公开(公告)号：US07980444B2

公开(公告)日：2011-07-19

申请号：US11887740

申请日：2007-05-08

申请人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

发明人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： H05K13/046 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/53174

摘要： An electronic component mounting apparatus includes an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, and the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even when the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant.

摘要翻译： 一种电子部件安装装置，包括用于保持电子部件的电子部件安装头和用于将电子部件压靠电路板的上下装置，并且电子部件被压靠在电路板上，同时从超声波施加超声波振动 电子部件安装头的传感器经由部件保持单元到电子部件，使得电子部件安装到电路板上。 在电子部件安装装置中，电子部件通过来自固定到部件保持单元的加热器的非接触状态的辐射热经由部件保持部被加热，使得即使电热加热器可替换地安装，超声波振动的特性 施加到电子部件可以保持恒定。

公开(公告)号：US20090265924A1

公开(公告)日：2009-10-29

申请号：US11887740

申请日：2007-05-08

申请人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

发明人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

IPC分类号： B23P19/00

CPC分类号： H05K13/046 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/53174

摘要： In an electronic component mounting apparatus including an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even under the condition that the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant.

摘要翻译： 在包括用于保持电子部件的电子部件安装头和用于将电子部件压靠在电路板上的上下装置的电子部件安装装置中，将电子部件压在电路板上，同时从超声波施加超声波振动 电子部件安装头的传感器经由部件保持单元到电子部件，使得电子部件安装到电路板上。 在电子部件安装装置中，电子部件通过来自固定到部件保持单元的加热器的辐射热通过部件保持单元以非接触状态被加热，使得即使在电热加热器可替换地安装的条件下， 施加到电子部件的超声波振动可以保持恒定。

公开(公告)号：US07850056B2

公开(公告)日：2010-12-14

申请号：US12532741

申请日：2008-02-28

申请人： Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Imamura ,  Hiroshi Ebihara ,  Hiroyuki Kobayashi

发明人： Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Imamura ,  Hiroshi Ebihara ,  Hiroyuki Kobayashi

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1, the shape of a center portion 3a of a tool 3 and the shape of an end portion 3b of the tool 3 are changed such that the cross-sectional areas are different, whereby ultrasonic amplitudes 9 in a direction perpendicular to the direction 5 of ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portion 3a of the tool 3 and at the end portion 3b of the tool 3 can be eliminated or reduced.

摘要翻译： 在与超声波振动器1的超声波振动的方向5平行的方向上，工具3的中心部3a的形状和工具3的端部3b的形状变化，使得横截面积 不同之处在于，与超声波振动方向5垂直的方向上的超声波幅度9基本相等。 通过这种方式，可以消除或减少在工具3的中心部分3a和工具3的端部3b之间的超声波振动的差异。

公开(公告)号：US20100065613A1

公开(公告)日：2010-03-18

申请号：US12532741

申请日：2008-02-28

申请人： Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Imamura ,  Hiroshi Ebihara ,  Hiroyuki Kobayashi

发明人： Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Imamura ,  Hiroshi Ebihara ,  Hiroyuki Kobayashi

IPC分类号： B23K1/06 ,  B23K3/00

CPC分类号： H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1, the shape of a center portion 3a of a tool 3 and the shape of an end portion 3b of the tool 3 are changed such that the cross-sectional areas are different, whereby ultrasonic amplitudes 9 in a direction perpendicular to the direction 5 of ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portion 3a of the tool 3 and at the end portion 3b of the tool 3 can be eliminated or reduced.

