金属板的所述第一主表面之间，所述第一焊料布置成将所述电子元件连接到所述金属板。 金属板的第一主表面的周边部分的至少一部分位于外部超过电子部件元件的下表面的外周。 沿着电子元件的下表面的外周，在金属板的第一主表面的周边部分中设置由第一焊料限定的脊。