摘要翻译： 在与超声波振动器1的超声波振动的方向5平行的方向上，工具3的中心部3a的形状和工具3的端部3b的形状变化，使得横截面积 不同之处在于，与超声波振动方向5垂直的方向上的超声波幅度9基本相等。 通过这种方式，可以消除或减少在工具3的中心部分3a和工具3的端部3b之间的超声波振动的差异。

公开(公告)号：US07789284B2

公开(公告)日：2010-09-07

申请号：US12432930

申请日：2009-04-30

申请人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

发明人： Hiroshi Ebihara ,  Hiroshi Nasu ,  Katsuhiko Watanabe ,  Hiroyuki Kobayashi

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： B23K20/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75355 ,  H01L2224/75702 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00

摘要： There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic component through the component holder; and an ultrasonic transducer which applies ultrasonic vibration to the held electronic component through the component holder. The component holder includes a horn at one end of which is mounted the ultrasonic transducer and a holding tool which is fixed to the other end of the horn by using bolts and holds the electronic component. The horn has a surface A1 and a surface A2 at the other end and the holding tool has a surface B1 in intimate contact with the surface A1 and a surface B2 in intimate contact with the surface A2.

摘要翻译： 提供了一种电子部件安装装置，包括：保持电子部件的部件保持器; 按压单元，其通过部件保持器对所保持的电子部件施加压力; 以及超声波换能器，其通过部件保持器对保持的电子部件施加超声波振动。 部件保持器包括一个喇叭，其一端安装有超声波换能器，一个保持工具通过使用螺栓固定在喇叭的另一端并保持电子部件。 喇叭的另一端具有表面A1和表面A2，并且保持工具具有与表面A1紧密接触的表面B1和与表面A2紧密接触的表面B2。

公开(公告)号：US20050268457A1

公开(公告)日：2005-12-08

申请号：US11111935

申请日：2005-04-22

申请人： Hiroshi Ebihara ,  Ken Kobayashi ,  Hiroshi Nasu ,  Daido Komyoji

发明人： Hiroshi Ebihara ,  Ken Kobayashi ,  Hiroshi Nasu ,  Daido Komyoji

IPC分类号： H05K13/04 ,  B23P19/00 ,  H01L21/60 ,  H05K13/08

CPC分类号： H05K13/0413 ,  H01L24/75 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K13/0409 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53196 ,  H01L2924/00

摘要： The electronic component mounting apparatus has a board holding part for holding a circuit board, a mounting mechanism for mounting an electronic component on the circuit board, and a grinding part for grinding a suction surface of a suction nozzle of the mounting mechanism. After mounting of the electronic components on the circuit board are repeated a predetermined number of times, the suction surface is ground. In the electronic component mounting apparatus, by continuously moving the suction nozzle in the Y-direction relative to the grinding part and moving the suction nozzle up and down, and bringing the suction surface of the suction nozzle in intermittent contact with the grinding surface of the grinding member with ultrasonic vibrations applied, the suction surface can be ground while preventing the occurrence of a large deformation of the suction nozzle.

摘要翻译： 电子部件安装装置具有用于保持电路板的板保持部，用于将电子部件安装在电路基板上的安装机构和用于研磨安装机构的吸嘴的吸引面的研磨部。 将电子部件安装在电路板上重复预定次数之后，将吸入面研磨。 在电子部件安装装置中，通过使吸嘴相对于研磨部在Y方向上连续移动，并且使吸嘴上下移动，使吸嘴的吸引表面与 通过施加超声波振动的研磨部件，能够吸引吸入面，同时防止吸嘴发生大的变形。

公开(公告)号：US20100140326A1

公开(公告)日：2010-06-10

申请号：US12630943

申请日：2009-12-04

申请人： Hiroshi Ebihara ,  Katsuhiko Watanabe ,  Ryo Fujita

发明人： Hiroshi Ebihara ,  Katsuhiko Watanabe ,  Ryo Fujita

IPC分类号： B23K1/06 ,  B23K37/00 ,  B23K20/10

CPC分类号： B23K20/106 ,  B23K37/0408 ,  B23K37/0452 ,  B23K2101/42 ,  H01L24/75 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A bonding tool comprises: a horn which transmits an ultrasonic vibration; a ultrasonic transducer which is provided on one end of the horn, and produces the ultrasonic vibration; a heater disposition part, in which a heater is disposed, which is provided between the one end of the horn and the other end of the horn; a bonding action part which is provided between the one end of the horn and the other end of the horn, holds an electronic component, and is heated by the heater; a first cooling part, through which a fluid flows, which is provided between the heater disposition part and the one end of the horn; and a second cooling part, through which a fluid flows, which is provided between the heater disposition part and the other end of the horn.

摘要翻译： 接合工具包括：发送超声波振动的喇叭; 超声波换能器，其设置在喇叭的一端，产生超声波振动; 加热器布置部，其中设置有加热器，其设置在喇叭的一端和喇叭的另一端之间; 设置在喇叭的一端和喇叭的另一端之间的接合动作部，保持电子部件，并被加热器加热; 流体流过的第一冷却部分，其设置在加热器布置部分和喇叭的一端之间; 以及流体流过的第二冷却部件，其设置在加热器配置部分和喇叭的另一端之间。

公开(公告)号：US08028886B2

公开(公告)日：2011-10-04

申请号：US12630943

申请日：2009-12-04

申请人： Hiroshi Ebihara ,  Katsuhiko Watanabe ,  Ryo Fujita

发明人： Hiroshi Ebihara ,  Katsuhiko Watanabe ,  Ryo Fujita

IPC分类号： B23K1/06

CPC分类号： B23K20/106 ,  B23K37/0408 ,  B23K37/0452 ,  B23K2101/42 ,  H01L24/75 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A bonding tool comprises: a horn which transmits an ultrasonic vibration; a ultrasonic transducer which is provided on one end of the horn, and produces the ultrasonic vibration; a heater disposition part, in which a heater is disposed, which is provided between the one end of the horn and the other end of the horn; a bonding action part which is provided between the one end of the horn and the other end of the horn, holds an electronic component, and is heated by the heater; a first cooling part, through which a fluid flows, which is provided between the heater disposition part and the one end of the horn; and a second cooling part, through which a fluid flows, which is provided between the heater disposition part and the other end of the horn.

摘要翻译： 接合工具包括：发送超声波振动的喇叭; 超声波换能器，其设置在喇叭的一端，产生超声波振动; 加热器布置部，其中设置有加热器，其设置在喇叭的一端和喇叭的另一端之间; 设置在喇叭的一端和喇叭的另一端之间的接合动作部，保持电子部件，并被加热器加热; 流体流过的第一冷却部分，其设置在加热器布置部分和喇叭的一端之间; 以及流体流过的第二冷却部件，其设置在加热器配置部分和喇叭的另一端之间。

公开(公告)号：US08328066B2

公开(公告)日：2012-12-11

申请号：US12711744

申请日：2010-02-24

申请人： Ryo Fujita ,  Hiroshi Ebihara ,  Katsuhiko Watanabe

发明人： Ryo Fujita ,  Hiroshi Ebihara ,  Katsuhiko Watanabe

IPC分类号： B23K1/06

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/181 ,  Y10T29/53174 ,  H01L2924/00

摘要： A bonding tool, including: a component mounting unit including a horn that has a heater insertion hole, in which a heater is inserted with a predetermined clearance, and transmits ultrasonic vibration, an ultrasonic transducer that is fixed on the horn and produces the ultrasonic vibration, and an electronic component holder that is fixed on the horn, holds an electronic component and is heated by the heater; a leg that supports the horn on both sides of the horn at nodal points of the ultrasonic vibration on the horn; a supporter that holds the leg; and a heater holder that holds the heater on both sides of the horn, wherein the leg and the heater holder are formed integrally with each other.

摘要翻译： 一种接合工具，包括：部件安装单元，包括具有加热器插入孔的喇叭，加热器插入孔中，加热器以预定间隙插入，并且发送超声波振动;超声波换能器，固定在喇叭上并产生超声波振动 以及固定在喇叭上的电子部件保持器，保持电子部件并被加热器加热; 在喇叭的超声波振动的节点处支撑喇叭两侧的喇叭; 支持腿的人 以及在喇叭的两侧保持加热器的加热器保持器，其中腿部和加热器保持器彼此一体地形成。

公开(公告)号：USD534091S1

公开(公告)日：2006-12-26

申请号：US29227421

申请日：2005-04-12

申请人： Hiroshi Ebihara

设计人： Hiroshi Ebihara